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WM-W800
SERVICING NOTES
Replacing chip components
All chip components should be connected and disconnect¬
ed, using a tapered soldering iron [temperature of the iron
tip: less than 280°C (536°F)], a pair of tweezers and braid¬
ed wire.
Precautions for replacement
1. Do not disconnect the chip component forcefully.
Otherwise, the pattern may peel off.
2. Never re-use a disconnected chip component. Dispose of
all old chip components.
3. To protect the chip component, heating time for attach¬
ing the component should be within 3 seconds.
o Removing chip components
(1) Removing solder at electrode
Remove the solder at the electrode, using a thin
braided wire. Do not remove the solder of the part
(chip component) attached adjacent to the electrode.
(2) Disconnecting chip components
Turn the tweezers with the soldering iron alternately
applied to both electrodes, and the chip component
will be disconnected. Take careful precautions while
disconnecting, because if the chip component is force¬
fully removed the land may peel off.
Never re-use a disconnected chip component.
(3) Smoothing the soldered surface
After disconnecting the chip component, remove the
solder by using a braided wire to smooth the land
surface.
o Connecting chip components
The value of chip components is not displayed on the
main body. Take due precautions to avoid mixing new
chip components with other ones.
(1) Applying solder to land on one side
Apply a thin layer of solder to the land on one side
where the chip component is to be connected. Too
much solder may cause bridging.
Small quantity of solder
(2) Speedy soldering
Hold the chip component at the desired position,
using tweezers, and apply the soldering iron in the
arrow-marked direction. To protect the chip compo¬
nent, heating time should be within 3 seconds.
(3) Speedy soldering of electrode on the other side
Solder the electrode on the other side in the same
way as in (2) above.
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