LG 32GS60QC-B Dismantling Manual
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LG 32GS60QC-B Dismantling Manual

Dismantling information

The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the disassembly of LG products to remove components and materials requiring selective treatment.

Product Identification

Type of Product Monitor
Model name 32GS60QC-B
This document covers derivation model which has same conceptual design and dismantling process

Displays must be stored in accordance with the requirements stipulated in Appendix VIII (1) or (2) of Directive 2012/19/EU and must, amongst other things, be stored in a weatherproof manner. Containers with covers must be used when storing and transporting the Displays.

Materials and components for Selective Treatment

Displays may contain hazardous substances like Pb and BFRs which are covered by exemptions under the RoHS directive. However, the majority is present in the PCB assembly. In order to reduce emissions as much as possible, a complete disposal of the old appliance is required. This treatment may only be performed in authorized handling plants.

Materials and components Notes Included Location
Printed Circuit Boards (PCB) or Printed Circuit Assemblies (PCA) With a surface greater than 10 square cm O
Batteries For Remote control -
Internal batteries -
Mercury containing components display backlights -
Liquid Crystal Displays (LCD) with a surface greater than 100 square cm Includes background illuminated displays with gas discharge lamps O
Capacitors / condensers (Containing PCB / PCT) -
Electrolytic Capacitors / Condensers measuring greater than 2.5 cm in diameter or height -
External electric cables cords Power cord -
Signal cable O
Gas Discharge Lamps -
Plastics containing Brominated Flame Retardants -
Components and waste containing asbestos -
Components, parts and materials containing refractory ceramic fibers -
Components, parts and materials containing radioactive substances -

Tools Required

List the type that would typically be used to disassemble the product to a point where components and materials requiring selective treatment can be removed.

Tool Description Tool information
Screw driver
Nipper
Plastic Hera Jig

Product Disassembly Process

PCBs and LCD Module

Unscrew and disassemble the back cover and disconnect the key connector.
Disassembly Process - PCBs and LCD Module - Step 1

Remove all the tape and wire, unscrew the screening can and remove the main board

Unscrew the screws and remove the metal and middle front.
Disassembly Process - PCBs and LCD Module - Step 2

LCD module(together with their casing) is only left after all other parts like electronic units and casing have been removed.
Disassembly Process - PCBs and LCD Module - Step 3

Power cord and signal cables

A Power cord plugged into the back of the display can easily be removed by hand or cables are provided as de-attached from the product
Disassembly Process - Power cord and signal cables

Capacitors > 25 mm (N/A)

Capacitors > 25 mm are located in the power supply units and can be removed by nipper: doesn't exist (Cap size is under 25mm)
Disassembly Process - Capacitors > 25 mm (N/A)

Disassembly of External enclosure

Remove the 2ea base screws as shown in the red circle and push down the base as shown in the blue arrow to remove the base
Disassembly of External enclosure - Step 1

Remove the 2ea bracket screws, as shown in the red circle, turn the bracket upward, as shown in the blue arrow, and remove the bracket
Disassembly of External enclosure - Step 2

Remove the 4ea rear shell screws
Disassembly of External enclosure - Step 3

Take the disassembling knife, cut the back shell along the joint between the back shell and the front frame, and remove the back shell

Disassembly of External enclosure - Step 4

Take the screwdriver, remove the wall mounting screws *2ea, motherboard screws *4ea, bracket adapter screws *4ea, as shown in the red circle, remove the bracket adapter
Disassembly of External enclosure - Step 5

Peel off the Myra and acetate tape, as shown in the red box, and remove the wall hangings
Disassembly of External enclosure - Step 6

Remove the LVDS cable, button cable and backlight cable, as shown in the red box, and remove the motherboard
Disassembly of External enclosure - Step 7

Remove the conductive foam on the back of the mainboard, as shown in the red box
Disassembly of External enclosure - Step 8

Take the function key combination, break the card hook to both sides, remove the key and the key pad, and then separate the key and the key pad
Disassembly of External enclosure - Step 9

Remove the center frame screw *15ea, and then remove the center frame
Disassembly of External enclosure - Step 10

Documents / Resources

Download manual

Here you can download full pdf version of manual, it may contain additional safety instructions, warranty information, FCC rules, etc.

Download LG 32GS60QC-B Dismantling Manual

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