Detailed Engineering Specifications; System Board Connector Maximum Allowable Dimensions; System Level Environmental And Operating Conditions - Dell OptiPlex 740 Specifications

DetAileD eNGiNeeRiNG speCiFiCAtiONs

sysTem DimensiOns (physical)
nOTe: System Weight* and Shipping Weight* is based on a typical configuration and may vary based on PC configuration. A
typical configuration includes: integrated graphics, one hard drive, one optical drive, and one diskette drive.
chassis volume liters
chassis weight* pounds/kilograms
1
chassis Dimensions: (hxwxD)
Height inches/centimeters
Width inches/centimeters
Depth inches/centimeters
shipping weight* pounds/kilograms includes packaging
1
materials
packaging parameters (hxwxD)
Height inches/centimeters
Width inches/centimeters
Depth inches/centimeters
Weights are approximates and may change based on system configuration and included accessories.
1
2 Dimensions are DAO specific. Each region has unique packing.

sYsteM BOARD CONNeCtOR MAxiMuM AllOWABle DiMeNsiONs

pci slots
Height (inches/centimeters)
Length (inches/centimeters)
pcie x16 slots
Height (inches/centimeters)
Length (inches/centimeters)
pcie x1 slots
Height (inches/centimeters)
Length (inches/centimeters)
risers: (replaces 1 pci slot and 1 pcie slot on DT system board)
combo full height riser with 1 pci and 1 pcie connector
(hxl)
Height (inches/centimeters)
Length (inches/centimeters)*,**
Dual Full Height Riser with 2 PCI connectors (HxL)
Height (inches/centimeters)
Length (inches/centimeters)*,**
* Card length can be longer than standard Half-Length Card but cannot be a Full-Length Card.
6.9/17.53 in/cm is longer than the standard Half-Length Card
**

sYsteM leVel eNViRONMeNtAl AND OpeRAtiNG CONDitiONs

Temperature
Operating
Non-Operating (Storage)
relative humidity
maximum vibration
Operating
Non-Operating
maximum shock
Operating
13
2
mT DT
33 16
25.8/11.70 18.2/8.26
16.3 / 41.4 4.5 / 11.4
7.3 / 18.5 15.7 / 39.9
17.3 / 43.9 13.9 / 35.3
43.5/19.73 28/12.7
22.38/56.85 20.63/52.4
22.25/56.52 20.31/51.59
14.25/36.2 11.75/29.85
mT DT
2 2
4.376 / 11.115 2.731 / 6.89
7.4 / 18.796* 6.6 / 16.764
1 1
4.376 / 11.115 2.731 / 6.89
7.4 / 18.796* 6.6 / 16.764
1
4.376/11.115
7.4 / 18.796*
1
4.376/11.115
6.6/16.764
1
4.376/11.115
6.6/16.764
mT DT
10° to 35° C (50° to 95° F)
-40° to 65° C (-40° to -149° F)
20% to 80% (non-condensing)
0.25 G at 3 to 200 Hz at 0.5 octave/min
0.5 G at 3 to 200 Hz at 1 octave/min
Bottom half-sine pulse with a change in velocity of 50.8
cm/sec (20 inches/sec)
sff
10.7
15/6.80
3.65 / 9.26
12.4 / 31.4
13.4 / 34
21.3/9.66
20.88/50.04
19.38/49.23
10.63/27
sff
1
1
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