Table Of Contents - Intel BLKD945GCPE - LGA775 1066FSB 2DDR2 2GB Audio Video Lan mATX 10Pack Motherboard Technical Product Specification

Product specification
Table of Contents

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Contents
1 Product Description
1.1 Overview........................................................................................ 10
1.1.1
Feature Summary ................................................................ 10
1.1.2
Board Layout ....................................................................... 12
1.1.3
Block Diagram ..................................................................... 14
1.2 Online Support................................................................................ 15
1.3 Processor ....................................................................................... 15
1.4 System Memory .............................................................................. 16
1.4.1
Memory Configurations ......................................................... 17
®
945GC Chipset ...................................................................... 17
1.5.1
Intel 945GC Graphics Subsystem............................................ 17
1.5.2
USB ................................................................................... 19
1.5.3
IDE Support ........................................................................ 19
1.5.4
Real-Time Clock, CMOS SRAM, and Battery .............................. 21
1.6 Legacy I/O Controller ....................................................................... 21
1.6.1
Diskette Drive Controller ....................................................... 21
1.6.2
Keyboard and Mouse Interface ............................................... 21
1.7 Audio Subsystem............................................................................. 22
1.7.1
Audio Subsystem Software .................................................... 22
1.7.2
Audio Connectors ................................................................. 22
1.7.3
Four Channel Audio Subsystem .............................................. 22
1.8 LAN Subsystem ............................................................................... 23
1.8.1
LAN Subsystem Software....................................................... 23
1.8.2
1.9 Hardware Management Subsystem .................................................... 25
1.9.1
Hardware Monitoring and Fan Control...................................... 25
1.9.2
Chassis Intrusion and Detection.............................................. 25
1.9.3
Fan Monitoring ..................................................................... 25
1.9.4
Thermal Monitoring .............................................................. 26
1.10 Power Management ......................................................................... 27
1.10.1 ACPI .................................................................................. 27
1.10.2 Hardware Support ................................................................ 29
2.1 Memory Resources .......................................................................... 34
2.1.1
Addressable Memory............................................................. 34
2.2 Connectors and Headers................................................................... 36
2.2.1
Back Panel Connectors .......................................................... 37
2.2.2
Component-side Connectors and Headers ................................ 38
2.3 Jumper Block .................................................................................. 46
2.4 Mechanical Considerations ................................................................ 48
2.4.1
Form Factor......................................................................... 48
2.5 Electrical Considerations ................................................................... 49
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