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Description #3
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Compute enclosure front components (See Figure 1)
2. Compute Enclosure Rear Components (See Figure 2)
3. Remove power supplies
Press the release button
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Pull down the handle
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Remove the power supply (quantity 12) (SEE Figure 3)
4. Removing DVD Module
Remove USB cables from DVD to OA
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Remove the DVD module bezel
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Press the button on the front of the DVD module to release handle
Pull the handle and slide the DVD module out enclosure (SEE Figure 4)
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5. Remove the Server Blades(s)
CAUTION: After you press the release buttons, the server blade is unlocked from the enclosure. Use both hands to support the server
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blade when you remove it from the enclosure. The Server Blade weighs approximately 15.4 kg (34 lb) (SEE Figure 5)
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Lay Server Blade on flat surface
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Remove the access panel by lifting it straight up and off the server Blade (SEE Figure 6)
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Locate the two processors
o Disconnect power cord from CPU assembly
o For CPU0 removal, remove the air baffle
o Rotate the processor locking handle up and back until it reaches a hard stop
o Pull the processor and heatsink off of the socket (SEE Figure 7)
o Remove the DIMMs, maximum quantity 32 (SEE Figure 8)
o Remove the two batteries (SEE Figure 9)
6. Remove the active cool fans, quantity 15
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Turn the handle counterclockwise
Remove the fan
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7. Remove the interconnect switch (maximum quantity 8)
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Disconnect all cables from component
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Press the release tab
Open the handle
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Remove the interconnect switch (See figure 2 for location)
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8. Remove Onboard Administrator modules (quantity 2) and Onboard Administrator tray
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Disconnect all cables
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Press the release tab and open handle and remove onboard administrator; quantity 2 (See Figure 2 for location)
On the Onboard Administrator Modules that were removed, depress the button in the center and remove the top panel.
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o Remove the PCB and look for the Yellow battery. This battery can be removed from its corresponding IC by using your fingers.
(See Figure 10)
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Press the release handle on the onboard administrator tray and open handle. Note: This is the assembly that the onboard
administrator installs into (See Figure 11)
9. Remove the GPSMs
Disconnect all cables
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Press the button on the front of the GPSM to release handle
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Pull the handle and slide the GPSM out of the enclosure
10. Remove the XFM; quantity of 4
Disconnect all X-Bar Flex-connect cables
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Press buttons on the front of the XFM to release the handles
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Pull the handles and slide the XFM out of the enclosure
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11. Remove the ac input modules
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Completely unscrew the three thumbscrews that secure the ac input module. The screws remain captive after they are unscrewed
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Remove the ac input modules (See Figure 2 for location; See Figure 12 for component removal)
12. Remove the I/O Chassis (Enclosure tear down)
Unscrew the ten thumbscrews and open the hinges completely
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Use the handles to extend the I/O chassis until the release levers engage on both sides of the I/O Chassis
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Grasp the handholds below the release levers
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Disengage the release levers on both sides of the rear chassis
o CAUTION: When removing and lifting the I/O chassis, always grasp the handholds as far forward as possible. The frontend
of the I/O chassis is heavy and the handholds provide a more balanced location to distribute the weight
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Use the handholds to extend and remove the I/O Chassis from the enclosure (See figure 13)
13. Remove the midplane brick assembly
WARNING: At least two people are required to safely move the midplane to avoid personal injury
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Pull the plunger pins in each corner and rotate ¼ turn to lock them in position
Use the handles to extend and remove the midplane assembly from the enclosure (See figure 14)
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Place midplane brick flat on table to allow disassembly
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14. Disassemble midplane brick
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Remove status panel PCA (See Figure 15)
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