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Panasonic KX-TCD455GM Service Manual page 87

Digital cordless phone metalic gray version (for germany)

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Address
Default
1F07
46
1F08
46
1F1C
16
1F1D
59
30. HOW TO REPLACE FLAT PACKAGE IC
30.1. Preparation
- PbF (: Pb free) Solder
- Soldering Iron
Tip Temperature of 700°F ± 20°F (370°C ± 10°C)
Note: We recommend a 30 to 40 Watt soldering iron. An expert
may be able to use a 60 to 80 Watt iron where someone with less
experience could overheat and damage the PCB foil.
- Flux
Recommended Flux: Specific Gravity
Type
RMA (lower residue, non-cleaning type)
Note: See
ABOUT LEAD FREE SOLDER (PbF: Pb free)
30.2. Procedure
1. Tack the flat pack IC to the PCB by temporarily soldering two
diagonally opposite pins in the correct positions on the PCB.
Name
ReceiveGainLowOffset x
ReceiveGainHighOffset x
GX-index
GX-index
Type
Country
Setting
D
Bit7 - AOG
Bit6 - AOG2
Bit5 - bit0: Gain-receive for volumestep
offset to volumestep 2 (GR-Index)
ranging from 0x00 to 0x24, each step
representing 1 dB)
D
Bit7 - AOG
Bit6 - AOG2
Bit5 - bit0: Gain-receive for volumestep
offset to volumestep 2 (GR-Index)
ranging from 0x00 to 0x24, each step
representing 1 dB)
A
17
Gain-transmit (values ranging from
0x24, each step representing 1 dB).
index represent volumestep 2. See
x
A
Bit7 - AOG
Bit6 - AOG2
Gain-receive (values ranging from
0x24, each step representing 1 dB).
index represent volumestep 2. See
0.82.
().
87
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