Hp Bladesystem Power Sizer; Conclusion - HP Xw460c - ProLiant - Blade Workstation Overview

HP BladeSystem Power Sizer

The HP BladeSystem Power Sizer is a tool that assists facilities teams and IT staff in sizing their power
and cooling infrastructures to meet the needs of an HP BladeSystem solution. The BladeSystem Power
Sizer is based on actual component-level power measurements of a system stressed to maximum
capability. It allows a customer to select the type and number of components within each server blade
and enclosure and to see the effect of changes on power consumption and heat loading.
Values obtained from the BladeSystem Power Sizer tool are based on heavy enterprise application
loads and are intended as guidelines only. Actual measured power consumption may be significantly
lower or higher than the numbers provided by the Power Sizer. Power consumption will vary with
application type, application utilization, and ambient temperature. The BladeSystem Power Sizer is
available at this website: .
http://www.hp.com/go/bladesystem/powercalculator

Conclusion

The HP BladeSystem c7000 Enclosure is the foundation of a modular computing architecture that
consolidates and simplifies infrastructure, reduces operational cost, and delivers IT services more
effectively. Thermal Logic technologies provide the mechanical design features, built-in monitoring,
and control capabilities that enable IT administrators to optimize their power and thermal
environments. The shared, high-speed, NonStop midplane and pooled-power backplane in the
enclosure accommodate new bandwidths and new technologies. The BladeSystem Onboard
Administrator supplies the infrastructure to provide essential power and cooling information and help
to automate infrastructure management. The HP BladeSystem c7000 Enclosure provides all the power,
cooling, and I/O infrastructure to support c-Class modular servers, interconnects, and storage
components, today and for the next several years.
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