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HCD-DZ7T
Ver. 1.1
Power consumption
Mexican models:
On: 180 W
Standby: 0.3 W (at the
Power Saving mode)
Latin American models:
On: 190 W
Standby: 0.3 W (at the
Power Saving mode)
Other models:
On: 180 W
Standby: 0.3 W (at the
Power Saving mode)
430 × 63× 380 mm (w/h/d)
Dimensions (approx.)
incl. projecting parts
Mass (approx.)
4.2 kg
Design and specifications are subject to change
without notice.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
Special Component Notice
The components identified by mark 9 contain confidential
information.
Strictly follow the instructions whenever the components are repaired
and/or replaced.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscou-s (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
2
Laser component in this product is capable of emitting radiation
exceeding the limit for Class 1.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 °C
during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
MODEL IDENTIFICATION
– Rear Panel –
SPEAKER
FRONT R
FRONT L
CENTER
SUR R
SUR L
SPEAKER
WOOFER
WOOFER
R
L
D-LIGHT SYNC OUT
Model
SP model
E32 model
MX model
TH model
•
Abbreviation
E32 : 110 – 240V AC area in E model
MX : Mexican model
SP
: Singapore model
TH
: Thai model
This appliance is classified as
a CLASS 1 LASER product.
This marking is located on
the rear exterior.
COAXIAL
AM
FM75
R
AUDIO IN
L
TV
VIDEO
DIGITAL IN
(DVD ONLY)
OUT
S VIDEO
(DVD ONLY)
(DVD ONLY)
Y
P
/C
P
/C
COAXIAL
OPTICAL
B
B
R
R
VIDEO IN
R
AUDIO IN
L
SAT/CABLE
COMPONENT VIDEO OUT
MONITOR OUT
SAT/CABLE
Parts No.
Part No.
3-197-464-5[]
3-197-464-6[]
3-197-464-7[]
3-215-699-5[]
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