Quectel FLM140D Hardware Design page 7

7.1. Mechanical Dimensions .................................................................................................................29
7.2. Recommended Footprint ...............................................................................................................31
7.3. Top and Bottom Views .................................................................................................................. 32
8 Storage and Packaging ..........................................................................................................................33
8.1. Storage Conditions ........................................................................................................................ 33
8.2. Packaging Specifications .............................................................................................................. 34
8.2.1. Carrier Tape ........................................................................................................................ 34
8.2.2. Plastic Reel ..........................................................................................................................35
8.2.3. Packaging Process ............................................................................................................. 35
9 Appendix References .............................................................................................................................37
FLM140D_Hardware_Design
Wi-Fi&Bluetooth Module Series
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