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IC DESCRIPTION
THERAML DATA
Symbol
R
th j-amb
R
th j-case
ELECTRICAL CHARACTERISTICS
Symbol
V
Supply Voltage Range
s
I
Quiescent Current
s
I
Stand-By Current
sb
V
Quiescent Output Voltage
o
A
voltage Gain
v
R
Input Impedance
IN
P
Output Power
o
THD
Distortion
SVR
Supply Voltage Rejection
E
Input Noise Voltage
I
Vsb
Stand-By Enable Voltage
Figure1. Application Circuit
APPLICATION HINTS :
For 14.5V supply and 8‰ speaker application, its maximum power dissipation is about 1.8W.
Assumming that max ambient temperature is 70...C, the required thermal resistance of the device mounted on the PCB
with a dissipating area must be equal to : (150-70)/1.8 = 44.4...C/W.
Junction to pin thermal resistance of the package is about 15...C/W. That means external heat sink of about 30...C C/W is
required.
Cu ground plane of PCB can be used as heat dissipating means.
Parameter
Thermal Rasistance junction to ambient
Thermal Resistance Junction to case
(Tamb = 25...C; Vs = 14.5V; RL=8‰; f=1KHz; nuless otherwise specified.)
Parameter
Test concition
Pin 3 shorted to GND
THD = 10%
Po = 1W
V
= 150mVrms;
ripple
F
= 1KHz
ripple
Rg = 10K‰; BW = 20Hz to 20KHz
16
16 16
Value
unit
70
... C / W
15
... C / W
Min.
Typ.
Max.
5
23
0.3
7.5
31
50
100
2.7
3
0.1
0.3
50
5
APPENDIX
Unit
18
V
35
mA
mA
V
33
dB
K ‰
W
%
dB
10
V
1
V
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