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General Description
The CYBLE-2X20XX-X1 is a Bluetooth
wireless module solution. The CYBLE-2X20XX-X1 is a turnkey
solution and includes onboard crystal oscillators, passive
components, and the Cypress PRoC™ BLE. Refer to the
CYBL1XX7X
datasheet
for additional details on the capabilities
of the PRoC BLE device used on this module.
The CYBLE-2X20XX-X1 supports a number of peripheral
functions
(ADC,
timers,
communication protocols (I
programmable architecture. The CYBLE-2X20XX-X1 includes a
royalty-free BLE stack compatible with Bluetooth 4.2 and
provides up to 19 GPIOs in a 15.0 × 23.0 × 2.0 mm package.
The CYBLE-2X20XX-X1 is offered in two certified versions
(CYBLE-212006-01 and CYBLE-202007-01), as well as an
uncertified version (CYBLE-202013-11). The CYBLE-212006-01
includes an integrated trace antenna. The CYBLE-202007-01
supports an external antenna via a u-FL connector. The
CYBLE-202013-11 supports an external antenna through a RF
solder pad output. The CYBLE-202013-11 does not include a RF
shield and is not regulatory certified.
Module Description
Module size: 15.00 mm × 23.00 mm × 2.00 mm
Extended Range:
Up to 400 meters bidirectional communication
Up to 450 meters in beacon only mode
Bluetooth 4.2 qualified single-mode module
QDID:
88957
Declaration ID:
D032786
Footprint compatible options for integrated antenna or
antenna-less design options
Certified to FCC, IC, MIC, KC, and CE regulations
(CYBLE-212006-01 and CYBLE-202007-01 only)
Castelated solder pad connections for ease-of-use
256-KB flash memory, 32-KB SRAM memory
Up to 19 GPIOs
Industrial temperature range: –40 °C to +85 °C
32-bit processor (0.9 DMIPS/MHz) operating up to 48 MHz
Watchdog timer with dedicated internal low-speed oscillator
Power Consumption
Maximum TX output power: +7.5 dbm
RX Receive Sensitivity: –93 dbm
Received signal strength indicator (RSSI) with 1-dB resolution
Notes
1. Connection range tested module-to-module in full line-of-sight environment, free of obstacles or interferance sources with output power of +7.5 dBm.
2. Specified as EZ-BLE XR module to module range. Mobile phone connection range will decrease based on the PA/LNA performance of the mobile phone used.
Cypress Semiconductor Corporation
Document Number: 002-15631 Rev.*D
Low Energy (BLE)
counters,
PWM)
and
2
C, UART, SPI) through its
[1,2]
[1]
198 Champion Court
EZ-BLE™ PRoC™ XR Module
TX current consumption
BLE silicon: 15.6 mA (radio only, 0 dbm)
RFX2401C: 27 mA (PA/LNA only, +7.5 dBm)
RX current consumption
BLE silicon: 16.4 mA (radio only, 0 dbm)
RFX2401C: 8.0 mA (PA/LNA only)
Cypress CYBL1XX7X silicon low power mode support
Deep Sleep: 1.3
serial
Hibernate: 150 nA with SRAM retention
Stop: 60 nA with XRES wakeup
Functional Capabilities
Up to 18 capacitive sensors for buttons or sliders
12-bit, 1-Msps SAR ADC with internal reference,
sample-and-hold (S/H), and channel sequencer
Two serial communication blocks (SCBs) supporting I
(master/slave), SPI (master/slave), or UART
Four dedicated 16-bit timer, counter, or PWM blocks
(TCPWMs)
LCD drive supported on all GPIOs (common or segment)
Programmable low voltage detect (LVD) from 1.8 V to 4.5 V
2
I
S master interface
BLE protocol stack supporting generic access profile (GAP)
Central, Peripheral, Observer, or Broadcaster roles
Switches between Central and Peripheral roles on-the-go
Standard BLE profiles and services for interoperability
Custom profile and service for specific use cases
Benefits
CYBLE-2X20XX-X1 is provided as a turnkey solution, including
all necessary hardware required to use BLE communication
standards.
Proven hardware design ready to use
Cost optimized for applications without space constraint
Reprogrammable architecture
Fully certified module eliminates the time needed for design,
development and certification
Bluetooth SIG qualified with QDID and Declaration ID
Flexible communication protocol support
PSoC Creator™ provides an easy-to-use integrated design
environment (IDE) to configure, develop, program, and test a
BLE application
San Jose
CYBLE-212006-01
CYBLE-202007-01
CYBLE-202013-11
A with watch crystal oscillator (WCO) on
,
CA 95134-1709
Revised April 21, 2017
2
C
408-943-2600

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Summary of Contents for Cypress CYBLE-212006-01

  • Page 1 The CYBLE-2X20XX-X1 is a turnkey RX current consumption ■ solution and includes onboard crystal oscillators, passive BLE silicon: 16.4 mA (radio only, 0 dbm) components, and the Cypress PRoC™ BLE. Refer to the ❐ CYBL1XX7X datasheet for additional details on the capabilities RFX2401C: 8.0 mA (PA/LNA only)
  • Page 2 ■ PRoC® Evaluation Boards (CYBLE-212006-EVAL/CY- PRoC BLE Silicon Datasheet ■ BLE-202007-EVAL/CYBLE-202013-EVAL) and the BLE Pi- Application notes: Cypress offers a number of BLE application oneer Kit (CY8CKIT-042-BLE) ■ notes covering a broad range of topics, from basic to advanced KBA97095 - EZ-BLE™...
  • Page 3: Table Of Contents

    Worldwide Sales and Design Support....... 40 Digital Peripherals ............. 22 Products ..............40 Serial Communication ..........24 PSoC® Solutions ............40 Memory ..............25 Cypress Developer Community......... 40 System Resources ............ 25 Technical Support ............. 40 Document Number: 002-15631 Rev.*D Page 3 of 40...
  • Page 4: Overview

    Module Dimensions and Drawing Cypress reserves the right to select components (including the appropriate BLE device) from various vendors to achieve the BLE module functionality. Such selections will still guarantee that all height restrictions of the component area are maintained. Designs...
  • Page 5 CYBLE-212006-01 CYBLE-202007-01 CYBLE-202013-11 Figure 1. Module Mechanical Drawing Side View Top View Bottom View Note 3. No metal or traces should be located beneath or above the antenna area. Only bare PCB material should be located beneath the antenna area. For more information...
  • Page 6: Pad Connection Interface

    To maximize RF performance, the host layout should follow these recommendations: 1. The ideal placement of the Cypress BLE module is in a corner of the host board with the trace antenna located at the far corner. This placement minimizes the additional recommended keep out area stated in item 2. Refer to...
  • Page 7: Recommended Host Pcb Layout

    PCB layout pattern for the CYBLE-212006-01. Dimensions are in millimeters unless otherwise noted. Pad length of 1.27 mm (0.635 mm from center of the pad on either side) shown in Figure 6 is the minimum recommended host pad length.
  • Page 8 CYBLE-212006-01 CYBLE-202007-01 CYBLE-202013-11 Table 3 provides the center location for each solder pad on the CYBLE-2X20XX-X1. All dimensions are referenced to the center of the solder pad. Refer to Figure 6 for the location of each module solder pad. Table 3. Module Solder Pad Location Figure 6.
  • Page 9: Digital And Analog Capabilities And Connections

    Radio Power Supply (2V to 3.6V) RF Ground Connection for use with CYBLE-202013-11 only; No Connect for CYBLE-212006-01 and CYBLE-202007-01 RF Pin to External Antenna for use with CYBLE-202013-11 only; No Connect for CYBLE-212006-01 and CYBLE-202007-01 Notes 4. TCPWM: Timer, Counter, and Pulse Width Modulator. If supported, the pad can be configured to any of these peripheral functions.
  • Page 10: Power Supply Connections And Recommended External Components

    CYBLE-212006-01 CYBLE-202007-01 CYBLE-202013-11 Power Supply Connections and Recommended External Components Power Connections External Component Recommendation The CYBLE-2X20XX-X1 contains two power supply connec- In either connection scenario, it is recommended to place an tions, VDD and VDDR. The VDD connection supplies power for external ferrite bead between the supply and the module both digital and analog device operation.
  • Page 11 CYBLE-212006-01 CYBLE-202007-01 CYBLE-202013-11 Figure 8. Recommended Host Schematic for an Independent Supply Option Independent Power Supply Option (Seen from Bottom) Document Number: 002-15631 Rev.*D Page 11 of 40...
  • Page 12: Antenna Matching Network Requirements For Cyble-202013-11

    CYBLE-212006-01 CYBLE-202007-01 CYBLE-202013-11 Antenna Matching Network Requirements for CYBLE-202013-11 The CYBLE-202013-11 module requires ANT and GND connections to an external antenna via the RF pad connections on the module (Pads 29 and 30). To optimize RF performance, an Antenna Matching Network (AMN) is required to be placed between the ANT connection (Pad 29) and the antenna used in the final design.
  • Page 13 CYBLE-212006-01 CYBLE-202007-01 CYBLE-202013-11 The CYBLE-2X20XX-X1 schematic is shown in Figure Figure 10. CYBLE-2X20XX-X1 Schematic Diagram Document Number: 002-15631 Rev.*D Page 13 of 40...
  • Page 14: Critical Components List

    56-pin QFN Programmable Radio-on-Chip (PRoC) with BLE Crystal 24.000 MHz, 12PF Crystal 32.768 kHz, 12.5PF Antenna Design Table 6 details trace antenna used in the CYBLE-212006-01 module. For more information, see Table Table 6. Trace Antenna Specifications Item Description Frequency Range 2402 – 2480 MHz Peak Gain -0.5 dBi typical...
  • Page 15: Enabling Extended Range Feature

    Note 9. The CYBLE-212006-01 module is certified for FCC, IC, CE, MIC and KC regulations at an output power of +7.5 dBm. To achieve this output power, RF (PRoC BLE silicon PA level) must be set to the -12 dBm setting in firmware. Settings higher than this will result in higher output power than specified in the CYBLE-212006-01 certifications.
  • Page 16: Electrical Specification

    CYBLE-212006-01 CYBLE-202007-01 CYBLE-202013-11 Electrical Specification Table 10 details the absolute maximum electrical characteristics for the Cypress BLE module. Table 10. CYBLE-2X20XX-X1 Absolute Maximum Ratings Parameter Description Units Details/Conditions Analog, digital, or radio supply relative to V –0.5 – Absolute maximum...
  • Page 17 CYBLE-212006-01 CYBLE-202007-01 CYBLE-202013-11 Table 12. CYBLE-2X20XX-X1 DC Specifications (continued) Parameter Description Units Details/Conditions T = 25 °C, Execute from flash; CPU at 24 MHz – – = 3.3 V Execute from flash; CPU at 24 MHz – – – T = –40 °C to 85 °C DD10 T = 25 °C,...
  • Page 18: Gpio

    CYBLE-212006-01 CYBLE-202007-01 CYBLE-202013-11 Table 13. AC Specifications Parameter Description Units Details/Conditions 1.71 V V 5.5 V CPU frequency –  Wakeup from Sleep mode – – Guaranteed by characterization SLEEP 24-MHz IMO. Guaranteed by  Wakeup from Deep-Sleep mode –...
  • Page 19: Xres

    CYBLE-212006-01 CYBLE-202007-01 CYBLE-202013-11 Table 15. GPIO AC Specifications Parameter Description Units Details/Conditions Rise time in Fast-Strong mode – 3.3-V V = 25 pF RISEF LOAD Fall time in Fast-Strong mode – 3.3-V V = 25 pF FALLF LOAD Rise time in Slow-Strong mode –...
  • Page 20 CYBLE-212006-01 CYBLE-202007-01 CYBLE-202013-11 Table 19. XRES AC Specifications Parameter Description Units Details/Conditions  Reset pulse width – – – RESETWIDTH Temperature Sensor Table 20. Temperature Sensor Specifications Parameter Description Units Details/Conditions Temperature-sensor accuracy –5 ±1 °C –40 °C to +85 °C...
  • Page 21 CYBLE-212006-01 CYBLE-202007-01 CYBLE-202013-11 Table 22. SAR ADC AC Specifications Parameter Description Units Details/Conditions Measured at 1-V A_PSRR Power-supply rejection ratio – – reference A_CMRR Common-mode rejection ratio – – A_SAMP Sample rate – – Msps SAR operating speed without external ref.
  • Page 22: Digital Peripherals

    CYBLE-212006-01 CYBLE-202007-01 CYBLE-202013-11 Digital Peripherals Timer Table 23. Timer DC Specifications Parameter Description Units Details/Conditions  Block current consumption at 3 MHz – – 16-bit timer TIM1  Block current consumption at 12 MHz – – 16-bit timer TIM2 ...
  • Page 23 CYBLE-212006-01 CYBLE-202007-01 CYBLE-202013-11 Pulse Width Modulation (PWM) Table 27. PWM DC Specifications Parameter Description Units Details/Conditions  Block current consumption at 3 MHz – – 16-bit PWM PWM1  Block current consumption at 12 MHz – – 16-bit PWM PWM2 ...
  • Page 24: Serial Communication

    CYBLE-212006-01 CYBLE-202007-01 CYBLE-202013-11 Serial Communication Table 31. Fixed I C DC Specifications Parameter Description Units Details/Conditions  Block current consumption at 100 kHz – – – I2C1  Block current consumption at 400 kHz – – – I2C2  Block current consumption at 1 Mbps –...
  • Page 25: Memory

    CYBLE-212006-01 CYBLE-202007-01 CYBLE-202013-11 Memory Table 39. Flash DC Specifications Parameter Description Units Details/Conditions Erase and program voltage 1.71 – – Number of Wait states at 32–48 MHz – – CPU execution from flash WS48 Number of Wait states at 16–32 MHz –...
  • Page 26 CYBLE-212006-01 CYBLE-202007-01 CYBLE-202013-11 Voltage Monitors (LVD) Table 45. Voltage Monitor DC Specifications Parameter Description Units Details/Conditions LVI_A/D_SEL[3:0] = 0000b 1.71 1.75 1.79 – LVI1 LVI_A/D_SEL[3:0] = 0001b 1.76 1.80 1.85 – LVI2 LVI_A/D_SEL[3:0] = 0010b 1.85 1.90 1.95 – LVI3 LVI_A/D_SEL[3:0] = 0011b 1.95...
  • Page 27 CYBLE-212006-01 CYBLE-202007-01 CYBLE-202013-11 Internal Main Oscillator Table 48. IMO DC Specifications Parameter Description Units Details/Conditions  IMO operating current at 48 MHz – – 1000 – IMO1  IMO operating current at 24 MHz – – – IMO2  IMO operating current at 12 MHz –...
  • Page 28 CYBLE-212006-01 CYBLE-202007-01 CYBLE-202013-11 Table 53. BLE Subsystem (continued) Parameter Description Units Details/Conditions Cochannel interference, RF-PHY Specification Wanted signal at –67 dBm and Interferer – (RCV-LE/CA/03/C) at FRX Adjacent channel interference RF-PHY Specification Wanted signal at –67 dBm and Interferer –...
  • Page 29 CYBLE-212006-01 CYBLE-202007-01 CYBLE-202013-11 Table 53. BLE Subsystem (continued) Parameter Description Units Details/Conditions Output power above +7.5 dBm will void certifications TXP, MAX Output power, maximum power setting – 22.5 – and qualifications of this module. TXP, MIN Output power, minimum power setting –...
  • Page 30 CYBLE-212006-01 CYBLE-202007-01 CYBLE-202013-11 Table 53. BLE Subsystem (continued) Parameter Description Units Details/Conditions PA only average current – – Packet length of 0x01 Continuous Transmit PA TX Current at +7.5 dBm module TXP ITX, +7.5dBm Silicon TXP set to –12-dBm setting (PA2) PA only average current –...
  • Page 31: Environmental Specifications

    Environmental Specifications Environmental Compliance This Cypress BLE module is built in compliance with the Restriction of Hazardous Substances (RoHS) and Halogen Free (HF) directives. The Cypress module and components used to produce this module are RoHS and HF compliant. RF Certification The CYBLE-212006-01 and CYBLE-202007-01 modules will be certified under the following RF certification standards at production release.
  • Page 32: Regulatory Information

    Regulatory Information FCC NOTICE: The devices CYBLE-212006-01 and CYBLE-202007-01 comply with Part 15 of the FCC Rules. The device meet the requirements for modular transmitter approval as detailed in FCC public Notice DA00-1407.transmitter Operation is subject to the following two condi- tions: (1) This device may not cause harmful interference, and (2) This device must accept any interference received, including interference that may cause undesired operation.
  • Page 33: Industry Canada (Ic) Certification

    The Original Equipment Manufacturer (OEM) must ensure that IC labelling requirements are met. This includes a clearly visible label on the outside of the OEM enclosure specifying the appropriate Cypress Semiconductor IC identifier for this product as well as the IC Notice above.
  • Page 34: Mic Japan

    CYBLE-202013-11 MIC Japan CYBLE-212006-01 and CYBLE-202007-01 are certified as a module with type certification number 203-JN0599. End products that integrate CYBLE-212006-01 and CYBLE-202007-01 do not need additional MIC Japan certification for the end product. End product can display the certification label of the embedded module.
  • Page 35: Packaging

    CYBLE-212006-01 CYBLE-202007-01 CYBLE-202013-11 Packaging Table 55. Solder Reflow Peak Temperature Maximum Time at Peak Module Part Number Package Maximum Peak Temperature No. of Cycles Temperature CYBLE-2X20XX-X1 30-pad SMT 260 °C 30 seconds Table 56. Package Moisture Sensitivity Level (MSL), IPC/JEDEC J-STD-2...
  • Page 36 The CYBLE-2X20XX-X1 is designed to be used with pick-and-place equipment in an SMT manufacturing environment. The center-of-mass for the CYBLE-2X20XX-X1 is detailed in Figure Figure 14. CYBLE-2X20XX-X1 Center of Mass (Seen from Top) CYBLE-212006-01 Center of Mass CYBLE-202007-01 Center of Mass CYBLE-202013-11 Center of Mass Document Number: 002-15631 Rev.*D...
  • Page 37: Ordering Information

    The part numbers are of the form CYBLE-ABCDEF-GH where the fields are defined as follows. For additional information and a complete list of Cypress Semiconductor BLE products, contact your local Cypress sales representative. To locate the nearest Cypress office, visit our website.
  • Page 38: Acronyms

    CYBLE-212006-01 CYBLE-202007-01 CYBLE-202013-11 Acronyms Document Conventions Table 59. Acronyms Used in this Document Units of Measure Acronym Description Table 60. Units of Measure Bluetooth Low Energy Symbol Unit of Measure Bluetooth °C degree Celsius Bluetooth Special Interest Group kilovolt European Conformity...
  • Page 39: Document History Page

    CYBLE-212006-01 CYBLE-202007-01 CYBLE-202013-11 Document History Page Document Title: CYBLE-212006-01, CYBLE-202007-01, CYBLE-202013-11 EZ-BLE™ PRoC™ XR Module Document Number: 002-15631 Orig. of Submission Revision Description of Change Change Date 5446955 10/07/2016 Preliminary datasheet for CYBLE-2X20XX-X1 modules. Updated More Information: Added EZ-Serial™ BLE Firmware Platform section.
  • Page 40: Sales, Solutions, And Legal Information

    ("Unintended Uses"). A critical component is any component of a device or system whose failure to perform can be reasonably expected to cause the failure of the device or system, or to affect its safety or effectiveness. Cypress is not liable, in whole or in part, and you shall and hereby do release Cypress from any claim, damage, or other liability arising from or related to all Unintended Uses of Cypress products.

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