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LEA-6 / NEO-6
u-blox 6 GPS Modules
Hardware Integration Manual
Abstract
This document describes the features and specifications of the cost
effective and high-performance LEA-6 and NEO-6 GPS modules
featuring the u-blox 6 positioning engine.
These compact, easy to integrate stand-alone GPS receiver modules
combine exceptional GPS performance with highly flexible power,
design, and connectivity options. Their compact form factors and
SMT pads allow fully automated assembly with standard pick &
place and reflow soldering equipment for cost-efficient, high-
volume production enabling short time-to-market.
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Table of Contents
Related Manuals for u-blox NEO-6Q
Summarization of Contents
Preface
u-blox Technical Documentation
Lists additional manuals and technical resources for u-blox products.
How to Use This Manual
Provides guidance on navigating the document's modular structure and understanding symbols.
Technical Support
Worldwide Web Support
Information on accessing product data, technical documents, and FAQs via the u-blox website.
Email Support
How to contact technical support offices via email for assistance.
Information for Technical Support
Details needed when contacting support, including receiver type and problem description.
1 Hardware Description
1.1 Overview
Introduces the LEA-6 and NEO-6 modules as standalone GPS receivers.
1.2 Architecture
Describes the two main functional parts: RF and Baseband sections of the modules.
1.3 Power Management
Details the three power supply pins (VCC, V_BCKP, VDDUSB) and their functions.
1.4 Antenna Supply - V_ANT (LEA-6)
Explains the V_ANT pin for active antenna supply and supervision on LEA-6.
1.5 System Functions
Covers system functions like EXTINT pin and system monitoring.
1.6 Interfaces
Discusses serial communication interfaces: UART, USB, DDC, and SPI.
1.7 I/O Pins
Describes various input/output pins like RESET_N, EXTINTO, and configuration pins.
2 Design-in
2.1 Design-in Checklist
A checklist covering power supply, layout, and design considerations for optimal performance.
2.1.1 Layout Design-in Checklist
Key items for checking PCB layout to ensure optimal performance and avoid redesigns.
2.1.2 Design Considerations
Essential functions and pins to consider for a minimal u-blox 6 GPS module design.
2.2 LEA-6 Design
Specific design aspects for LEA-6 modules, including passive antenna setup.
2.2.1 LEA-6 Passive Antenna Design
Minimal setup for a PVT GPS receiver using a LEA-6 module with a passive antenna.
2.2.2 Pin Description for Antenna Designs (LEA-6)
Detailed pin descriptions for antenna designs specifically for LEA-6 modules.
2.3 NEO-6 Design
Specific design aspects for NEO-6 modules, including passive antenna setup.
2.3.1 Passive Antenna Design (NEO-6)
Minimal setup for a PVT GPS receiver using a NEO-6 module with a passive antenna.
2.4 Layout
Information on PCB layout for reliable and sensitive GPS system design.
2.4.1 Footprint and Paste Mask
Recommendations for module footprint and paste mask geometry.
2.4.2 Placement
Guidance on optimal receiver placement on the PCB for maximum performance.
2.4.3 Antenna Connection and Grounding Plane Design
Design considerations for connecting antennas and creating grounding planes.
2.4.4 Antenna Micro Strip
Details on calculating and designing antenna micro strips for 50 Ohm impedance.
2.5 Antenna and Antenna Supervisor
Discusses antenna types, gain limits, and the active antenna supervisor circuit.
2.5.1 Passive Antenna
Design considerations for passive antennas, including layout and noise reduction.
2.5.2 Active Antenna (LEA-6)
Integration of active antennas with LEA-6, including biasing and placement.
2.5.3 Active Antenna (NEO-6)
Integration of active antennas with NEO-6, including inductor use for biasing.
2.5.4 Active Antenna Bias Power (LEA-6)
Methods for supplying bias voltage to active antennas on LEA-6.
2.5.5 Active Antenna Supervisor (LEA-6)
Implementation of an active antenna supervisor circuit for fault detection.
3 Product Handling
3.1 Packaging, Shipping, Storage and Moisture Preconditioning
Information on module packaging, shipping, storage, and moisture sensitivity.
3.2 Soldering
Comprehensive guide to soldering processes including paste, reflow, and inspection.
3.2.1 Soldering Paste
Recommendations for "No Clean" soldering paste and stencil thickness.
3.2.2 Reflow Soldering
Guidelines for convection reflow soldering, including temperature profiles.
3.2.3 Optical Inspection
Steps for visually inspecting solder joints and module alignment after soldering.
3.2.4 Cleaning
Discourages cleaning modules and provides reasons why.
3.2.5 Repeated Reflow Soldering
Discourages repeated reflow soldering and upside-down module soldering.
3.2.6 Wave Soldering
Mentions wave soldering for THT components and single process for SMT modules.
3.2.7 Hand Soldering
Guidelines for performing hand soldering on the module.
3.2.8 Rework
Procedures for unsoldering and replacing modules, with warnings.
3.2.9 Conformal Coating
Advises on applying conformal coating and its warranty implications.
3.2.10 Casting
Guidance on casting processes and their warranty impact.
3.2.11 Grounding Metal Covers
Discusses soldering ground strips to EMI covers at customer's risk.
3.2.12 Use of Ultrasonic Processes
Warns against using ultrasonic processes due to potential module damage.
3.3 EOS/ESD/EMI Precautions
Essential guidelines for handling and protecting against Electrostatic Discharge, Overstress, and Interference.
3.3.1 Abbreviations
Refers to Appendix A for a list of abbreviations used.
3.3.2 Electrostatic Discharge (ESD)
Defines Electrostatic Discharge (ESD) as a sudden electric current causing damage.
3.3.3 ESD Handling Precautions
Principles for establishing Electrostatic Protective Areas (EPAs) and handling precautions.
3.3.4 ESD Protection Measures
Specific ESD protection measures for passive and active antennas.
3.3.5 Electrical Overstress (EOS)
Defines Electrical Overstress (EOS) as exceeding maximum input power ratings.
3.3.6 EOS Protection Measures
Recommended EOS protection measures for mixed wireless transceiver designs.
3.3.7 Electromagnetic Interference (EMI)
Explains EMI and recommends grounding, shielding, and filtering measures.
3.3.8 GSM Applications
Addresses challenges with GSM applications, including antenna isolation and jamming.
3.3.9 Recommended Parts
Lists recommended components for ESD/EOS protection and filtering.
4 Product Testing
4.1 u-blox In-Series Production Test
Describes u-blox's automatic test equipment and measurements for ensuring product quality.
4.2 Test Parameters for OEM Manufacturer
Focus areas for OEM manufacturers regarding device sensitivity and host communication.
4.3 System Sensitivity Test
Methods for testing GPS device sensitivity using a 1-channel GPS simulator.
4.3.1 Guidelines for Sensitivity Tests
Step-by-step guide for performing sensitivity tests using a GPS simulator.
4.3.2 'Go/No Go' Tests for Integrated Devices
Simple tests for integrated devices, often involving outdoor signal acquisition.
Appendix
A Abbreviations
Provides a table explaining common abbreviations used in the document.
B Migration to u-blox 6 Receivers
Guidance on migrating from ANTARIS 4 and u-blox 5 designs to u-blox 6 receivers.
B.1 Checklist for Migration
A checklist to help select the optimal u-blox 6 module variant for specific application needs.
B.2 Software Migration
Details differences in software and protocol messages between older and u-blox 6 versions.
B.3 Hardware Migration
Discusses hardware considerations when migrating from ANTARIS 4 and u-blox 5.
B.4 Migration of LEA Modules
Compares pin assignments and voltage thresholds for LEA module migration.
B.5 Migration of NEO Modules
Compares pin assignments and configuration settings for NEO module migration.
C Interface Backgrounder
Explains the I²C compatible Display Data Channel (DDC) interface principles.
C.1 DDC Interface
Explains the I²C compatible Display Data Channel (DDC) interface principles.
C.1.1 Addresses, Roles and Modes
Describes device addressing, roles (master/slave), and modes within the DDC bus.
C.1.2 DDC Troubleshooting
Common questions and considerations for troubleshooting DDC interface implementations.
C.2 SPI Interface
Provides an overview of the Serial Peripheral Interface (SPI) communication protocol.
C.2.1 SPI Basics
Explains the fundamental principles of SPI communication in master/slave modes.
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