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General Description
The CYBLE-0130XX-00 is a fully integrated Bluetooth
Energy (BLE) wireless module solution. The CYBLE-0130XX-00
includes onboard crystal oscillator, passive components, flash
memory, and the Cypress CYW20737 silicon device. Refer to the
CYW20737 datasheet for additional details on the capabilities of
the silicon device used in this module.
The CYBLE-0130XX-00 supports a number of peripheral
functions (ADC and PWM), as well as UART serial
communication. The CYBLE-0130XX-00 includes a royalty-free
BLE stack compatible with Bluetooth 4.1 in a 14.5 × 19.2 ×
2.25mm package.
The CYBLE-013025-00 includes 128KB of onboard flash
memory and is designed to allow for self-sufficient opperation.
The CYBLE-013030-00 does not contain onboard flash,
providing maximum cost optimization and allowing for hosted
control or application RAM upload, or interface to external flash
on the host board.
The CYBLE-0130XX-00 is fully certified by Bluetooth SIG is
targeted at applications requiring cost optimized BLE wireless
connectivity. The CYBLE-0130XX-00 is footprint compatible
with the CYBLE-x120xx-00 module family.
Module Description
Module size: 14.52 mm × 19.20 mm × 2.25 mm
n
Bluetooth LE 4.1 single-mode module
n
QDID: TBD
p
Declaration ID: TBD
p
Certified to FCC, IC, MIC, and CE regulations
n
Castelated solder pad connections for ease-of-use
n
128-KB flash memory, 60-KB SRAM memory
n
Up to 14 GPIOs configurable as open drain high/low,
n
pull-up/pull-down, HI-Z analog, HI-Z digital, or strong output
Industrial temperature range: –30 °C to +85 °C
n
Cortex-M3 32-bit processor
n
Watchdog timer with dedicated internal low-speed oscillator
n
Supports A4WP wireless charging
n
Supports fRSA encryption/decryption and key exchange
n
mechanisms (up to 4 kbit)
Supports NFC tag-based "tap-to-pair"
n
Supports IR learning with built-in IR modulator
n
Notes
1. CYBLE-0130XX-00 global connections (Power, Ground, XRES, etc) are pad compatible with the CYBLE-x120xx-00 family of modules. Available GPIO and functions
may not be 100% compatible with your design. A review of the pad location and function within your design should be complete to determine if the CYBLE-0130XX-00
is completely pad-compatible to the CYBLE-x120xx-00 modules.
Cypress Semiconductor Corporation
Document Number: 002-xxxxx Rev. **
PRELIMINARY
Power Consumption
Maximum TX output power: +4.0 dbm
n
Low
RX Receive Sensitivity: –94 dbm
n
Received signal strength indicator (RSSI) with 1-dB resolution
n
TX current consumption: 9.1 mA
n
RX current consumption: 9.8 mA
n
Cypress CYW20737 silicon low power mode support
n
p
p
Functional Capabilities
10-bit auxiliary ADC with nine analog channels
n
Serial Communications interface (compatible with Philips
n
slaves)
Four dedicated PWM blocks
n
BLE protocol stack supporting generic access profile (GAP)
n
Central, Peripheral, Observer, or Broadcaster roles
[1]
Programmable output power control
n
Benefits
CYBLE-0130XX-00 provides all necessary components required
to operate BLE communication standards.
Proven hardware design ready to use
n
Cost optimized for applications without space constraints
n
Non-volatile memory for complex application development
n
Over-the-air update capable for in-field updates
n
Bluetooth SIG qualified with QDID and Declaration ID
n
Fully certified module eliminates the time needed for design,
n
development and certification processes
WICED™ SMART provides an easy-to-use integrated design
n
environment (IDE) to configure, develop, and program a BLE
application
198 Champion Court
EZ-BLE™ WICED Module
Sleep: 12 uA typical
Deep Sleep: TBD
,
San Jose
CA 95134-1709
CYBLE-013025-00
CYBLE-013030-00
®
I2C
408-943-2600
Revised April 10, 2017

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Summary of Contents for Cypress EZ-BLE WICED CYBLE-0130 00 Series

  • Page 1 RX Receive Sensitivity: –94 dbm includes onboard crystal oscillator, passive components, flash Received signal strength indicator (RSSI) with 1-dB resolution memory, and the Cypress CYW20737 silicon device. Refer to the CYW20737 datasheet for additional details on the capabilities of TX current consumption: 9.1 mA the silicon device used in this module.
  • Page 2: Table Of Contents

    Digital Demodulator and Bit Synchronizer....20 Products ..............42 Receiver Signal Strength Indicator......20 PSoC® Solutions ............42 Local Oscillator............20 Cypress Developer Community......... 42 Calibration ..............20 Technical Support ............. 42 Internal LDO Regulator ..........20 Peripheral Transport Unit ..........21 Broadcom Serial Communications Interface .....
  • Page 3: Overview

    Module Dimensions and Drawing Cypress reserves the right to select components from various vendors to achieve the Bluetooth module functionality. Such selections will still guarantee that all mechanical specifications and module certifications are maintained. Designs should be held within the...
  • Page 4 CYBLE-013025-00 PRELIMINARY CYBLE-013030-00 Figure 2. Module Mechanical Drawing Side View Top View (See from Top) Bottom View (Seen from Bottom) Notes 2. No metal should be located beneath or above the antenna area. Only bare PCB material should be located beneath the antenna area. For more information on recommended host PCB layout, see “Recommended Host PCB Layout”...
  • Page 5: Pad Connection Interface

    To maximize RF performance, the host layout should follow these recommendations: 1. The ideal placement of the Cypress BLE module is in a corner of the host board with the trace antenna located at the far corner. This placement minimizes the additional recommended keep out area stated in item 2. Please refer to...
  • Page 6: Recommended Host Pcb Layout

    CYBLE-013025-00 PRELIMINARY CYBLE-013030-00 Recommended Host PCB Layout Figure Figure Figure 7, and Table 3 provide details that can be used for the recommended host PCB layout pattern for the CYBLE-0130XX-00. Dimensions are in millimeters unless otherwise noted. Pad length of 1.27 mm (0.635 mm from center of the pad on either side) shown in Figure 7 is the minimum recommended host pad length.
  • Page 7 CYBLE-013025-00 PRELIMINARY CYBLE-013030-00 Table 3 provides the center location for each solder pad on the CYBLE-0130XX-00. All dimensions reference the to the center of the solder pad. Refer to Figure 6 for the location of each module solder pad. Table 3. Module Solder Pad Location Figure 7.
  • Page 8: Module Connections

    CYBLE-013025-00 PRELIMINARY CYBLE-013030-00 Module Connections Table 4 Table 5 detail the solder pad connection definitions and available functions for the pad connections for the CYBLE-013025-00 and CYBLE-013030-00 respectively. Table 4 Table 5 lists the solder pads on the CYBLE-0130XX-00 modules, the silicon device pin, and denotes what functions are available for each solder pad.
  • Page 9 CYBLE-013025-00 PRELIMINARY CYBLE-013030-00 Table 5. CYBLE-013030-00 Solder Pad Connection Definitions Pad Num- Pad Name UART/SPI/I2C GPIO Other Function XRES Power Supply Input (3.30V) GND/NC Ground Can be NC GND/NC Ground Can be NC P11/27 SPI2_MOSI(master/slave) ADC input, QOC, XTALI32K P12/26 SPI2_CS(slave) ADC input, QOC, XTALO32K ADC input, SWDIO, IR_RX...
  • Page 10: Connections And Optional External Components

    CYBLE-013025-00 PRELIMINARY CYBLE-013030-00 Connections and Optional External Components Power Connections (VDD) The CYBLE-0130XX-00 contains one power supply connection, VDD. VDD accepts a supply input range of 2.3V to 3.6 V. Table 14 provides this specification. The maximum power supply ripple for this power connection is 100 mV, as shown in Table External Reset (XRES)
  • Page 11 CYBLE-013025-00 PRELIMINARY CYBLE-013030-00 Figure 8 illustrates the CYBLE-0130XX-00 schematic. Figure 8. CYBLE-0130XX-00 Schematic Diagram Document Number: 002-xxxxx Rev. ** Page 11 of 42...
  • Page 12: Critical Components List

    CYBLE-013025-00 PRELIMINARY CYBLE-013030-00 Critical Components List Table 6 details the critical components used in the CYBLE-0130XX-00 module. Table 6. Critical Component List Component Reference Designator Description Silicon 32-pin QFN BLE Silicon Device - CYW20737r Silicon 8-pin TDF8N, 128KSerial Flash Crystal 24.000 MHz, 12PF Antenna Design Table 7...
  • Page 13: Bluetooth Baseband Core

    CYBLE-013025-00 PRELIMINARY CYBLE-013030-00 Bluetooth Baseband Core The Bluetooth Baseband Core (BBC) implements all of the time-critical functions required for high performance Bluetooth operation. The BBC manages the buffering, segmentation, and data routing for all connections. It also buffers data that passes through it, han- dles data flow control, schedules ACL TX/RX transactions, monitors Bluetooth slot usage, optimally segments and packages data into baseband packets, manages connection status indicators, and composes and decodes HCI packets.
  • Page 14: Infrared Modulator

    Notes 4. Full qualification and use of these profiles may require FW updates from Cypress. Some of these profiles are under development/approval at the Bluetooth SIG and conformity with the final approved version is pending. Contact your local representative for updates and the latest list of profiles.
  • Page 15: Infrared Learning

    CYBLE-013025-00 PRELIMINARY CYBLE-013030-00 Figure 9. Infrared TX Infrared Learning The CYBLE-0130XX-00 includes hardware support for infrared learning. The hardware can detect both modulated and unmodulated signals. For modulated signals, the CYBLE-0130XX-00 can detect carrier frequencies between 10 kHz~500 kHz and the duration that the signal is present or absent.
  • Page 16: Wireless Charging

    PTU reference designs based on the CYBLE-0130XX-00, including bills of material (BOMs), are available through Cypress technical support. Depending on charging power requirements, a Power Management Unit (PMU) such as the BCM8935X may be included in the design. However, most PTUs requiring < 5W will not need a PMU. The references designs leverage ADCs, PWMs, and other internal peripherals to help drive the charging circuitry for energy transfer as well as provide feedback for charging control.
  • Page 17: Adc Port

    CYBLE-013025-00 PRELIMINARY CYBLE-013030-00 ADC Port The CYBLE-0130XX-00 contains a 16-bit ADC (effective number of bits is 10). Additionally: There are 9 analog input channels in the 32-pin package The following GPIOs can be used as ADC inputs: P8/P33 (select only one) P11 on P11/P27 pin P12 on P12/28 pin P13/P28 (select only one)
  • Page 18: Serial Peripheral Interface

    CYBLE-013025-00 PRELIMINARY CYBLE-013030-00 Serial Peripheral Interface The CYBLE-0130XX-00 has two independent SPI interfaces. One is a master-only interface and the other can be either a master or a slave. Each interface has a 16-byte transmit buffer and a 16-byte receive buffer. To support more flexibility for user applications, the CYBLE-0130XX-00 has optional I/O ports that can be configured individually and separately for each functional pin as shown in Table Table...
  • Page 19: Internal Reset

    CYBLE-013025-00 PRELIMINARY CYBLE-013030-00 Internal Reset Figure 11. Internal Reset Timing External Reset (XRES) The CYBLE-0130XX-00 has an integrated power-on reset circuit that completely resets all circuits to a known power-on state. An external active low reset signal, XRES, can be used to put the CYBLE-0130XX-00 in the reset state. The XRES pin has an internal pull-up resistor and, in most applications, it does not require that anything be connected to it.
  • Page 20: Integrated Radio Transceiver

    CYBLE-013025-00 PRELIMINARY CYBLE-013030-00 Integrated Radio Transceiver The CYBLE-0130XX-00 has an integrated radio transceiver that is optimized for 2.4 GHz Bluetooth wireless systems. It has been designed to provide low power, low cost, and robust communications for applications operating in the globally available 2.4 GHz unli- censed ISM band.
  • Page 21: Peripheral Transport Unit

    CYBLE-013025-00 PRELIMINARY CYBLE-013030-00 Peripheral Transport Unit Broadcom Serial Communications Interface The CYBLE-0130XX-00 provides a 2-pin master BSC interface, which can be used to retrieve configuration information from an external EEPROM or to communicate with peripherals such as track-ball or touch-pad modules, and motion tracking ICs used in mouse devices.
  • Page 22: Gpio Port

    CYBLE-013025-00 PRELIMINARY CYBLE-013030-00 Figure 13. 32 kHz Oscillator Block Diagram Table 12. XTAL Oscillator Characteristics Parameter Symbol Conditions Minimum Typical Maximum Unit Output frequency – – 32.768 – oscout Frequency – Crystal dependent – – tolerance Start-up time – – –...
  • Page 23: Pwm

    CYBLE-013025-00 PRELIMINARY CYBLE-013030-00 The CYBLE-0130XX-00 has four PWMs. The PWM module consists of the following: PWM0-3 The following GPIOs can be mapped as PWMs: . P26 . P27 . P14/P28 (Dual bonded, only one of two is available.) . P13 on P13/28 PWM0–3.
  • Page 24: Power Management Unit

    CYBLE-013025-00 PRELIMINARY CYBLE-013030-00 Power Management Unit The Power Management Unit (PMU) provides power management features that can be invoked by software through power management registers or packet-handling in the baseband core. RF Power Management The BBC generates power-down control signals for the transmit path, receive path, PLL, and power amplifier to the 2.4 GHz trans- ceiver, which then processes the power-down functions accordingly.
  • Page 25: Electrical Characteristics

    CYBLE-013025-00 PRELIMINARY CYBLE-013030-00 Electrical Characteristics Table 13 shows the maximum electrical rating for voltages referenced to VDD pin. Table 13. Maximum Electrical Rating Rating Symbol Value Unit – Voltage on input or output pin – – 0.3 to V + 0.3 Operating ambient temperature range Topr –30 to +85...
  • Page 26 CYBLE-013025-00 PRELIMINARY CYBLE-013030-00 1. LSBs are expressed at the 10-bit level. Table 16 shows the specifications for the digital voltage levels. Table 16. Digital Levels Characteristics Symbol Unit Input low voltage – – Input high voltage 0.75 × VDDO – –...
  • Page 27 CYBLE-013025-00 PRELIMINARY CYBLE-013030-00 Table 17 shows the specifications for current consumption. Table 17. Current Consumption Operational Mode Conditions Unit Receive Receiver and baseband are both operating, 100% ON. 10.0 Transmit Transmitter and baseband are both operating, 100% ON. Sleep Internal LPO is in use. 12.0 13.0 µA...
  • Page 28: Rf Specifications

    CYBLE-013025-00 PRELIMINARY CYBLE-013030-00 RF Specifications Table 19. Receiver RF Specifications Parameter Mode and Conditions Unit Receiver Section Frequency range – 2402 – 2480 RX sensitivity (standard) 0.1%BER, 1 Mbps – –94 – RX sensitivity (low current) – –91.5 – Input IP3 –...
  • Page 29 CYBLE-013025-00 PRELIMINARY CYBLE-013030-00 Table 20. Transmitter RF Specifications (continued) Parameter Minimum Typical Maximum Unit 30 MHz to 1 GHz – – –36.0 1 GHz to 12.75 GHz – – –30.0 1.8 GHz to 1.9 GHz – – –47.0 5.15 GHz to 5.3 GHz –...
  • Page 30: Timing And Ac Characteristics

    CYBLE-013025-00 PRELIMINARY CYBLE-013030-00 Timing and AC Characteristics In this section, use the numbers listed in the Reference column of each table to interpret the following timing diagrams. UART Timing Table 21. UART Timing Specifications Reference Characteristics Unit Delay time, UART_CTS_N low to UART_TXD valid –...
  • Page 31: Bsc Interface Timing

    CYBLE-013025-00 PRELIMINARY CYBLE-013030-00 Figure 16. SPI Timing – Mode 0 and 2 Figure 17. SPI Timing – Mode 1 and 3 BSC Interface Timing Table 23. BSC Interface Timing Specifications Reference Characteristics Unit Clock frequency – 1000 START condition setup time –...
  • Page 32 CYBLE-013025-00 PRELIMINARY CYBLE-013030-00 Table 23. BSC Interface Timing Specifications Reference Characteristics Unit Data input setup time – STOP condition setup time – Output valid from clock – Bus free time – 1. As a transmitter, 300 ns of delay is provided to bridge the undefined region of the falling edge of SCL to avoid unintended generation of START or STOP conditions.
  • Page 33: Environmental Specifications

    Environmental Specifications Environmental Compliance This Cypress BLE module is produced in compliance with the Restriction of Hazardous Substances (RoHS) and Halogen-Free (HF) directives. The Cypress module and components used to produce this module are RoHS and HF compliant. RF Certification The CYBLE-0130XX-00 module will be certified under the following RF certification standards at production release.
  • Page 34: Regulatory Information

    The Original Equipment Manufacturer (OEM) must ensure that FCC labelling requirements are met. This includes a clearly visible label on the outside of the OEM enclosure specifying the appropriate Cypress Semiconductor FCC identifier for this product as well as the FCC Notice above. The FCC identifier is FCC ID: WAP3025.
  • Page 35: Industry Canada (Ic) Certification

    The Original Equipment Manufacturer (OEM) must ensure that IC labelling requirements are met. This includes a clearly visible label on the outside of the OEM enclosure specifying the appropriate Cypress Semiconductor IC identifier for this product as well as the IC Notice above.
  • Page 36: Mic Japan

    CYBLE-013025-00 PRELIMINARY CYBLE-013030-00 MIC Japan CYBLE-0130XX-00 is certified as a module with type certification number TBD. End products that integrate CYBLE-013025-00 do not need additional MIC Japan certification for the end product. End product can display the certification label of the embedded module. Document Number: 002-xxxxx Rev.
  • Page 37: Packaging

    CYBLE-013025-00 PRELIMINARY CYBLE-013030-00 Packaging Table 25. Solder Reflow Peak Temperature Module Part Number Package Maximum Peak Temperature Maximum Time at Peak Temperature No. of Cycles CYBLE-0130XX-00 14-pad SMT 260 °C 30 seconds Table 26. Package Moisture Sensitivity Level (MSL), IPC/JEDEC J-STD-2 Module Part Number Package CYBLE-0130XX-00...
  • Page 38 CYBLE-013025-00 PRELIMINARY CYBLE-013030-00 Figure 21 details reel dimensions used for the CYBLE-0130XX-00. Figure 21. Reel Dimensions The CYBLE-0130XX-00 is designed to be used with pick-and-place equipment in an SMT manufacturing environment. The center-of-mass for the CYBLE-0130XX-00 is detailed in Figure Figure 22.
  • Page 39: Ordering Information

    The CYBLE-0130XX-00 is offered in tape and reel packaging. The CYBLE-0130XX-00 ships in a reel size of TBD. For additional information and a complete list of Cypress Semiconductor BLE products, contact your local Cypress sales representative. To locate the nearest Cypress office, visit our website.
  • Page 40: Acronyms

    CYBLE-013025-00 PRELIMINARY CYBLE-013030-00 Acronyms Document Conventions Table 29. Acronyms Used in this Document Units of Measure Acronym Description Table 30. Units of Measure Bluetooth Low Energy Symbol Unit of Measure Bluetooth SIG Bluetooth Special Interest Group °C degree Celsius European Conformity kilovolt Canadian Standards Association milliamperes...
  • Page 41: Document History Page

    CYBLE-013025-00 PRELIMINARY CYBLE-013030-00 Document History Page Document Title: CYBLE-0130XX-00 EZ-BLE™ WICED Module Document Number: 002-XXXXX Orig. of Submission Revision Description of Change Change Date PRELIM- Preliminary datasheet for CYBLE-0130XX-00 module. INARY Document Number: 002-xxxxx Rev. ** Page 41 of 42...
  • Page 42: Sales, Solutions, And Legal Information

    ("Unintended Uses"). A critical component is any component of a device or system whose failure to perform can be reasonably expected to cause the failure of the device or system, or to affect its safety or effectiveness. Cypress is not liable, in whole or in part, and you shall and hereby do release Cypress from any claim, damage, or other liability arising from or related to all Unintended Uses of Cypress products.

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