Samsung AM080 XV Series Service Manual page 12

Changes in comparison to basic mode (cont.)
 AM140/160/180/200/220/240/260/280/300KXVSSS
AAM100/120/180/200MXVAFC
AM160/180/260/280/300MXVAGC
Changed
part
Change Main PCB
Main PCB
- Increase MICOM capability
Applies 600V IPM by LC
FAN PCB
resonance buck-converter
- Increases current due to
Inverter PCB
high capacity compressor
(Compressor
- Increases capacitor's capacity
Control
- Applies EMI coil on board
PCB)
(Deletes core in wire)
- Develops 50A EMI PBA
→ Increases coil size and
EMI PCB
fuse capacity
- Improves EMI characteristic.
- Increases current due to
high capacity compressor
REACTOR
- Improved wire connection terminal
- Increases heat cooling capacity
Refrigerant
- Increases pipe size and heat
cooling
exchange area
Samsung Electronics
Changed item
and feature
Basic
Product Specifications
After changed
2-5