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Summary of Contents for ENGICAM GEA STM32MP13
- Page 1 GEA STM32MP13 HW manual Getting started manual Revision History DATE REVISION CHANGE DESCRIPTION 07/03/2023 1.0.0 Release...
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Page 2: Table Of Contents
Table of Content Chapter 1 .............................. 4 1.1 General Information ........................5 1.2 Block Diagram ........................... 6 1.3 Main Features ..........................7 Document and Standard References ..................7 1.4.1 External Industry Standard Documents ................7 1.4.2 Other external documents ....................7 1.4.3 On-line documentation ...................... - Page 3 5.7 USB interface ........................... 32 5.7.1 How to connect the USB OTG interface ................32 5.7.2 How to connect the USB host interface ................34 5.8 How to connect the SD CARD interface ................. 35 5.9 How to connect an LCD display ....................36 5.10 Boot Mode Pin ........................
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Page 4: Chapter 1
Chapter 1 Introduction This Chapter gives background information on this document. Section includes： • General Overview • Acronyms and Abbreviations Used • Document and Standard References... -
Page 5: General Information
All examples of this document are based on carrier board that is available from ENGICAM. This document also provides a collection of... -
Page 6: Block Diagram
1.2 Block Diagram... -
Page 7: Main Features
1.3 Main Features 1.4 Document and Standard References 1.4.1 External Industry Standard Documents • The I2C Specification, Version 2.1, January 2000, Philips Semiconductor (now NXP). I2S Bus Specification, Feb. 1986 and Revised June 5, 1996, Philips Semiconductor (now NXP). • •... -
Page 8: Disclaimer
Engicam explicitly reserves the rights to change or add to the contents of this manual or parts of it without special notification. All operating parameters must be validated for each customer application by customer’s technical experts. -
Page 9: Acronyms And Abbreviations Used
1.7 Acronyms and Abbreviations used ABBREVIATION EXPLANATION Analogue to Digital Converter Controller Area Network, a bus that is manly used in automotive and industrial environment Central Processor Unit Digital to Analogue Converter Electromagnetic Interference, high frequency disturbances eMMC Embedded Multi Media Card, flash memory combined with MMC interface controller in a BGA package, used as internal flash memory Electrostatic Discharge, high voltage spike or spark that can damage electrostatic- sensitive devices... -
Page 10: Chapter 2
Chapter 2 Mechanical data This Chapter gives information about PCB and module's dimensions. Section includes： • Assembly Top View • Assembly Bottom View • Mechanical data... -
Page 11: Mechanical Data
2.1 Mechanical data The ST module has a standard SO DIMM footprint compliant with TYCO ELECTRONICS code 1473005-1 or compatible connector. The PCB dimensions is L 67.60 x W 25 x H 1 mm. The distances available on PCB under the module are from 1 to 1.4 mm 2.1.1 Assembly Top View Figure 1 2.1.2 Assembly Bottom View... -
Page 12: Chapter 3
Chapter 3 Ordering information This Chapter gives the ordering information and technical specifications of the modules. Section includes： • GEA STMP1 ordering codes • CPU & Memory specification • Operating temperature range • STM32MP135 supported features... -
Page 13: Ordering Information
3.1 Ordering Information Following is provided the ordering information and the description for the Basic technical specifications modules: Marking Code Ordering Code Description CPU & Memory specifications Operating temperature Module available at range °C (excepted CPU) least until GEA STM32MP1 512 002682028DI43A -25 to +85 Q -2033... -
Page 14: Part Number Structure
3.2 Part Number Structure The module is available with eMMC option. The standard order codes shown in the tables above shall be modified as follow: 0026 RAM size 512MB Option available No option Non volatile memory specification Single Ethernet 256MB SLC NAND Dual Ethernet 512MB SLC NAND 4GB eMMC... -
Page 15: Chapter 4
Chapter 4 Pinout and electrical specs This Chapter gives the pinout information. Section includes： • Pinout overview • Pad specifications • Electrical specifications... -
Page 16: Module Pinout
4.1 Module Pinout The module's interface is achieved by a SO DIMM 200 position connector TYCO ELECTRONICS code 1473005-1 or compatible Name Pin Name on CPU Primary Function Description GPIO Voltage Capable +1V8 Output Power PIN +1V8 Output Power PIN Power PIN Power PIN Power PIN... - Page 17 Name Pin Name on CPU Primary Function Description GPIO Voltage Capable Power PIN Spare GPIO +3,3V SPI2_MOSI PH10 SPI MOSI signal +3,3V Power PIN Spare GPIO +3,3V Spare GPIO +3,3V SPI2_NSS PB13 SPI Chip Select signal +3,3V Power PIN SPI2_CLK PB10 SPI CLK signal +3,3V...
- Page 18 Name Pin Name on CPU Primary Function Description GPIO Voltage Capable LCD_B0 LCD interface +3,3V LCD_B1 PE13 LCD interface +3,3V LCD_G0 LCD interface +3,3V LCD_G1 LCD interface +3,3V Power PIN LCD_R0 PA15 LCD interface +3,3V LCD_R1 LCD interface +3,3V ETH2_TXP Fast Ethernet TXP signal ETH2_TXN Fast Ethernet TXN signal...
- Page 19 Name Pin Name on CPU Primary Function Description GPIO Voltage Capable Power PIN SAI1_SCKA I2S SCLK +3,3V LCD_CLK LCD interface +3,3V ETH1_TXN Fast Ethernet TXN signal nRESET Reset signal +3,3V ETH1_TXP Fast Ethernet TXP signal Spare GPIO +3,3V ETH1_RXN Fast Ethernet RXN signal LCD_BL PE12 LCD interface...
- Page 20 Name Pin Name on CPU Primary Function Description GPIO Voltage Capable SDIO_B_DATA3 PC11 SD DAT 3 signal +3,3V SDIO_B_CMD SD CMD signal +3,3V SDIO_B_DATA0 SD DAT 0 signal +3,3V SDIO_B_CLK PC12 SD CLK signal +3,3V SDIO_B_DATA2 PC10 SD DAT 2 signal +3,3V SDIO_B_DATA1 SD DAT 1 signal...
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Page 21: Electrical Specifications
4.2 Electrical specifications 4.2.1 Operating Ranges All the values reported in the following table have to be confirmed V Min (Volts) V Typ (Volts) V Max (Volts) Vin 1) + 5,25 VBUS_USB (180, 195) + 5,25 GPIO V(oh) + 2,8 GPIO V(ol) + 0,4 GPIO V(ih) -
Page 22: Chapter 5
Chapter 5 Module interfaces This Chapter gives the technical specifications for carrier board design. Section includes： Power signals and backup battery ▪ ▪ Serials ▪ CAN Bus Ethernet ▪ ▪ SDIO ▪ ▪ ▪ LVDS Boot mode ▪ ▪ Audio ▪... -
Page 23: How To Power The Module
5.1 How to power the module Read carefully the related sections before starting the power stage design. This module needs to be supply up to +5Vin power. Please refer to the table below for the power supply range specification. The power dissipated by the module in the operating mode is up to 600 mA, but the system must provide at least a power of 2A at 5V to allow the start of the module. -
Page 24: How To Connect A Backup Battery
Power output Max output current +1V8 50 mA (Total) +3V3_OUT 800 mA (Total) Table 7 WARNING! The currents above 600 mA provided by the +3V3_OUT of the module, help to lower the performance in temperature. We recommend adding a regulator voltage for an external current greater than or equal to 600 mA, in those applications where the operating temperature range is important. -
Page 25: How To Connect Two 3-Wire Rs232 Serial Port
5.3 How to connect two 3-wire RS232 serial port This section shows how to use the ST UARTs as 3-wire RS232 serial ports. The table shows involved UARTs and the associated pins: Number Name Primary Function GPIO Capable Voltage Description UART8_TXD UART8 TXD signal +3,3V... -
Page 26: How To Connect A Rs485 Serial Port
5.4 How to connect a RS485 serial port This chapter shows how an RS485 serial port can be connected to the module. The figure below shows how UART is connect to the RS485 transceiver. Figure 4 The pins involved in this RS485 communication in standard EDIMM spec are listed in the following table. Number Name Primary Function... -
Page 27: How To Connect Can Bus Interfaces
5.5 How to connect CAN BUS interfaces This chapter describes how CAN bus transceiver can be connected to the STM32MP135 module. Figure 5 The following table describes the pins' numbering in the main connector involved in the CAN interface Number Name Primary Function GPIO Capable... -
Page 28: How To Design The Ethernet Interface
5.6 How to design the Ethernet interface 5.6.1 Double Ethernet option (2 x PHY on board) The NXP ST Ethernet Media Access Controller (MAC) is designed to support 2 x 10/100 Mbps Ethernet/IEEE standard 802.3™ networks. Figure 6 The table below lists both the Ethernet signals available on the module. The primary function description is referred to the differential pair in 1000BASE-T mode. -
Page 29: Component Placement Considerations
5.6.2 Component Placement considerations Components placement can affect signal quality, emissions and can decrease EMI problems. If the magnetics are a discrete component than the distance from the connector RJ45 should be kept to under 25mm of separation. To decrease EMI problems the distance between magnetics and Phy should be at least 25mm or greater to isolate the PHY from magnetics. -
Page 30: Cable Transient Event And Phy Protection
5.6.3 Cable Transient Event and PHY Protection Cable transient events are + and - DC surges that are induced across the transformer onto the PHY side of the TX+/- and RX+/- signals as shown in the figure below. The PHY side of the transformer should not contain any DC component other than the typical 3.3V pull-up on the center tap of the transformer for analog signal biasing. -
Page 31: Phy Ethernet
5V. D3 and D4 act the same way when the transient is across the RX+/- differential pair. The total capacitance seen by each differential pair must not exceed 50pF (25pF single ended). Figure 9 Recommended by ENGICAM: Diode array TVS, 4 CH, ESD, 3.3V Wurth Elektronik 824013... -
Page 32: Usb Interface
5.7 USB interface 5.7.1 How to connect the USB OTG interface The NXP ST USB module provides high performance USB On-The-Go (up to 480Mbps), compatible with the USB 2.0 specification. An OTG HS PHY is also integrated so no external OTG PHY is needed on the baseboard. The figure shows how the MINI-AB USB/OTG connector is powered and connected in the evaluation board. - Page 33 The following figures show two different ways to connect the USB OTG interface that may be used to work as either a host or a device. Use of the USB OTG port as a Host with its own dedicated supply. The ID signal is forced to GND Figure 11 Use of the USB OTG port as Device.
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Page 34: How To Connect The Usb Host Interface
5.7.2 How to connect the USB host interface The module provides one port for USB host interface. The figure shows how to connect this port to the Module. Figure 11 It's possible to multiply the USB ports available by equipping the carrier board with a USB HUB. The Figure 12 shows how to connect USB Hub outputs to: USB power distribution switches (TPS 2052BD) and USB type A connector. -
Page 35: How To Connect The Sd Card Interface
5.8 How to connect the SD CARD interface The STM32MP1 provides the interface between the host system and MMC/SD/SDIO/CE-ATA cards, including cards with reduced size or mini cards. The module includes these features and the figure shows how the Micro SD Card connector is connected to ST Module in the evaluation board. -
Page 36: How To Connect An Lcd Display
5.9 How to connect an LCD display The GEA STM32MP1 module offers LCD signals for 24 bit display. The pin names indicate the color mapping: for example LCD_B0 is relative to Blue LSB and B7 to Blue MSB. Number Name Primary Function Description GPIO Capable Voltage... -
Page 37: Boot Mode Pin
5.10 Boot Mode Pin Boot mode pin determines how the module boot. The following table listed the possible options of the boot mode: BOOT_MODE Action Boot from memory devices Boot from Serial Table 19 The boot from Serial is usually used for the boot loader deploy, for further information referring to the CPU RM. Figure 14 The table below lists the boot mode Pin numbering. -
Page 38: How To Connect The Audio Interface
5.11 How to connect the Audio Interface GEA STMP1 is equipped with a SAI (Synchronous Audio Interface) that can be connected with a standard audio codec device. The figure below shows connection with a Low Power Stereo Codec using the module signals interface Figure 16 The following table lists the I2S BUS pins numbering Number... -
Page 39: How To Connect The Reset Pin
5.12 How to connect the reset pin The nRESET signal has input/output functionality and shall be driven in open-drain mode. The signal has an internal 100K pull-up; the maximum recommended capacitive load is about 100pF. Figure 17 TDelay: driven low by SOM during the POR state TReset: driven low by user to force POR CPU pin 5.12.1 Input mode usage The nRESET signal can be used to reset the module by driving it with an open-drain or with a simple button. -
Page 40: Chapter 6
Chapter 6 Peripheral multiplexing This Chapter gives the alternative peripheral information Section includes： • • • • • UART •... -
Page 41: Peripheral Multiplexing Description
6.1 Peripheral multiplexing description In the following we describe opportunity to use alternative interfaces using the properties of multiplexing pin. Refer to the NXP's reference manual and documentation for further details. 6.1.1 SPI & IIS Configuration Using pin multiplexing 's features we may have the following SPI and IIS connections. The tables below show the output signals on the Connector's module. -
Page 42: Alternative Pwm Pins Table
IIS2 bus interfaces Pin number Pin Name on MP135 Signal reference Voltage reference 26 / 114 PG10 / PA0 I2S_DIN +3,3V 27 / 116 / 122 PF12 / PD6 / PA5 I2S_DOUT +3,3V 65 / 108 / 124 PC0 / PH12 / PA4 I2S_SCLK +3,3V 14 / 115 / 147... -
Page 43: Iic Configuration
6.1.3 IIC Configuration IIC1 interfaces Pin number Pin Name on MP135 Signal reference Voltage reference 10 / 170-185 PB8 / PC10 +3,3V 6 / 166-186 PE8 / PC11 +3,3V Table 32 IIC2 interfaces Pin number Pin Name on MP135 Signal reference Voltage reference 111 / 158 PD7 / PF2... -
Page 44: Alternative Uart Pins Tables
6.1.4 Alternative UART pins tables The following tables show an alternative UART configuration UART1 interfaces Pin number Pin Name on MP135 Signal reference Voltage reference 65 / 142 / 154 PC0 / PA9 / PB6 UART1_TXD +3,3V 32 / 66 / 144 PD13 / PB0 / PD14 UART1_RXD +3,3V... -
Page 45: Alternatives Can Bus Interfaces
Pin number Pin Name on MP135 Signal reference Voltage reference 114 / 144 PG10 / PD14 UART8_CTS +3,3V PE12 UART8_RTS +3,3V Table 43 6.1.5 Alternatives CAN bus interfaces CAN 1 BUS Interface Pin number Pin Name on MP135 Signal reference Voltage reference 114 / 118 / 171-187 PG10 / PE10 / PC9... -
Page 46: Chapter 7
Chapter 7 7.1 Carrier board recommended specifications Following are the specifications required for the carrier board to avoid problems in the assembly process. The module is interfaced with the carrier board through a SO-DIMM with 200 positions connector type TYCO ELECTRONICS code 1473005-1 or compatible. For proper assembly it is strongly recommended to paying attention to: 7.1.1 Planarity in finish process Due to the technical and mechanical specifications of the connector we suggest the maximum planarity of the footprint on PCB, so we... -
Page 47: Chapter 8
8.1 Product compliance In order to respect own internal policy regarding the environmental regulations and safety laws, Engicam in this chapter confirms the compliant, when applicable, of its own products to the normative ROHS and REACH and to the recognized hazards.
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