Reliability; Thermal Considerations For Components - Intel BLKD915PGNL - LGA775 800FSB 4DDR Audio Lan SATA ATX 4PCI Technical Product Specification

Table 40 provides maximum case temperatures for the components that are sensitive to thermal
changes. The operating temperature, current load, or operating frequency could affect case
temperatures. Maximum case temperatures are important when considering proper airflow to cool
the board.
Table 40.

Thermal Considerations for Components

Component
Intel Pentium 4 processor
Intel 82915P MCH
Intel 82801FB ICH6
For information about
Intel Pentium 4 processor datasheets and specification updates

2.13 Reliability

The Mean Time Between Failures (MTBF) prediction is calculated using component and
subassembly random failure rates. The calculation is based on the Bellcore Reliability Prediction
Procedure, TR-NWT-000332, Issue 4, September 1991. The MTBF prediction is used to estimate
repair rates and spare parts requirements.
The MTBF data is calculated from predicted data at 55 ºC. The MTBF for the D915PGN and
D915PSY boards is 102,038 hours.
Maximum Case Temperature
For processor case temperature, see processor datasheets and
processor specification updates
o
99 C (under bias)
o
110 C (under bias)
Technical Reference
Refer to
Section 1.4, page 19
85