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General Description
The CYBLE-2X20XX-X1 is a Bluetooth
wireless module solution. The CYBLE-2X20XX-X1 is a turnkey
solution and includes onboard crystal oscillators, passive
components, and the Cypress PRoC™ BLE. Refer to the
CYBL1XX7X
datasheet
for additional details on the capabilities
of the PRoC BLE device used on this module.
The CYBLE-2X20XX-X1 supports a number of peripheral
functions
(ADC,
timers,
communication protocols (I
programmable architecture. The CYBLE-2X20XX-X1 includes a
royalty-free BLE stack compatible with Bluetooth 4.2 and
provides up to 19 GPIOs in a 15.0 × 23.0 × 2.0 mm package.
The CYBLE-2X20XX-X1 is offered in two fully certified versions
(CYBLE-212006-01 and CYBLE-202007-01), as well as an
uncertified version (CYBLE-202013-11). The CYBLE-212006-01
includes an integrated trace antenna. The CYBLE-202007-01
supports an external antenna via a u-FL connector. The
CYBLE-202013-11 supports an external antenna through a RF
solder pad output. The CYBLE-202013-11 does not include a RF
shield and is not Bluetooth SIG or regulatory certified.
Module Description
■
Module size: 15.00 mm × 23.00 mm × 2.00 mm
■
Extended Range:
❐
Up to 400 meters bidirectional communication
❐
Up to 450 meters in beacon only mode
■
Bluetooth 4.2 qualified single-mode module
❐
QDID:
88957
❐
Declaration ID:
D032786
■
Footprint compatible options for integrated antenna or
antenna-less design options
■
Certified to FCC, IC, MIC, KC, and CE regulations
(CYBLE-212006-01 and CYBLE-202007-01 only)
■
Castelated solder pad connections for ease-of-use
■
256-KB flash memory, 32-KB SRAM memory
■
Up to 19 GPIOs
■
Industrial temperature range: –40 °C to +85 °C
■
32-bit processor (0.9 DMIPS/MHz) operating up to 48 MHz
■
Watchdog timer with dedicated internal low-speed oscillator
Power Consumption
■
Maximum TX output power: +7.5 dbm
■
RX Receive Sensitivity: –93 dbm
■
Received signal strength indicator (RSSI) with 1-dB resolution
Notes
1. Connection range tested module-to-module in full line-of-sight environment, free of obstacles or interference sources with output power of +7.5 dBm.
2. Specified as EZ-BLE XR module to module range. Mobile phone connection range will decrease based on the PA/LNA performance of the mobile phone used.
Cypress Semiconductor Corporation
Document Number: 002-15631 Rev.*B
PRELIMINARY
Low Energy (BLE)
counters,
PWM)
and
2
C, UART, SPI) through its
[1,2]
[1]
•
198 Champion Court
EZ-BLE™ PRoC™ XR Module
■
TX current consumption
❐
BLE silicon: 15.6 mA (radio only, 0 dbm)
❐
RFX2401C: 27 mA (PA/LNA only, +7.5 dBm)
■
RX current consumption
❐
BLE silicon: 16.4 mA (radio only, 0 dbm)
❐
RFX2401C: 8.0 mA (PA/LNA only)
■
Cypress CYBL1XX7X silicon low power mode support
❐
Deep Sleep: 1.3
serial
❐
Hibernate: 150 nA with SRAM retention
❐
Stop: 60 nA with XRES wakeup
Functional Capabilities
■
Up to 18 capacitive sensors for buttons or sliders
■
12-bit, 1-Msps SAR ADC with internal reference,
sample-and-hold (S/H), and channel sequencer
■
Two serial communication blocks (SCBs) supporting I
(master/slave), SPI (master/slave), or UART
■
Four dedicated 16-bit timer, counter, or PWM blocks
(TCPWMs)
■
LCD drive supported on all GPIOs (common or segment)
■
Programmable low voltage detect (LVD) from 1.8 V to 4.5 V
2
■
I
S master interface
■
BLE protocol stack supporting generic access profile (GAP)
Central, Peripheral, Observer, or Broadcaster roles
■
Switches between Central and Peripheral roles on-the-go
■
Standard BLE profiles and services for interoperability
■
Custom profile and service for specific use cases
Benefits
CYBLE-2X20XX-X1 is provided as a turnkey solution, including
all necessary hardware required to use BLE communication
standards.
■
Proven hardware design ready to use
■
Cost optimized for applications without space constraint
■
Reprogrammable architecture
■
Fully certified module eliminates the time needed for design,
development and certification
■
Bluetooth SIG qualified with QDID and Declaration ID
■
Flexible communication protocol support
■
PSoC Creator™ provides an easy-to-use integrated design
environment (IDE) to configure, develop, program, and test a
BLE application
•
San Jose
CYBLE-212006-01
CYBLE-202007-01
CYBLE-202013-11
A with watch crystal oscillator (WCO) on
,
CA 95134-1709
•
Revised December 16, 2016
2
C
408-943-2600
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Related Manuals for Cypress EZ-BLE PRoC XR Module
Summary of Contents for Cypress EZ-BLE PRoC XR Module
- Page 1 ■ RX current consumption solution and includes onboard crystal oscillators, passive ❐ BLE silicon: 16.4 mA (radio only, 0 dbm) components, and the Cypress PRoC™ BLE. Refer to the CYBL1XX7X datasheet for additional details on the capabilities ❐ RFX2401C: 8.0 mA (PA/LNA only) of the PRoC BLE device used on this module.
- Page 2 ■ PRoC BLE Silicon Datasheet BLE-212006-EVAL/CYBLE-202007-EVAL/CY- ■ Application notes: Cypress offers a number of BLE application BLE-202013-EVAL) and the BLE Pioneer Kit (CY8CKIT-042-BLE) notes covering a broad range of topics, from basic to advanced level. Recommended application notes for getting started with ❐...
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Page 3: Table Of Contents
Serial Communication ..........23 Worldwide Sales and Design Support....... 39 Memory ..............24 Products ..............39 System Resources ............ 24 PSoC® Solutions ............39 Cypress Developer Community......... 39 Technical Support ............. 39 Document Number: 002-15631 Rev.*B Page 3 of 39... -
Page 4: Overview
Module Dimensions and Drawing Cypress reserves the right to select components (including the appropriate BLE device) from various vendors to achieve the BLE module functionality. Such selections will still guarantee that all height restrictions of the component area are maintained. Designs... - Page 5 CYBLE-212006-01 CYBLE-202007-01 PRELIMINARY CYBLE-202013-11 Figure 1. Module Mechanical Drawing Side View Top View Bottom View Note 3. No metal or traces should be located beneath or above the antenna area. Only bare PCB material should be located beneath the antenna area. For more information on recommended host PCB layout, see Figure Figure...
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Page 6: Pad Connection Interface
To maximize RF performance, the host layout should follow these recommendations: 1. The ideal placement of the Cypress BLE module is in a corner of the host board with the trace antenna located at the far corner. This placement minimizes the additional recommended keep out area stated in item 2. Please refer to... -
Page 7: Recommended Host Pcb Layout
CYBLE-212006-01 CYBLE-202007-01 PRELIMINARY CYBLE-202013-11 Recommended Host PCB Layout Figure Figure Figure 6, and Table 3 provide details that can be used for the recommended host PCB layout pattern for the CYBLE-212006-01. Dimensions are in millimeters unless otherwise noted. Pad length of 1.27 mm (0.635 mm from center of the pad on either side) shown in Figure 6 is the minimum recommended host pad length. - Page 8 CYBLE-212006-01 CYBLE-202007-01 PRELIMINARY CYBLE-202013-11 Table 3 provides the center location for each solder pad on the CYBLE-2X20XX-X1. All dimensions are referenced to the center of the solder pad. Refer to Figure 6 for the location of each module solder pad. Table 3.
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Page 9: Digital And Analog Capabilities And Connections
6. When using the capacitive sensing functionality, Pad 3 (P4.0) must be connected to a C capacitor (located off of Cypress BLE Module). The value of this capacitor is 2.2 nF and should be placed as close to the module as possible. -
Page 10: Power Supply Connections And Recommended External Components
CYBLE-212006-01 CYBLE-202007-01 PRELIMINARY CYBLE-202013-11 Power Supply Connections and Recommended External Components Power Connections External Component Recommendation The CYBLE-2X20XX-X1 contains two power supply connec- In either connection scenario, it is recommended to place an tions, VDD and VDDR. The VDD connection supplies power for external ferrite bead between the supply and the module both digital and analog device operation. - Page 11 CYBLE-212006-01 CYBLE-202007-01 PRELIMINARY CYBLE-202013-11 Figure 8. Recommended Host Schematic for an Independent Supply Option Independent Power Supply Option (Seen from Bottom) Document Number: 002-15631 Rev.*B Page 11 of 39...
- Page 12 CYBLE-212006-01 CYBLE-202007-01 PRELIMINARY CYBLE-202013-11 The CYBLE-2X20XX-X1 schematic is shown in Figure Figure 9. CYBLE-2X20XX-X1 Schematic Diagram Document Number: 002-15631 Rev.*B Page 12 of 39...
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Page 13: Critical Components List
CYBLE-212006-01 CYBLE-202007-01 PRELIMINARY CYBLE-202013-11 Critical Components List Table 5 details the critical components used in the CYBLE-2X20XX-X1 module. Table 5. Critical Component List Component Reference Designator Description Silicon 56-pin QFN Programmable Radio-on-Chip (PRoC) with BLE Crystal 24.000 MHz, 12PF Crystal 32.768 kHz, 12.5PF Antenna Design Table 6... -
Page 14: Enabling Extended Range Feature
Low-Power Operation The CYBLE-2X20XX-X1 module is already optimized for low power operation when in high output power, high gain mode. The Cypress BLE Link Layer will automatically enable TX high power operation, as well as RX high gain operation. When the radio TX or RX operation is not in use (i.e. -
Page 15: Electrical Specification
CYBLE-212006-01 CYBLE-202007-01 PRELIMINARY CYBLE-202013-11 Electrical Specification Table 10 details the absolute maximum electrical characteristics for the Cypress BLE module. Table 10. CYBLE-2X20XX-X1 Absolute Maximum Ratings Parameter Description Units Details/Conditions Analog, digital, or radio supply relative to V –0.5 – Absolute maximum... - Page 16 CYBLE-212006-01 CYBLE-202007-01 PRELIMINARY CYBLE-202013-11 Table 12. CYBLE-2X20XX-X1 DC Specifications (continued) Parameter Description Units Details/Conditions T = 25 °C, Execute from flash; CPU at 24 MHz – – = 3.3 V Execute from flash; CPU at 24 MHz – – – T = –40 °C to 85 °C DD10 T = 25 °C,...
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Page 17: Gpio
CYBLE-212006-01 CYBLE-202007-01 PRELIMINARY CYBLE-202013-11 Table 13. AC Specifications Parameter Description Units Details/Conditions 1.71 V V 5.5 V CPU frequency – Wakeup from Sleep mode – – Guaranteed by characterization SLEEP 24-MHz IMO. Guaranteed by Wakeup from Deep-Sleep mode –... -
Page 18: Xres
CYBLE-212006-01 CYBLE-202007-01 PRELIMINARY CYBLE-202013-11 Table 15. GPIO AC Specifications Parameter Description Units Details/Conditions Rise time in Fast-Strong mode – 3.3-V V = 25 pF RISEF LOAD Fall time in Fast-Strong mode – 3.3-V V = 25 pF FALLF LOAD Rise time in Slow-Strong mode –... - Page 19 CYBLE-212006-01 CYBLE-202007-01 PRELIMINARY CYBLE-202013-11 Table 19. XRES AC Specifications Parameter Description Units Details/Conditions Reset pulse width – – – RESETWIDTH Temperature Sensor Table 20. Temperature Sensor Specifications Parameter Description Units Details/Conditions Temperature-sensor accuracy –5 ±1 °C –40 °C to +85 °C SENSACC SAR ADC Table 21.
- Page 20 CYBLE-212006-01 CYBLE-202007-01 PRELIMINARY CYBLE-202013-11 Table 22. SAR ADC AC Specifications (continued) Parameter Description Units Details/Conditions Integral nonlinearity. V = 1.71 V to 5.5 V, A_INL –1.5 – = 1 V to V 500 ksps Differential nonlinearity. V = 1.71 V to 5.5 V, A_dnl –1 –...
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Page 21: Digital Peripherals
CYBLE-212006-01 CYBLE-202007-01 PRELIMINARY CYBLE-202013-11 Digital Peripherals Timer Table 23. Timer DC Specifications Parameter Description Units Details/Conditions Block current consumption at 3 MHz – – 16-bit timer TIM1 Block current consumption at 12 MHz – – 16-bit timer TIM2 ... - Page 22 CYBLE-212006-01 CYBLE-202007-01 PRELIMINARY CYBLE-202013-11 Pulse Width Modulation (PWM) Table 27. PWM DC Specifications Parameter Description Units Details/Conditions Block current consumption at 3 MHz – – 16-bit PWM PWM1 Block current consumption at 12 MHz – – 16-bit PWM PWM2 ...
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Page 23: Serial Communication
CYBLE-212006-01 CYBLE-202007-01 PRELIMINARY CYBLE-202013-11 Serial Communication Table 31. Fixed I C DC Specifications Parameter Description Units Details/Conditions Block current consumption at 100 kHz – – – I2C1 Block current consumption at 400 kHz – – – I2C2 Block current consumption at 1 Mbps –... -
Page 24: Memory
CYBLE-212006-01 CYBLE-202007-01 PRELIMINARY CYBLE-202013-11 Memory Table 39. Flash DC Specifications Parameter Description Units Details/Conditions Erase and program voltage 1.71 – – Number of Wait states at 32–48 MHz – – CPU execution from flash WS48 Number of Wait states at 16–32 MHz –... - Page 25 CYBLE-212006-01 CYBLE-202007-01 PRELIMINARY CYBLE-202013-11 Voltage Monitors (LVD) Table 45. Voltage Monitor DC Specifications Parameter Description Units Details/Conditions LVI_A/D_SEL[3:0] = 0000b 1.71 1.75 1.79 – LVI1 LVI_A/D_SEL[3:0] = 0001b 1.76 1.80 1.85 – LVI2 LVI_A/D_SEL[3:0] = 0010b 1.85 1.90 1.95 – LVI3 LVI_A/D_SEL[3:0] = 0011b 1.95...
- Page 26 CYBLE-212006-01 CYBLE-202007-01 PRELIMINARY CYBLE-202013-11 Internal Main Oscillator Table 48. IMO DC Specifications Parameter Description Units Details/Conditions IMO operating current at 48 MHz – – 1000 – IMO1 IMO operating current at 24 MHz – – – IMO2 IMO operating current at 12 MHz –...
- Page 27 CYBLE-212006-01 CYBLE-202007-01 PRELIMINARY CYBLE-202013-11 Table 53. BLE Subsystem (continued) Parameter Description Units Details/Conditions Adjacent channel interference RF-PHY Specification Wanted signal at –67 dBm and Inter- – (RCV-LE/CA/03/C) ferer at FRX ±1 MHz Adjacent channel interference RF-PHY Specification Wanted signal at –67 dBm and Inter- –...
- Page 28 CYBLE-212006-01 CYBLE-202007-01 PRELIMINARY CYBLE-202013-11 Table 53. BLE Subsystem (continued) Parameter Description Units Details/Conditions Average frequency deviation for RF-PHY Specification F1AVG 11110000 pattern (TRM-LE/CA/05/C) RF-PHY Specification Eye opening = F2AVG/F1AVG – – (TRM-LE/CA/05/C) RF-PHY Specification FTX, ACC Frequency accuracy –150 – (TRM-LE/CA/06/C) RF-PHY Specification FTX, MAXDR...
- Page 29 CYBLE-212006-01 CYBLE-202007-01 PRELIMINARY CYBLE-202013-11 Table 53. BLE Subsystem (continued) Parameter Description Units Details/Conditions Module TXP: +7.5 dBm; Iavg_1sec, Average current at 1-second BLE ±20-ppm master and slave – – 7.5dBm connection interval clock accuracy. For empty PDU exchange Module TXP: +7.5 dBm; Iavg_4sec, Average current at 4-second BLE ...
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Page 30: Environmental Specifications
Environmental Specifications Environmental Compliance This Cypress BLE module is built in compliance with the Restriction of Hazardous Substances (RoHS) and Halogen Free (HF) directives. The Cypress module and components used to produce this module are RoHS and HF compliant. RF Certification The CYBLE-212006-01 and CYBLE-202007-01 modules will be certified under the following RF certification standards at production release. -
Page 31: Regulatory Information
The Original Equipment Manufacturer (OEM) must ensure that FCC labelling requirements are met. This includes a clearly visible label on the outside of the OEM enclosure specifying the appropriate Cypress Semiconductor FCC identifier for this product as well as the FCC Notice above. The FCC identifier is FCC ID: WAP2006. -
Page 32: Industry Canada (Ic) Certification
The Original Equipment Manufacturer (OEM) must ensure that IC labelling requirements are met. This includes a clearly visible label on the outside of the OEM enclosure specifying the appropriate Cypress Semiconductor IC identifier for this product as well as the IC Notice above. -
Page 33: Mic Japan
CYBLE-212006-01 CYBLE-202007-01 PRELIMINARY CYBLE-202013-11 MIC Japan CYBLE-212006-01 and CYBLE-202007-01 are certified as a module with type certification number 203-JN0599. End products that integrate CYBLE-212006-01 and CYBLE-202007-01 do not need additional MIC Japan certification for the end product. End product can display the certification label of the embedded module. KC Korea CYBLE-212006-01 and CYBLE-202007-01 are certified for use in Korea with certificate number MSIP-CRM-Cyp-2006. -
Page 34: Packaging
CYBLE-212006-01 CYBLE-202007-01 PRELIMINARY CYBLE-202013-11 Packaging Table 55. Solder Reflow Peak Temperature Maximum Time at Peak Module Part Number Package Maximum Peak Temperature No. of Cycles Temperature CYBLE-2X20XX-X1 30-pad SMT 260 °C 30 seconds Table 56. Package Moisture Sensitivity Level (MSL), IPC/JEDEC J-STD-2 Module Part Number Package CYBLE-2X20XX-X1... - Page 35 CYBLE-212006-01 CYBLE-202007-01 PRELIMINARY CYBLE-202013-11 Figure 12 details reel dimensions used for the CYBLE-2X20XX-X1. Figure 12. Reel Dimensions The CYBLE-2X20XX-X1 is designed to be used with pick-and-place equipment in an SMT manufacturing environment. The center-of-mass for the CYBLE-2X20XX-X1 is detailed in Figure Figure 13.
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Page 36: Ordering Information
The part numbers are of the form CYBLE-ABCDEF-GH where the fields are defined as follows. For additional information and a complete list of Cypress Semiconductor BLE products, contact your local Cypress sales representative. To locate the nearest Cypress office, visit our website. -
Page 37: Acronyms
CYBLE-212006-01 CYBLE-202007-01 PRELIMINARY CYBLE-202013-11 Acronyms Document Conventions Table 59. Acronyms Used in this Document Units of Measure Acronym Description Table 60. Units of Measure Bluetooth Low Energy Symbol Unit of Measure Bluetooth °C degree Celsius Bluetooth Special Interest Group kilovolt European Conformity milliamperes Canadian Standards Association... -
Page 38: Document History Page
CYBLE-212006-01 CYBLE-202007-01 PRELIMINARY CYBLE-202013-11 Document History Page Document Title: CYBLE-212006-01, CYBLE-202007-01, CYBLE-202013-11 EZ-BLE™ PRoC™ XR Module Document Number: 002-15631 Orig. of Submission Revision Description of Change Change Date 5446955 10/07/2016 Preliminary datasheet for CYBLE-2X20XX-X1 modules. Updated More Information: Added EZ-Serial™ BLE Firmware Platform section. -
Page 39: Sales, Solutions, And Legal Information
("Unintended Uses"). A critical component is any component of a device or system whose failure to perform can be reasonably expected to cause the failure of the device or system, or to affect its safety or effectiveness. Cypress is not liable, in whole or in part, and you shall and hereby do release Cypress from any claim, damage, or other liability arising from or related to all Unintended Uses of Cypress products.
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