Hardware Components - HP 279720-B21 - ProLiant BL p-Class F-GbE Interconnect Overview

Hardware components

The HP BladeSystem p-Class solution consists of the following:
Server blades
Server blade enclosures
Network interconnects
Power subsystem
Table 5. HP BladeSystem Required Components
Required Function
Components
Server blade Server blades contain one or more processors, memory, internal and external
storage options, and integrated management. For FC connectivity, server blades
must also be configured with FC card or FC HBA options. ProLiant BL30p and
ProLiant BL35p Server Blades require a p-Class sleeve for mounting in the
enhanced server blade enclosure.
Server blade HP BladeSystem p-Class enclosures hold server blades and network interconnect
enclosure options. Combinations of different server blades are supported in the same blade
enclosure.
Each enclosure supports a pair of interconnects for network cable management.
The enhanced server blade enclosure also provides a single Ethernet port for
connecting to the iLO interface of every installed server blade.
Some server blade models are supported only in the enhanced server blade
enclosure. Refer to the enclosure compatibility matrix on the HP website,
http://h18004.www1.hp.com/products/blades/components/Compatibility-
Matrix.html
Network HP BladeSystem p-Class interconnects pass the network adapter (NIC) signals from
interconnects the server blades to external networks. Several options are available:
Both patch panel and interconnect switches are available with or without FC pass-
through capability.
Power enclosure The HP BladeSystem p-Class system offers two power enclosure options:
with power
supplies
(Not needed if
using facility
-48 VDC ±10%)
Power distribution Power is carried from the 3U power enclosure(s) to the server blade enclosure(s)
(used only with 3U through bus.
power enclosures)
Bus bars are available in mini and scalable versions depending on the number of
server blade enclosures being deployed.
Note: Power requirements for an HP BladeSystem p-Class solution: 200 V to 240 VAC, 30 A or facility DC –48V ±10%
Patch Panel interconnects route each NIC signal individually from the server
blades to the customer network.
Interconnect switches consolidate the server blade NIC connections to just a
few uplinks, reducing the number of cables needed to connect the solution to
your network.
The 1U power enclosure provides redundant power for a single server blade
enclosure. It is ideal for remote offices, small businesses, or environments that
do not have three-phase power available.
The 3U power enclosure and power distribution components provide
redundant power for multiple server blade enclosures. This solution is ideal
for datacenter rack deployment. The 3U power enclosures are available in
single-phase and three-phase models.
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