Product Specifications - Gigabyte H262-NO1 User Manual

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Product Specifications

NOTE:
We reserve the right to make any changes to the product specifications and product-related
information without prior notice.
CPU
Socket
Chipset
Memory
LAN
Video
Hardware Installation
3rd Generation Intel® Xeon® Scalable Processors
Š
Intel® Xeon® Platinum Processor, Intel® Xeon® Gold Processor, Intel® Xeon®
Š
Silver Processor
10nm technology, CPU TDP up to 270W
Š
NOTE: If only 1 CPU is installed, some PCIe or memory functions might be unavailable
Per Node:
2 x LGA 4189
Š
Total:
8 x LGA 4189
Š
Socket P+
Š
Intel® C621A Express Chipset
Š
Per Node:
16 x DIMM slots
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Total:
64 x DIMM slots
Š
DDR4 memory supported only
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8-channel memory architecture
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RDIMM modules up to 128GB supported
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LRDIMM modules up to 128GB supported
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3DS RDIMM/LRDIMM modules up to 256GB supported
Š
1.2V modules: 3200/2933/2666 MHz
Š
Per Node:
1 x Dedicated management port
Š
Total:
4 x Dedicated management port
Š
*CMC: Chassis Management Controller, to monitor all status of computing nodes
Integrated in Aspeed® AST2600
Š
2D Video Graphic Adapter with PCIe bus interface
Š
1920x1200@60Hz 32bpp, DDR4 SDRAM
Š
Management chip on CMC board:
Š
Integrated in Aspeed® AST2520A2-GP
Š
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