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MEX-M72BT/N5300BT/N7300BD
Ver. 1.1
NOTES ON CHIP COMPONENT REPLACEMENT
•
Never reuse a disconnected chip component.
•
Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
FLEXIBLE CIRCUIT BOARD REPAIRING
•
Keep the temperature of soldering iron around 270 °C during
repairing.
•
Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
•
Be careful not to apply force on the conductor when soldering or
unsoldering.
CAUTION
Use of controls or adjustments or performance of procedures other
than those specifi ed herein may result in hazardous radiation ex-
posure.
• MEX-M72BT/N5300BT: US, CND
CAUTION
The use of optical instruments with this
product will increase eye hazard.
• MEX-N5300BT: EA
This label is located on bottom surface of
the product.
This product is classified Class 1 Laser
product by IEC60825-1:2007 and
IEC60825-1:2014.
SAFETY-RELATED COMPONENT WARNING!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE
PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE 0 SUR
LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES
PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONC-
TIONNEMENT. NE REMPLACER CES COMPOSANTS QUE
PAR DES PIÈCES SONY DONT LES NUMÉROS SONT DON-
NÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS
PUBLIÉS PAR SONY.
4
TABLE OF CONTENTS
1.
2.
..................................................................... 24
3.
3-1. Disassembly Flow .............................................................. 34
3-2. Cover Sheet (MEX-M72BT) ............................................. 35
3-3. Mini Fuse (Blade Type), Sub Panel Assy .......................... 35
3-4. Chassis Top/Cover Bottom Block-1 .................................. 36
3-5. Chassis Top/Cover Bottom Block-2 .................................. 37
3-6. CD Mechanism Deck ......................................................... 38
3-7. MAIN Board ...................................................................... 39
3-8. Service Position ................................................................. 40
4.
............................................................... 41
5.
6.
6-1. Block Diagram - MAIN Section - ...................................... 44
- AMP/PANEL/POWER SUPPLY Section - ..................... 45
6-3. Printed Wiring Board - MAIN Section (1/2) - ................... 47
6-4. Printed Wiring Boards - MAIN Section (2/2) - ................. 48
6-5. Schematic Diagram - MAIN Section (1/5) - ...................... 49
6-6. Schematic Diagram - MAIN Section (2/5) - ...................... 50
6-7. Schematic Diagram - MAIN Section (3/5) - ...................... 51
6-8. Schematic Diagram - MAIN Section (4/5) - ...................... 52
- MAIN Section (5/5) (MEX-N7300BD) - ........................ 53
7.
7-1. Front Panel Section ............................................................ 65
7-2. Chassis Top Section ........................................................... 66
7-3. Cover Bottom Section ........................................................ 67
8.
9.
.......................................................... 76
Sony CONFIDENTIAL
For Authorized Servicer
................................................
............................................ 42
................................. 68
5
SYS SET
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