Service Precautions; Notes On Soldering; Notes On Replacing Parts - Pioneer CDJ-2000NXS2 Service Manual

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1. SERVICE PRECAUTIONS

1.1 NOTES ON SOLDERING

• For environmental protection, lead-free solder is used on the printed circuit boards mounted in this unit.
A
Be sure to use lead-free solder and a soldering iron that can meet specifications for use with lead-free solders for repairs
accompanied by reworking of soldering.
Do NOT use a soldering iron whose tip temperature cannot be controlled.
B

1.2 NOTES ON REPLACING PARTS

C
The part listed below is difficult to replace as a discrete component part.
When the part listed in the table is defective, replace whole Assy.
Assy Name
Ref No.
MAIN Assy IC1, IC2
IC10
IC14
IC301
IC501, IC502
D
IC1101
IC1102
IC1103
IC602
IC603
IC604
IC606, IC1502, IC1503
IC1201
IC607
LCDB Assy IC4801
IC4802
IC4202, IC4204
E
SRVB Assy IC7305
The part listed below is difficult to replace as a discrete component part.
The replaceing method see remarks.
Assy Name
Ref No.
JFLB Assy V9201
F
4
1
2
Function
DDR2
MAIN CPU
AUTHENTICATION CHIP
DSP
DDR3
PMIC
SmartReflex
VTT Regulator
USB-LAN Conversion
USB-HUB (function)
LAN-HUB & PHY
DC/DC CONVERTER
FPGA
USB CURRENT LIMIT IC
LCD POWER IC
LCD BACKLIGHT POWER IC
DC/DC CONVERTER
DC/DC CONVERTER
Parts that is Difficult to Replace
Function Part No.
Jog FL DEL1074
CDJ-2000NXS2
2
3
Parts that is Difficult to Replace
Part No.
W971GG6SB-25
R8A77240D500BG2
H337S3959
TMS320C6655CZH
W631GG6KB-12
TPS65262RHB
LM10011SD
TPS51200DRC
RTL8152B-VB-CG
USB2512B-AEZG-TR
RTL8304E-CG
BD9328EFJ
XC3S50A-4FTG256C
TPS2557DRB
R1290K103A
BD81A04EFV-M
BD9328EFJ
BD9328EFJ
Remarks
As the Jog FL is integrated with the FL Holder (DNF1735) with the aid of two
pieces of double-back tape (Z12-016), first remove the integrated Jog FL and
FL Holder, attach a new Jog FL and an FL Holder, using two pieces of
double-back tape, then mount them together.
3
4
Remarks
BGA package
BGA package
USON package
(UltraSmallOutlineNon-lead)
BGA package
BGA package
IC with heat-pad
IC with heat-pad
IC with heat-pad
IC with heat-pad
IC with heat-pad
IC with heat-pad
IC with heat-pad
BGA package
QFN package
QFN package
IC with heat-pad
IC with heat-pad
IC with heat-pad
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