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PV-D300 / VM-D100 / PV-L550 / PV-L600 / PV-L650 / VM-L450
5.1.12. REPLACEMENT PROCEDURE FOR
LEADLESS (CHIP) COMPONENT
The
following
procedures
replacement of the leadless components used in this Unit.
1. Preparation for replacement
a. Soldering Iron
Use a pencil-type soldering iron using less than 30
watts.
b. Solder
Eutectic Solder (Tin 63%, Lead 37%) is recommended.
c. Soldering time
Do not apply heat for more than 4 seconds.
d. Preheating
Leadless
capacitor
installation.
(130°C ~ 150°C, for about 2 minutes.)
Note:
a. Leadless component must not be reused after removal.
b. Excessive mechanical stress and rubbing of the
component electrode must be avoided.
2. Removing the leadless component
Grasp the leadless component body with tweezers and
alternately apply heat to both electrodes. When the solder
on both electrodes is melted, remove leadless component
with a twisting motion.
Note:
a. Do not attempt to lift the component off the board until
the component is completely disconnected from the
board by a twisting action. The leadless component is
attached to the PCB with glue. So carefully twist the
component when removing it so as not to break or
damage any fail under the component.
b. Take care not to break the copper foil on the printed
board.
3. Installation of the leadless component
a. Presolder the contact points of the circuit board.
are
recommended
for
must
be
preheated
Fig. 6-1
the
b. Press the part downward with tweezers and solder both
electrodes as shown below.
before
Note:
Do not glue the replacement leadless component to the
circuit board.
5.1.13. SPECIAL NOTE
All integrated circuits and many other semiconductor devices
are electrostatically sensitive and therefore require the special
handlings
techniques
"ELECTROSTATICALLY SENSITIVE (ES) DEVICES" section
of this service manual.
5.1.14. MODEL NO. IDENTIFICATION
MARK
Use Marks shown in the chart below to distinguish the different
models included in this Service Manual.
24
Fig. 6-2
Fig. 6-3
described
under
the
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