Figure 14. Localized High Temperature Zones; Table 23. Thermal Considerations For Components - Intel BLKD945GCLF - MB 533FSB DDR2 667 533 Aud+Vdo+Lan mATX Technical Product Specification

Figure 14 shows the locations of the localized high temperature zones.

Figure 14. Localized High Temperature Zones

Table 23 provides maximum case temperatures for the board components that are
sensitive to thermal changes. The operating temperature, current load, or operating
frequency could affect case temperatures. Maximum case temperatures are important
when considering proper airflow to cool the board.

Table 23. Thermal Considerations for Components

Component
Processor
Intel 82945GC GMCH
Intel 82801GB ICH7
For information about
Processor datasheets and specification updates
Item Description
A Processor voltage regulator area
B Processor
C Intel 82945GC GMCH
D Intel 82801GB ICH7
Maximum Case Temperature
For processor case temperature, see processor datasheets and
processor specification updates
o
97 C (under bias)
o
92 C (under bias)
Technical Reference
Refer to
Section 1.2, page 15
53