Table of Contents
Advertisement
EzPro735
EzPro735
Note 6 : Thermal Performance
The DMD is designed to conduct residual heat energy to the back of the package where it can
be removed by an appropriate heat sink. A device configured for a particular application can
be manufactured with a thermal stud designated for that application. The heat sink and
cooling system must be capable of maintaining the package within the specified operational
temperatures. The total heat load is largely driven by the incident light absorbed by the
active area although other significant contributions that should be considered include light
energy absorbed by the window aperture and electrical input power. The portion of incident
light absorbed by the active area is determined from the active area absorption coefficient.
The absorption by the window aperture is the light neither spectrally nor diffusely reflected
according to the window aperture reflectivity parameters. Optical systems should be de
signed so that no significant light energy falls outside the window clear aperture as any
significant additional thermal load on the case top can damage the device.
P
ARAMETER
B
a e
m
h c
e i
r f
y a
a
p
r e
e p
d n
c i
l u
r a
C
h
e i
r f
y a
l c
c o
i k
a
i t c
e v
r a
a e
c
n e
e t
S
M
6 - 6
ERVICE
ANUAL
Table 2. Standard DMD Illumination Conditions
I
C
NPUT
ONDITION
g n
e l
o
f f
6
o
0 2
g n
f
o r
m
61
5 4
o
l r
n i
s e
O
C
UTPUT
ONDITION
6
o
o
. 0
5 2
0
. 0
5 2
o
N
OTES
R
l e
i t a
e v
o t
s
s y
o
n i
r e t
a f
e c
p
a l
e n
P
r e
e p
d n
c i
l u
r a
m
r i
o r
t r
t l i
x a
e t
m
o t
s i
Advertisement
Table of Contents
