Philips CDF 100 Service Manual page 3

2 PROOUCT INFORMATION
GENERAL INFORMATION
Within the Photo CD concept, photographic film is
scanned, digitally processed and then recorded as a
series of images on Photo CD disc. It is also possible to
print as high quality color prints.
The recorded images on disc are decoded by a
Photo CD player
CD-i player
CD-ROM XA player
The system is fully prepared to handle multipie
applications including CD Audio discs as well as the
Photo CD discs. This photo CD-player is a stand alone
consumer apparatus that plays audio discs (according to
the red book) and photo CD discs. A photo CD disc is a
disc conform the CD-ROM XA bridge specification and
conform the Atlantic specification. A photo CD can be a
single session disc or a multi session disc
(= conform the orange book).
2.1 Technical specification
General
Power requirements: 220V-230V 50Hz Eur
240V SOHzZ UK
120V 60Hz USA
100V 50/60Hz Japan
Power Consumption: about 15 Watts
Weight: 1.1 Kg
Dimensions: 220 X 154 X 48 mm
Operating temperature: +5Cto35C
Humidity range: 5 to 90% (No condensation)
Safety requirements: Conformable IEC65
Connections
Video
Video out (cinch bus):
Y/C (S-VHS) out:
1 Vpp (75 ohms load)
1 Vpp (75 ohms load)(Y)
300 mV pp (75 ohms load)
color burst
Signal to Noise ratio: > 50 dB
Band width: > 5.0 MHz (PAL)
> 4.2 MHz (NTSC)
Audio
Analog output: 2V ims +/- 2 dB
Signal to noise ratio: > 90 dB
Dynamic range: > 85 dB
Channel separation: > 85 dB
Total Harmonic Distortion: < 85 dB
Interfaces: 8-pin mini-Din A/V connector, audio line out,
headphone out, RCS infra red remote contro! receiver,
wail adapter (8.8 V DC input).
PCS 67 430
2.2 Input voltages
The wall adapters for the photo CD players are fully
functional with voltage variations of +/- 10% from nominal
line voltage.
Players for the North American market have nominal line
voltages of 120 V AC.
voltages of 220 V AC/230 V AC.
Players for the United Kingdom have nominal line
voltages of 240 V AC.
Players intended for the Japanese market place have
nominal line voltages of 100 V AC.
2.3 Remote control system
The players use an IR remote transmitter which has
functions commensurate with the features of the model: it
uses the RC-5 remote system.
The transmitter uses 2 AAA LeClanche cells. Normal
user Cell life is expected to be in excess of 2 years. The
transmitter has a useable range of 10 meters.
2.4 Power supply and rechargeable battery pack.
The powersupply has a short circuit protection and a
rechargeable circuit for a battery pack.
To switch on the powersupply the input voltage via wall
adapter or battery pack must be higher than 4.4 Volts
and the on/off switch must be switched on.
The nominal voltage of the wall adapter is 8.8 Volts; the
charging current is 150 mA during 12 h.
CAUTION: During transport you must always use the
transport path !!!
3.1 SAFETY INSTRUCTIONS
Safety regulations demand that the set be restored to
its originat condition and that components identical
with the original types be used.
Safety components are marked by the symbol A.
ESO
All IC's and many other semi-conauctors are
susceptible to electrostatic discharges (ESD).
Careless handling during repair can reduce life
drastically.
When repairing, make sure that you are connected
with the same potential as the mass of the set via a
wrist wrap with resistance.
Keep components and tools also at this potential.
For detailed information see "Handling ESD-sensitive
components".
A set to be repaired should always be connected to
the mains via a suitable isolating transformer.
never repiace any modules or any other parts while
the set is switched on.
Use plastic instead of metal alignment tools. This in
order to prelude short-circuit or to prevent a specific
circuit form being rendered unstable.
3.2 SERVICING OF SMDs (Surface Mounted Devices)
3.2.1 General cautions on handling and storage
a.
bo.
Oxidation on the SMDs terminals results in poor
soldering. Do not handle SMDs with bare hand.
Avoid for storage places that are sensitive to
oxidation such as places with sulfur or chlorine gas,
direct sunlight, high temperatures or a high degree of
humidity.
As a result the capacitance or resistance value of the
SMDs may be affected.
. Rough handling of circuit boards containing SMDs
may cause damage to the components as weil as the
circuit boards. Circuit boards containing SMDs should
never be bent or flexed. Different circuit board
materials expand and contract at different rates when
heated or cooled and the components and/or solder
connections may be damaged due to the stress.
Never rub or scrape chip components as this may
cause the value of the component to change. Similary,
do not slide the circuit board across any surface.
3.2.2 Removal of SMDs
a.
Heat the solder (for 2-3 seconds) at each terminal of
the chip. Small components can, by means of litz wire
and a limited horizontal force, be removed with the
soldering iron. They can also be removed with a
solder sucker (see Fig. 1a) or
. While holding the SMD with a pair of tweezers take it
off gently using th soldering iron's heat applied to
each terminal (see Fig. 1b).
. Remove the excess solder on the solder lands by
means of litz wire or a solder sucker (see Fig. 1c).
3.2.2.1 Caution on removal:
a
b.
. When handling the soldering iron, use suitable
pressure and be careful.
When removing the chip, do not use undue force with
the pair of tweezers.
. The soldering iron to be used (approx. 30 W), must
preferably be provided with a thermal control
(soldering temperature about 225 to 250°C).
The chip, once removed, must never be used again.
PCS 66 382
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3.2.3 Attachment of SMDs
a. Locate the SMD on the solder lands by means of
tweezers and solder the component at one side.
Ensure that the component is positioned well on the
solder lands (see Fig. 2a).
b. Next complete te soldering of the terminals of the
component (see Fig. 2b).
MOUNTING EXAMPLES
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3.2.3.1 Caution on attachment:
a. When soldering the SMD terminals, do not touch them
directly with the soldering iron. The soldering must be
as quick as possible; care must be taken to avoid
damage to the terminals and the body itseif.
. Keep the SMD's body in contact with the printed
board when soldering.
. The soldering iron to be used (approx. 30 W) must
preferably be provided with a thermal control
(soldering temperature about 225 to 250°C).
. Soldering should not be done outside the solder land.
. Soldering flux (of rosin) may be used but should not
be acidic.
. After soldering, let the SMD cool down gradually at
room temperature.
. The quantity of solder must be proportional with the
size of the solder land. If the quantity is too great, the
SMD might crack or the solder lands might be torn
loose from the printed board (see Fig. 3).