Contents
1 Product Description
1.1
Overview ...................................................................................................................... 10
1.1.1
Feature Summary.......................................................................................... 10
1.1.2
Manufacturing Options .................................................................................. 11
1.1.3
Board Layout ................................................................................................. 12
1.1.4
Block Diagram ............................................................................................... 14
1.2
Online Support ............................................................................................................. 15
1.3
Processor ..................................................................................................................... 15
1.4
System Memory ........................................................................................................... 16
1.4.1
Memory Configurations ................................................................................. 17
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1.5
945P Chipset...................................................................................................... 21
1.5.1
USB ............................................................................................................... 21
1.5.2
IDE Support ................................................................................................... 22
1.5.3
1.6
PCI Express Connectors.............................................................................................. 24
1.7
1.8
Legacy I/O Controller ................................................................................................... 25
1.8.1
Serial Port...................................................................................................... 25
1.8.2
Parallel Port ................................................................................................... 25
1.8.3
1.8.4
1.9
Audio Subsystem ......................................................................................................... 26
1.9.1
1.9.2
Audio Connectors .......................................................................................... 26
1.9.3
1.10 LAN Subsystem ........................................................................................................... 28
1.10.1
1.10.2
1.10.3
Gigabit LAN Subsystem ................................................................................ 30
1.11.1
1.11.2
1.11.3
Fan Monitoring............................................................................................... 31
1.11.4
Thermal Monitoring........................................................................................ 32
1.12 Power Management ..................................................................................................... 33
1.12.1
ACPI .............................................................................................................. 33
1.12.2
Hardware Support ......................................................................................... 35
2.1
Introduction .................................................................................................................. 39
2.2
Memory Resources ...................................................................................................... 39
2.2.1
Addressable Memory..................................................................................... 39
2.2.2
Memory Map.................................................................................................. 41
2.3
DMA Channels ............................................................................................................. 41
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