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DATE
REVISION
23/10/15
1.0.0
01/12/15
1.0.1
21/01/16
1.0.2
12/09/16
2.0.0
10/10/16
2.0.1
28/10/16
2.0.2
09/01/17
2.0.3
07/04/17
2.0.4
D N :
Gea M6UL HW manual 2.0.4
Getting started manual
***** REV 2.0.4 *****
CHANGE DESCRIPTION
Release
Added pinout update
Added Reset pin informations; added power current consumption; updated Boot pins configurations
New PCB revision, added eMMC assembly option
General enhancement
Important correction on PAD CPU Reference (pinout table).for details see PCN1610-1
Electrical specifications updated
Updated ordering code
1
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Table of Contents
Related Manuals for ENGICAM Gea M6UL HW
Summary of Contents for ENGICAM Gea M6UL HW
- Page 1 Gea M6UL HW manual 2.0.4 Getting started manual ***** REV 2.0.4 ***** DATE REVISION CHANGE DESCRIPTION 23/10/15 1.0.0 Release 01/12/15 1.0.1 Added pinout update 21/01/16 1.0.2 Added Reset pin informations; added power current consumption; updated Boot pins configurations 12/09/16 2.0.0...
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Page 2: Table Of Contents
Summary 1. Introduction..............................3 1.1 Introduction................................4 1.2 Acronyms and Abbreviations used..........................4 1.3 Document and Standard References........................5 1.3.1 External Industry Standard Documents............................5 1.3.2 NXP Documents..................................5 1.3.3 Disclaimer....................................5 2. Mechanical data............................6 2.1 Mechanical data................................ 7 2.2 Assembly Top View..............................7 2.3 Assembly Bottom View.............................. -
Page 3: Introduction
Chapter 1. Introduction This Chapter gives background information on this document. Section includes： General Overview ✔ Acronyms and Abbreviations Used ✔ Document and Standard References ✔ D N :... -
Page 4: Introduction
All examples of this document are based on GEA M6UL carrier board that is available from ENGICAM. This document also provides a collection of useful documentation, application reports, and design recommendations. -
Page 5: Document And Standard References
Engicam explicitly reserves the rights to change or add to the contents of this manual or parts of it without special notification. All operating parameters must be validated for each customer application by customer’s technical experts. -
Page 6: Mechanical Data
Chapter 2. Mechanical data This Chapter gives information about PCB and module's dimensions. Section includes： Assembly Top ✔ Assembly Bottom ✔ Mechanical dimensions ✔ D N :... -
Page 7: Mechanical Data
2.1 Mechanical data The i.MX6UL module has a standard SO DIMM footprint compliant with TYCO ELECTRONICS code 1473005-1 or compatible connector. The PCB dimensions is L 67.6 x W 25 x H 1 mm. The distances available on PCB under the module are from 1 to 1.5 mm 2.2 Assembly Top View The GEA M6UL Module has a Standard SODIMM footprint where odd pins are on top (component) side and even pins are on bottom side. -
Page 8: Ordering Information And Features
Chapter Features 3. Ordering Information and This Chapter gives the ordering information and technical specifications of the modules. Section includes： GEA M6UL Ordering code ✔ CPU & memory specifications ✔ Operating temperature range ✔ D N :... -
Page 9: Ordering Information
3.1 Ordering Information In the following table some examples of orderable codes, informations and the descriptions for the modules' basic technical specifications: Part name Ordering Code Description CPU & Memory specifications CPU junction Operating temperature Module available at temperature range °C range °C (excepted CPU) least until SODIMM Module... - Page 10 The module is available with both NAND and eMMC option. The main order codes, shown in the table above, could be modified following the structure below: 0026 0026 Reserved Reserved RAM SIZE RAM SIZE 128MB 256MB 512MB OPTION AVAILABLE OPTION AVAILABLE Single ethernet (BASIC) NON VOLATILE MEMORY SPECIFICATION NON VOLATILE MEMORY SPECIFICATION...
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Page 11: Pinout
Chapter 4. Pinout This Chapter gives the pinout informations. Section includes： Pinout overview ✔ i.MX Pad spacifications ✔ Electrical specification ✔ D N :... -
Page 12: Module Pinout
4.1 Module Pinout The module's interface is achieved by a SO DIMM 200 position connector TYCO ELECTRONICS code 1473005-1 or compatible Name Pin Name on I.MX6 Primary Function Description GPIO Voltage Capable +1V8 Output Power PIN +1V8 Output Power PIN Power PIN Power PIN Power PIN... - Page 13 Name Pin Name on I.MX6 Primary Function Description GPIO Voltage Capable SD2_CD CSI_MCLK uSDHC2 CD Signal +3,3V GPIO1_8 GPIO1_IO08 Generic GPIO +3,3V Power PIN GPIO4_18 CSI_PIXCLK Generic GPIO +3,3V GPIO3_4 LCD_RESET Generic GPIO +3,3V SPI1_MOSI CSI_DATA06 Enhanced Configurable SPI MOSI +3,3V Power PIN GPIO3_27...
- Page 14 Name Pin Name on I.MX6 Primary Function Description GPIO Voltage Capable GPIO1_18 UART1_CTS_B Generic GPIO nSD_BOOT +3,3V Power PIN ETH1_TXP Fast Ethernet TXP signal ETH1_TXN Fast Ethernet TXN signal Led Indicator Cathode signal ETH1_LED_10_100_KATHOD ETH1_RXP Fast Ethernet RXP signal ETH1_LED_ACT_ANOD Led indicator Anode signal ETH1_RXN Fast Ethernet RXN signal...
- Page 15 Name Pin Name on I.MX6 Primary Function Description GPIO Voltage Capable UART1_RXD UART1_RXD UART1 RXD signal +3,3V CAN1_TX UART3_CTS CAN 1 transmit signal +3,3V CAN1_RX UART3_RTS CAN 1 receive signal +3,3V CAN2_TX UART2_CTS CAN 2 transmit signal +3,3V CAN2_RX UART2_RTS CAN 2 receive signal +3,3V I2S_DOUT...
- Page 16 Name Pin Name on I.MX6 Primary Function Description GPIO Voltage Capable DISP0_D2 LCD_DATA02 LCD interface +3,3V DISP0_D1 LCD_DATA01 LCD interface +3,3V DISP0_D0 LCD_DATA00 LCD interface +3,3V DISP0_VSYNC LCD_VSYNC LCD interface +3,3V DISP0_HSYNC LCD_HSYNC LCD interface +3,3V DISP0_DRDY LCD_ENABLE LCD interface +3,3V SD2_D3 CSI_DATA03...
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Page 17: What's New
Name Pin Name on I.MX6 Primary Function Description GPIO Voltage Capable +5Vin Power PIN +5Vin Power PIN +5Vin Power PIN +5Vin Power PIN Table 2 Note: for the use of this pin please refer to boot option in “Boot Mode Pin” chapter Connect to Coin-Cell or Super-Cap;... -
Page 18: Electrical Specifications
4.3 Electrical specifications V Min (Volts) V Typ (Volts) V Max (Volts) + 3,6 + 5,5 VBUS_OTG_USB, VBUS_USB + 4,40 +5.35 GPIO V(oh) + 3,15 GPIO V(ol) + 0,15 GPIO V(ih) + 2,35 + 3,3 GPIO V(il) Table 4 This measure has done testing the module's start at the limit temperatures of -40°C and +85°C Warning: the use of V Min voltage to power the module is not enough to power also the VBUS for USB peripherals Following, the current consumption test on module type GEA M6UL NAND BASIC, when running four different benchmarks. -
Page 19: Carrier Board Design
Chapter 5. Carrier Board Design This Chapter gives the technical specifications for carrier board design. Section includes： Carrier Board recommendations ✔ Power signals and backup battery ✔ Serials ✔ CAN Bus ✔ Ethernet ✔ ✔ SDIO ✔ ✔ Boot mode ✔... -
Page 20: Carrier Board Recommended Specifications
5.1 Carrier board recommended specifications Following we'll describe the specifications required to carrier board to avoid problems of assembly process. The module is interfaced with the carrier board through a SO-DIMM with 200 positions connector type TYCO ELECTRONICS code 1473005-1 or compatible. For proper assembly is strongly recommended to paying attention to: 5.1.1 Planarity in finish process Due to the technical and mechanical specifications of the connector we suggest the maximum planarity of the footprint on PCB, so we... -
Page 21: How To Power The Gea M6Ul Module
5.2 How to power the GEA M6UL module Please read carefully the related sections before start your power stage design. This module needs to be supply up to +5Vin power. Please refer to the table below for the power supply range specification. The power dissipated by the module in the operating mode is about 200 mA, but the system must provide at least a power of 1A at 5V to allow the start of the module. -
Page 22: How To Connect A Backup Battery
We recommend to add a regulator voltage for an external current greater than or equal to 600 mA, in those applications where the operating temperature range is important. NOTE: Engicam not provide for a dissipation system, it is customer's own responsibility to evaluate the appropriate heatsink and the dissipation system depending of its own application. -
Page 23: How To Connect Two 3-Wire Rs232 Serial Port
5.3 How to connect two 3-wire RS232 serial port In this section is shown how to use the UART1 and UART2 as 3-wire RS232 serial ports. In the following table are shown the UART1 and UART2 pins numbering. Number Name Primary Function GPIO Voltage... -
Page 24: How To Connect A Rs485 Serial Port
5.4 How to connect a RS485 serial port In this chapter is shown how an RS485 serial port can be connected to the module. In the figure below is shown how UART3 is used to connect to a RS485 transceiver on the starter kit. The figure shows UART3 connection but you can consider that also UART 4 & 5 can be used to connect a RS485 transceiver. -
Page 25: How To Connect Can Bus Interfaces
5.5 How to connect CAN BUS interfaces In this chapter is described how CAN bus transceiver can be connected to a module. In the figure below is shown how CAN bus1 and 2 are connected in the evaluation board. Both CAN buses have been implemented. Figure 5 The following table describes the pins' numbering in the main connector involved in the CAN interface Number... -
Page 26: How To Design The Ethernet Interface
5.6 How to design the Ethernet interface The NXP i.MX6UL Ethernet Media Access Controller (MAC) is designed to support both 10 and 100 Mbps Ethernet/IEEE standard 802.3™ networks. The 10-Mbps and 100-Mbps RMII Ethernet physical interfaces is supported. In the figure is shown how to connect the Ethernet interface to module. -
Page 27: Component Placement Considerations
5.6.1 Component Placement considerations Components placement can affect signal quality, emissions and can decrease EMI problems. If the magnetics are a discrete component than the distance from the connector RJ45 should be kept to under 25mm of separation. To decrease EMI problems the distance between magnetics and Phy should be at least 25mm or greater to isolate the PHY from magnetics. -
Page 28: Cable Transient Event And Phy Protection
5.6.2 Cable Transient Event and PHY Protection Cable transient events are + and - DC surges that are induced across the transformer onto the PHY side of the TX+/- and RX+/- signals as shown in figure below. The PHY side of the transformer should not contain any DC component other than the typical 3.3V pull-up on the center tap of the transformer for analog signal biasing. -
Page 29: Phy Ethernet
5V. D3 and D4 act the same way when the transient is across the RX+/- differential pair. The total capacitance seen by each differential pair must not exceed 50pF (25pF single ended). Figure 9 Recommended by ENGICAM: Diode array TVS, 4 CH, ESD, 3.3V Wurth Elektronik 824013... -
Page 30: Usb Interface
5.7 USB interface 5.7.1 How to connect the USB OTG interface The NXP i.MX6UL USB module provides high performance USB On-The-Go (up to 480Mbps), compatible with the USB 2.0 specification. An OTG HS PHY is also integrated so no external OTG PHY is needed on the baseboard. In the figure is shown how the MINI-AB USB/OTG connector is powered and connected in the evaluation board. - Page 31 In the following figures there are shown two different ways to connect the USB OTG interface that may be used to work as either a host or a device. Use of the USB OTG port as a Host with its own dedicated supply. The ID signal is forced to GND Figure 11 Use of the USB OTG port as Device or as Host depending on the status of the ID signal that is used also to enable the power supply.
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Page 32: How To Connect The Usb Host Interface
Figure 13 Engicam's evaluation board is equipped with an USB HUB to multiply the USB port available on module, if only one port is needed it's possible to connect it as one of the four output ports of the HUB output directly to module on pin 194-196 of the main connector. -
Page 33: How To Connect The Sd Card Interface
5.8 How to connect the SD CARD interface The NXP i.MX6UL Ultra Secured Digital Host Controller (uSDHC) provides the interface between the host system and MMC/SD/SDIO/CE-ATA cards, including cards with reduced size or mini cards. The module include this features and in the figure is shown how the Micro SD Card connector is connected to GEA Module in the evaluation board. -
Page 34: How To Connect An Lcd Display
5.9 How to connect an LCD display The evaluation board is equipped with one RGB data port, this interface contains RGB data of 18 bit, pixel clock. Following are reported the schematic interface with parallel URT and the map of signals. Number Name Primary Function Description... -
Page 35: Connection Map For 18 Bit Tft Only
5.9.1 Connection map for 18 bit TFT only The following map represent the connection mode applied to 18 bit TFT display For every connection the colour controlled is joined Number Name 18 bit TFT connections DISP0_D0 BLU 0 DISP0_D1 BLU 1 DISP0_D2 BLU 2 DISP0_D3... -
Page 36: Boot Mode Pin
5.10 Boot Mode Pin Boot mode pin determines how the module boot. The following table listed the possible options of the boot mode: BOOT_MODE Action Boot from memory devices Boot from USB OTG Table 20 The boot from USB OTG is usually used for the boot loader deploy. In the figure is shown the boot section scheme. - Page 37 The figure above shows the implementation of the boot options applied to a generic carrier board. The signal used to configure the boot option on the ENGICAM EVABOARD is named EIM_DA7 (pin 80, nSD_BOOT signal on GEA M6UL) which is pulled up with a 12KOhm resistor on the module.
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Page 38: Boot Signals Management
The NXP documentation declares the above signals as BOOT_CFG signals but no other information (function and reset status) is currently given about them. Basing on the Engicam test result we currently suggest to leave all these signals floating during reset status and it's strongly recommended to consult the NXP's documentation before starting the carrier board design. -
Page 39: How To Connect The Audio Interface
5.11 How to connect the Audio Interface The evaluation board is equipped with the low-power stereo codec, NXP SGTL5000, that includes headphones and is designed to provide a comprehensive audio solution for portable products that require line-in, mic-in, line-out, headphone-out and digital I/O. The figure shows how the device interface is connected to the module using the I2S BUS Figure 24 Following the I2S BUS pins numbering... -
Page 40: How To Connect The Reset Pin
5.12 How to connect the reset pin The nRESET signal has input/output functionality and shall be driven in open-drain mode. The signal has an internal 100K pull-up and a 100 Ohm series resistors,the maximum recommended capacitive load is about 100pF. Figure 23 : driven low by SOM during the POR state Delay... -
Page 41: Peripheral Multiplexing
Chapter 6. Peripheral multiplexing This Chapter gives the alternative peripheral informations Section includes： ✔ ✔ ✔ ✔ ✔ UART ✔ ✔ ✔ D N :... -
Page 42: Peripheral Multiplexing Description
6.1 Peripheral multiplexing description Following we describe opportunity to use alternative interfaces using the properties of multiplexing pin. Please refer to the NXP's reference manual and documentation for further details (document name i.MX6UL Reference Manual). 6.1.1 SPI Interfaces Using pin multiplexing 's features we may have the following SPI and IIS connections. In the tables below are shown the output signals on the Connector's module. -
Page 43: Iis Configuration
6.1.2 IIS Configuration The following tables show the pin configurations for IIS Bus on module's connector. IIS1 bus interfaces Pin number Pin Name on i.MX Signal reference Voltage reference 63 / 155 CSI_DATA06 / LCD_DATA03 I2S_DIN +3,3V 73 / 154 CSI_DATA07 / LCD_DATA04 I2S_DOUT +3,3V... -
Page 44: General Purpose Timer (Gpt)
6.1.4 General Purpose Timer (GPT) Using pin multiplexing 's features we may have the following GPT connections. In the tables below are shown the signals on the Connector's module. GPT IN interfaces Pin number Pin Name on i.MX Signal reference Voltage reference 33 / 112 GPIO1_IO00 / UART2_TX_DATA... -
Page 45: I2C Configuration
6.1.5 I2C Configuration The following tables show the pin configurations for I2C Bus on module's connector. I2C1 interfaces Pin number Pin Name on i.MX Signal reference Voltage reference 40 / 27 / 23 CSI_PIXCLK / GPIO1_IO02 / UART4_TX_DATA +3,3V 37 / 26 / 24 CSI_MCLK / GPIO1_IO03 / UART4_RX_DATA +3,3V Table 36... -
Page 46: Alternative Uart Pins Tables
6.1.6 Alternative UART pins tables The following tables shows an alternative UART configuration UART1 interfaces Pin number Pin Name on i.MX Signal reference Voltage reference UART1_CTS_B UART1_CTS +3,3V UART1_RTS_B UART1_RTS +3,3V 27 / 116 GPIO1_IO02 / UART1_TX_DATA UART1_TXD +3,3V 26 / 117 GPIO1_IO03 / UART1_RX_DATA UART1_RXD +3,3V... - Page 47 UART6 interfaces Pin number Pin Name on i.MX Signal reference Voltage reference CSI_HSYNC UART6_CTS +3,3V CSI_VSYNC UART6_RTS +3,3V CSI_MCLK UART6_TXD +3,3V CSI_PIXCLK UART6_RXD +3,3V Table 45 UART7 interfaces Pin number Pin Name on i.MX Signal reference Voltage reference LCD_DATA06 UART7_CTS +3,3V 132 / 151 ENET1_RX_ER / LCD_DATA07...
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Page 48: Alternative Cmos Sensor Interface
6.1.7 Alternative CMOS Sensor Interface CSI interfaces Pin Number Pin Name on i.MX Signal Name Function Description Voltage 141 / 66 LCD_DATA17 / UART3_RX_DATA DATA0 CMOS Sensor Interface Data +3,3V 142 / 191 LCD_DATA16 / UART3_TX_DATA DATA1 CMOS Sensor Interface Data +3,3V 168 / 116 CSI_DATA00 / UART1_TX_DATA... -
Page 49: Usdhc Interfaces
6.1.8 uSDHC Interfaces uSDHC Interface (SD1) Pin Number Pin Name on i.MX Signal reference Voltage reference 26 / 68 / 183 GPIO1_IO03 / CSI_DATA05 / UART1_RTS_B uSDHC1 CD Signal +3,3V SD1_DAT0 uSDHC1 DAT 0 signal +3,3V +3,3V SD1_DAT1 uSDHC1 DAT 1 signal SD1_DAT2 uSDHC1 DAT 2 signal +3,3V...
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