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Item Description
Components, parts and materials containing
refractory ceramic fibers
Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Torx
Phillips
Hex
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Remove top cover and rear cages/PCIe Risers including associated cabling
2. Remove Front Cage Cable Management components
3. Disconnect all cables from the motherboard
4. Remove Fan Bracket (Wondermiddel) (see chassis image below)
5. Remove the Hex screws from the Video port on motherboard and screws that lock the board to the chassis.
6. Pull the motherboard back (towards the front of the chassis) and then up to take it remove
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
image from the PSU (Internal) 1600W AC
MF877-00
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at
Notes
Tool Size (if
applicable)
T10, T15, T30
50mm
4.5mm
MF877-01
Quantity
of items
included
in product
0
0
Page 2
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