Equipotential Bonding - Siemens SIMATIC IFP1200 V2 Product Information

Installing and connecting the device
3.4 Connecting the device
Connecting the cables
NOTICE
Observe local installation regulations
Observe the local installation regulations and the local installation conditions, such as
protective wiring for power supply lines, when connecting the cables.
Short-circuit and overload protection
Different measures for short-circuit and overload protection are required when setting up an
entire plant. The type of components and the level of obligation for the protective measures
depends on the regulation that applies to your plant installation.
• When connecting the cables, make sure that you do not bend the contact pins.
• Secure each cable connector with a cable tie.
• Provide adequate strain relief for all connecting cables.
• The pin assignment of the ports is described in the technical specifications.
3.4.2

Equipotential bonding

Differences in electrical potential
Differences in electrical potential can develop between spatially separate plant components.
Such electrical potential differences can lead to high equalizing currents across the data
cables and therefore to the destruction of their interfaces. Equalizing currents can develop if
the cable shielding is terminated at both ends and grounded to different plant parts.
Differences in potential may develop when a system is connected to different mains supplies.
General requirements for equipotential bonding
Differences in potential must be reduced by means of equipotential bonding in order to
ensure trouble-free operation of the relevant components of the electronic system. The
following must therefore be observed when installing the equipotential bonding circuit:
• The effectiveness of equipotential bonding increases as the impedance of the
equipotential bonding conductor decreases or as its cross-section increases.
• If two plant components are interconnected by means of shielded data cables and their
shielding is bonded at both ends to the grounding/protective conductor, the impedance of
the additionally installed equipotential bonding cable must not exceed 10 % of the
shielding impedance.
• The cross-section of an equipotential bonding conductor must be capable of handling the
maximum equalizing current. Equipotential bonding cables are required between two
control cabinets with a minimum conductor cross-section of 16 mm².
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IFP V2 built-in devices and Transceiver Unit UL hazardous information
Product Information, 12/2023, A5E53493649-AA