Thermal Considerations; Processor Heatsink For Omni-Directional Airflow - Intel BLKD945PSNLK Technical Product Specification

Intel Desktop Board D945PSN Technical Product Specification

2.12 Thermal Considerations

CAUTION
A chassis with a maximum internal ambient temperature of 38
requirement. Use a processor heatsink that provides omni-directional airflow (similar to the type
shown in Figure 24) to maintain required airflow across the processor voltage regulator area.
Figure 24. Processor Heatsink for Omni-directional Airflow
CAUTION
Failure to ensure appropriate airflow may result in reduced performance of both the processor
and/or voltage regulator or, in some instances, damage to the board. For a list of chassis that have
been tested with Intel desktop boards please refer to the following website:
http://developer.intel.com/design/motherbd/cooling.htm
All responsibility for determining the adequacy of any thermal or system design remains solely with
the reader. Intel makes no warranties or representations that merely following the instructions
presented in this document will result in a system with adequate thermal performance.
CAUTION
Ensure that the ambient temperature does not exceed the board's maximum operating temperature.
Failure to do so could cause components to exceed their maximum case temperature and
malfunction. For information about the maximum operating temperature, see the environmental
specifications in Section 2.14.
62
o
C at the processor fan inlet is a
OM16996