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1-2 Product Specifications
NOTE:
We reserve the right to make any changes to the product specifications and product-related
information without prior notice.
CPU
Socket
Chipset
Memory
Secur i t y
Ser ver
Socket
Oper ating P
Secur i t y
Ser ver
Oper ating P
r oper t i es
Power Suppl y
Hardware Installation
2nd Generation Intel® Xeon® Scalable and Intel® Xeon® Scalable Processors
Š
Intel® Xeon® Platinum Processor, Intel® Xeon® Gold Processor, Intel® Xeon®
Š
Silver Processor and Intel® Xeon® Bronze Processor
CPU TDP up to 165W
Š
NOTE:
If only 1 CPU is installed, some PCIe or memory functions might be unavailable
Š
Secur i t y
Ser ver
Socket
Oper ating P
r oper t i es
This device does not support Intel Omni-Path function
Š
Per node:
Power Suppl y
2 x LGA 3647
Š
Total:
Š 8 x LGA 3647
Š Socket P
Intel® C621 Express Chipset
Š
Socket
Secur i t y
Ser ver
Oper ating P
r oper t i es
Per node:
16 x DIMM slots
Power Suppl y
Š
Total:
Š 64 x DIMM slots
r oper t i es
Š DDR4 memory supported only
Š 6-channel memory architecture
Power Suppl y
Š RDIMM modules up to 64GB supported
Š LRDIMM modules up to 128GB supported
Š Supports Intel® Optane™ DC Persistent Memory (DCPMM)
Š 1.2V modules: 2933/2666/2400/2133 MHz
Maximum verified DCPMM configuration:
Ambient temperature 35°C
Š
2nd Generation Intel® Xeon® Scalable processor 165W (Max.)
Š
DCPMM 256GB x2 pcs (Per Node)
Š
DCPMM installation locations:
DIMM_P1_( G1, J1)
NOTE:
1.
2933MHz for 2nd Generation Intel® Xeon® Scalable Processors only
2.
Intel® Optane™ DC Persistent Memory for 2nd Generation Intel® Xeon®
Scalable Processors only
3.
The maximum number of DCPMM that can be installed is based on a maximum
operating (ambient) temperature of 35°C
4.
To enquire about installing a greater number of DCPMM, please consult with
your GIGABYTE technical or sales representative
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