Intel BOXDX58OG Specification page 7

5 Regulatory Compliance and Battery Disposal Information
5.1 Regulatory Compliance..................................................................... 77
5.1.1 Safety Standards.................................................................. 77
5.1.2 European Union Declaration of Conformity Statement ................ 78
5.1.3 Product Ecology Statements................................................... 79
5.1.4 EMC Regulations .................................................................. 81
5.1.5 ENERGY STAR* 5.0, e-Standby, and ErP Compliance ................. 84
5.1.6 Regulatory Compliance Marks (Board Level) ............................. 85
5.2 Battery Disposal Information............................................................. 86
Figures
1. Major Board Components.................................................................. 11
2. Block Diagram ................................................................................ 13
3. Memory Channel and DIMM Configuration ........................................... 17
4. Back Panel Audio Connectors ............................................................ 22
5. LAN Connector LED Locations ............................................................ 24
6. Thermal Sensors and Fan Headers ..................................................... 26
7. Locations of Onboard LED Indicators .................................................. 35
8. Location of the Power and Reset Buttons ............................................ 36
9. Detailed System Memory Address Map ............................................... 38
10. Back Panel Connectors ..................................................................... 40
11. Component-side Connectors and Headers ........................................... 41
12. Connection Diagram for Front Panel Header ........................................ 48
13. Connection Diagram for Front Panel USB Headers ................................ 50
14. Location of the Jumper Block............................................................. 51
15. Board Dimensions ........................................................................... 53
16. Localized High Temperature Zones..................................................... 56
Contents
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