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SanDisk SSD UATA 5000 1.8” Thermal Analysis

Flash disk module
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Computerized
Analysis & Simulation Ltd.
Thermal Analysis
SSD UATA 5000 1.8"
with ZIF connector
"Flash Disk Module"
For:
SanDisk
October 2006
(Ref: w06e048b.doc)

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Summary of Contents for SanDisk SSD UATA 5000 1.8”

  • Page 1 Computerized Analysis & Simulation Ltd. Thermal Analysis SSD UATA 5000 1.8” with ZIF connector "Flash Disk Module" For: SanDisk October 2006 (Ref: w06e048b.doc)

  • Page 2: Table Of Contents

    Computerized Analysis & Simulation Ltd. Table of contents ABSTRACT SCOPE..........................4 APPLICABLE DOCUMENTS ..................4 THE FLASH DISK DESCRIPTION ................. 4 ......................4 LASH ISK DESCRIPTION BOUNDARY CONDITION AND ASSUMPTIONS............10 ........................10 OUNDARY CONDITION ............................10 ATERIALS THE THERMAL MODEL....................11 .....................

  • Page 3: Abstract

    Computerized Analysis & Simulation Ltd. Abstract The document summarizes thermal analysis for the mSSD UATA 5000 1.8” CG with ZIF connector - "Flash Disk Module" The main aim is to check whether the current design meets thermal design requirements. The analysis results are temperatures distribution figures and components case and junction temperatures.

  • Page 4: Scope

    Computerized Analysis & Simulation Ltd. Scope The document summarized thermal analysis for the "Flash Disc module", based on the customer design data. It includes the base design data, description of the thermal model, the solution process and graphical and numerical representation of the results (temperature distribution and components case and junction temperatures).
  • Page 5 Computerized Analysis & Simulation Ltd. Table 3.1-1: Power dissipations Component Designation Total Quantity Power Name Number Power Flash U5-U12, U105-U112 0.04 0.64 0.162 0.162 TI-transceiver U1-U4, U101-U104 0.0025 0.02 DC-DC 0.006 0.010 Oscillator 0.018 0.018 TOTAL 0.850 Notes: a. Flash, transceiver and E3 are working in 100% duty-cycle in high performance Figure 3.1-1: The general mechanical description –...
  • Page 6 Computerized Analysis & Simulation Ltd. Figure 3.1-2: The general mechanical description – Bottom side Figure 3.1-3: The Memory card (PS) from bottom side Ref: w06e048d.doc Page 6 of 23 CAS Ltd. - P.O.B. 7651, Haifa 31076 - ISRAEL Tel: 972 4 8580024 Fax: 972 4 8580025 E-mail: cas@cas.co.il Web: www.cas.co.il...
  • Page 7 Computerized Analysis & Simulation Ltd. Figure 3.1-4: The CPU card ( CS) from bottom side Figure 3.1-5: The CPU card pad from top side Ref: w06e048d.doc Page 7 of 23 CAS Ltd. - P.O.B. 7651, Haifa 31076 - ISRAEL Tel: 972 4 8580024 Fax: 972 4 8580025 E-mail: cas@cas.co.il Web: www.cas.co.il...
  • Page 8 Computerized Analysis & Simulation Ltd. Figure 3.1-6: The CPU card (PS) from top side Figure 3.1-7: The memory card CS and PS placement Ref: w06e048d.doc Page 8 of 23 CAS Ltd. - P.O.B. 7651, Haifa 31076 - ISRAEL Tel: 972 4 8580024 Fax: 972 4 8580025 E-mail: cas@cas.co.il Web: www.cas.co.il...
  • Page 9 Computerized Analysis & Simulation Ltd. Figure 3.1-8: The CPU card CS and PS placement Ref: w06e048d.doc Page 9 of 23 CAS Ltd. - P.O.B. 7651, Haifa 31076 - ISRAEL Tel: 972 4 8580024 Fax: 972 4 8580025 E-mail: cas@cas.co.il Web: www.cas.co.il...

  • Page 10: Boundary Condition And Assumptions

    Computerized Analysis & Simulation Ltd. Boundary Condition and Assumptions 4.1 Boundary condition Boundary conditions: • Temperature : Tw=70 (measured on the top-cover, at the center.) • Altitude : 3048m 4.2 Materials • body - Plastic: K=0.29 W/m C • Covers - stainless-steel K=37 W/m C •...

  • Page 11: The Thermal Model

    Computerized Analysis & Simulation Ltd. The Thermal Model 5.1 CFD and Finite Volume Model The models were solved with Coolit a CFD (Computational Fluid Dynamics) finite volume, object oriented software. CFD software is a general technique for modeling and solving the fluid flow and heat transfer;...

  • Page 12: The Thermal Model Structure

    Computerized Analysis & Simulation Ltd. 5.2 The Thermal Model Structure Figure 5.2-1: The thermal model - general isometric view – from top Figure 5.2-2: The CPU card PS side and the Mylar layer – view from top side Ref: w06e048d.doc Page 12 of 23 CAS Ltd.
  • Page 13 Computerized Analysis & Simulation Ltd. Figure 5.2-3: The CPU card PS side – view from top side Figure 5.2-4: The Memory card CS and the plastic frame – view from top side (CPU card hidden) Ref: w06e048d.doc Page 13 of 23 CAS Ltd.
  • Page 14 Computerized Analysis & Simulation Ltd. Figure 5.2-5: The Memory card CS– view from top side (CPU card and plastic frame are hidden) Figure 5.2-6: The thermal model - general isometric view – from bottom Ref: w06e048d.doc Page 14 of 23 CAS Ltd.
  • Page 15 Computerized Analysis & Simulation Ltd. Figure 5.2-7: The Memory card PS and the thermal Pad – view from bottom side Figure 5.2-8: The Memory card PS – view from bottom side Ref: w06e048d.doc Page 15 of 23 CAS Ltd. - P.O.B. 7651, Haifa 31076 - ISRAEL Tel: 972 4 8580024 Fax: 972 4 8580025 E-mail: cas@cas.co.il Web: www.cas.co.il...
  • Page 16 Computerized Analysis & Simulation Ltd. Figure 5.2-9: The CPU card CS and thermal Pad – view from bottom side Figure 5.2-10: The CPU card CS and the plastic frame – view from bottom side Ref: w06e048d.doc Page 16 of 23 CAS Ltd.

  • Page 17: Analysis Results

    Computerized Analysis & Simulation Ltd. Analysis Results The analysis results are shown in this paragraph. Each figure shows the temperature distribution in C, the legends shows the different temperatures . Figure 6.1-1: Temperature distribution – isometric view – Top side Ref: w06e048d.doc Page 17 of 23 CAS Ltd.
  • Page 18 Computerized Analysis & Simulation Ltd. Figure 6.1-2: Temperature distribution – isometric view – bottom side Ref: w06e048d.doc Page 18 of 23 CAS Ltd. - P.O.B. 7651, Haifa 31076 - ISRAEL Tel: 972 4 8580024 Fax: 972 4 8580025 E-mail: cas@cas.co.il Web: www.cas.co.il...
  • Page 19 Computerized Analysis & Simulation Ltd. Figure 6.1-3: Temperature distribution – isometric view – Memory card CS Ref: w06e048d.doc Page 19 of 23 CAS Ltd. - P.O.B. 7651, Haifa 31076 - ISRAEL Tel: 972 4 8580024 Fax: 972 4 8580025 E-mail: cas@cas.co.il Web: www.cas.co.il...
  • Page 20 Computerized Analysis & Simulation Ltd. Figure 6.1-4: Temperature distribution – isometric view – Memory card PS Ref: w06e048d.doc Page 20 of 23 CAS Ltd. - P.O.B. 7651, Haifa 31076 - ISRAEL Tel: 972 4 8580024 Fax: 972 4 8580025 E-mail: cas@cas.co.il Web: www.cas.co.il...
  • Page 21 Computerized Analysis & Simulation Ltd. Figure 6.1-5: Temperature distribution – isometric view - CPU card CS Ref: w06e048d.doc Page 21 of 23 CAS Ltd. - P.O.B. 7651, Haifa 31076 - ISRAEL Tel: 972 4 8580024 Fax: 972 4 8580025 E-mail: cas@cas.co.il Web: www.cas.co.il...
  • Page 22 Computerized Analysis & Simulation Ltd. Figure 6.1-6: Temperature distribution – Side cross section Ref: w06e048d.doc Page 22 of 23 CAS Ltd. - P.O.B. 7651, Haifa 31076 - ISRAEL Tel: 972 4 8580024 Fax: 972 4 8580025 E-mail: cas@cas.co.il Web: www.cas.co.il...

  • Page 23: Conclusions

    Computerized Analysis & Simulation Ltd. Table 6.1-1: Power and Temperature dissipation Thermal Tj/Ta Component Designation Case Junction resistance Power allowable Name Number temperature temperature θ θ θ θ [C/W] U5-U12, 1 Flash 0.04 Tj=125 U105-U112 2 E3 0.162 18.2 Tj=125 U1-U4, 3 TI-transceiver 0.0025...

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