ASL INTERCOM MPX10 Assembly Instructions Manual page 3

MPX10 – Adding MPX10 Expansion Module(s) Assembly Instructions
1 Introduction
This document provides instructions on how to fit MPX10 Expansion Modules to an MPS01 microphone.
It does not provide installation information or instructions. Please refer to the Installation Guide for the
MPS-Series microphones (ASL U-0664-0174) for installation instructions.
Once fitted with one or more MPX10 modules, the MPS01 becomes an MPS10, MPS20, MPS30, MPS40 or
MPS50, as described below.
Microphone series:
MPS Modular Microphone Station
Number of microphone buttons:
01 None
10 10 buttons (right-hand side)
20 20 buttons (right-hand side)
30 30 buttons (right-hand side)
40 40 buttons (right-hand side)
50 50 buttons (right-hand side
Note that the MPS01 base unit can support a maximum of five MPX10 Expansion Modules.
2 Protective Measures and Handling
ESD Precautions
This product contains static-sensitive devices. Observe
ESD precautions when working on the equipment with
the cover removed.
Unpacking and Handling
The equipment should be unpacked and inspected
immediately on receipt. If damage has occurred please
advise your carrier or supplier.
It is advisable to retain the original equipment packing in
the event that the equipment ever needs returning for
service.
Ensure that the name and address of the Authorised
Distributor from whom you purchased the unit is
recorded on the "Service and Warranty" page of this
manual for future reference.
Packing for Return for Repair
! !
! !
Advice on packing the product for return can be provided
by ASL.
U-0664-0522.doc – Issue: 03 complete, approved
Page 3 of 12
MPS
All electronics assemblies must be
properly packed in ESD protective
packing for transport, to prevent physical
and ESD damage.
The filler material used for packing for
return for repair must be antistatic or
static dissipative, as this may come into
contact with exposed connectors, wiring,
or PCB assemblies. The use of non-
conductive filler material may cause
damage to the electronic assemblies
reducing their operational life, or even
destroying them.
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