Preparing The Mounting Cutout - Siemens SIMATIC IFP1200 V2 Product Information

Note
Ensure that the permitted ambient temperature is not exceeded when mounting the device
in a cabinet and especially in a closed enclosure.
3.1.2.3

Preparing the mounting cutout

Note
Stability of the mounting cutout
The material in the area of the mounting cutout must be sturdy enough to ensure permanent
safe mounting of the device.
To achieve the degrees of protection described below, it must be ensured that deformation of
the material cannot occur due to the force of the mounting clips or operation of the device.
Degrees of protection
The various degrees of protection of the device can only be guaranteed if the following
requirements are met:
• To achieve the degree of protection specified in the technical specifications: Material
thickness at the mounting cutout: 2 mm to 6 mm
• Permitted deviation from plane at the mounting cutout: ≤ 0.5 mm
This condition must also be met for the installed device.
• Permitted surface roughness in the area of the seal: ≤ 120 µm (R
IFP V2 built-in devices and Transceiver Unit UL hazardous information
Product Information, 12/2023, A5E53493649-AA
Installing and connecting the device
3.1 Preparing for installation
120)
z
13