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DFI TGH960 Design Manual

Com express basic module carrier board
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TGH960
COM Express Basic Module
Carrier Board Design Guide
© May 18, 2023 DFI Inc.

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Summary of Contents for DFI TGH960

  • Page 1 TGH960 COM Express Basic Module Carrier Board Design Guide © May 18, 2023 DFI Inc.
  • Page 2 COM Express Specification Reference • Shielded interface cables must be used in order to comply with the emission limits. PICMG® COM Express® Module Base Specification. http://www.picmg.org/ Design Guide | TGH960...

  • Page 3: Table Of Contents

    PCI Express Bus ........................13 Serial ATA ..........................20 Gigabit Ethernet (GBE) ......................22 AC'97 Audio / HD Audio .....................25 Universal Serial Bus 2.0 and 3.1 (USB 2.0 and 3.1) ............29 LVDS/eDP (optional) ......................34 VGA ............................39 Digital Display Interface .......................42 Miscellaneous ........................48 Design Guide | TGH960...
  • Page 4 • To reduce the risk of electric shock, unplug the power cord before removing the sys- tem chassis cover for installation or servicing. After installation or servicing, cover the system chassis before plugging the power cord. Design Guide | TGH960...
  • Page 5 • Storage devices such as hard disk drive, etc. You will also need external system peripherals you intend to use which will normally include at least a keyboard, a mouse and a video display monitor. Design Guide | TGH960...

  • Page 6: Chapter 1 - Introduction

    PCI Express, Serial ATA, USB 2.0, etc. Not only do COMs allow quick board are applicable and can be found in the PICMG Design Guide V1.0. Please contact DFI design, they also provide the benefits of easy installation, maintenance and upgrade ease.

  • Page 7: Specification

    1 x Intel® I225 series (10/100/1000Mbps/2.5G) 4 x USB 3.2 Gen2 8 x USB 2.0 SATA 4 x SATA 3.0 (up to 6Gb/s) Support RAID 0/1 1 x 8-bit DIO (Default 4 inputs and 4 outputs) Design Guide | TGH960...
  • Page 8 Operating: 0 to 60°C, -40 to 70°C Storage: -40 to 85°C Humidity Operating: 5 to 90% RH Storage: 5 to 90% RH MTBF MECHANICAL Dimensions COM Express Basic 95mm (3.74") x 125mm (4.9") ® Compliance PICMG COM Express® R3.0, Type 6 Design Guide | TGH960...

  • Page 9: Block Diagram

    Chapter 1 INTRODUCTION X Block Diagram Design Guide | TGH960...

  • Page 10: Board Layout

    INTRODUCTION X Board Layout X Connector The COM Express connector is used to interface the TGH960 COM Express board to a carrier board. Connect the COM Express connector (located on the solder side of the board) to the CPU fan JP8000 COM Express connector on the carrier board.Refer to the following pages for the pin functions...

  • Page 11: Terminology

    Integrated Drive Electronics (Advanced Technology Attachment) IDE (ATA) An interrupt request signal where x stands for interrupts A, B, C, INTx and D A local area network (LAN) is a computer network covering a small physical area Liquid Crystal Display Design Guide | TGH960...

  • Page 12: Chapter 2 - Concept

    Chapter 2 - Concept X COM Express Module Standards The figure below shows the dimensions of the different types of COM Express modules. TGH960 is a COM Express Basic. The dimension is 95mm x 125mm. Common for all Form Factors Extended only...

  • Page 13: Chapter 3 - Carrier Board Schematic Guidelines

    O output from the Module I/O bi-directional input/output signal OD open drain output Pwr Rail/Tolerance: power voltage TGH960: the description of Module board Module Base Specification R2.1 Description COM Express Carrier Design Guide R2.0 Description PCI Express Lanes Signals Descriptions...
  • Page 14 DDI1_PAIR1- Connect AC Coupling Capacitors 0.1uF to Device Module DDI1_PAIR2+ Connect AC Coupling Capacitors 0.1uF to Device Design Guide | TGH960 O PCIE AC coupled off DP1_LANE2+/- for DP / TMDS1_DATA0+/- for HDMI or DVI DDI1_PAIR2- Connect AC Coupling Capacitors 0.1uF to Device...
  • Page 15 Use the exactly same package size for the capacitor on each signal in a differential pair. The reference for the PCI Express capacitor is indicated below. AC Coupling Min = 75 nF Capacitor Value Gen1 or Gen2 Max = 265 nF AC Coupling Min = 180 nF Capacitor Value Gen3 Max = 265 nF Design Guide | TGH960...
  • Page 16 2574 4926 PCIE_TX4- PCIE_RX4+ 2328 5172 PCIE_RX4- PCIE_TX5+ 2437 5063 PCIE_TX5- PCIE_RX5+ 2291 5209 PCIE_RX5- PCIE_TX6+ 1421 6079 PCIE_TX6- PCIE_RX6+ 1513 5987 PCIE_RX6- PCIE_TX7+ 1478 6022 PCIE_TX7- PCIE_RX7+ 1694 5806 PCIE_RX7- * Trace length Unit: mils Design Guide | TGH960...
  • Page 17 5,648 PEG_TX7- Differential 6869 PEG_TX8+ 85Ω±10% 5,637 PEG_TX8- PEG_TX9+ 5,660 PEG_TX9- PEG_TX10+ 5,650 PEG_TX10- PEG_TX11+ 5,630 PEG_TX11- PEG_TX12+ 5,610 PEG_TX12- PEG_TX13+ 5,615 PEG_TX13- PEG_TX14+ 5,647 PEG_TX14- D101 PEG_TX15+ 5,539 D102 PEG_TX15- * Trace length Unit: mils Design Guide | TGH960...
  • Page 18 PEG_RX8- PEG_RX9+ 1179 5,289 PEG_RX9- PEG_RX10+ 1140 5,328 PEG_RX10- PEG_RX11+ 1213 5,255 PEG_RX11- PEG_RX12+ 1058 5,410 PEG_RX12- PEG_RX13+ 1183 5,285 PEG_RX13- PEG_RX14+ 1104 5,364 PEG_RX14- C101 PEG_RX15+ 1289 5,179 C102 PEG_RX15- * Trace length Unit: mils Design Guide | TGH960...
  • Page 19 Chapter 3 CARRIER BOARD SCHEMATIC GUIDELINES Board-to-Board Couple Carrier Board COMe Module Note: The RX+/-AC Cap on the carrier board is only for PEG 3.0 Design Guide | TGH960...

  • Page 20: Serial Ata

    MDI[1]+/- B1_DB+/- RX+/- RX+/- Pwr Rail/Tolerance: power voltage MDI[2]+/- B1_DC+/- MDI[3]+/- B1_DD+/- TGH960: the description of Module board GBE0_MDI0- I/O Analog 3.3V max Suspend Module Base Specification R2.1 Description GBE0_MDI1+ I/O Analog 3.3V max Suspend Connect to Magnetics Module MDI1+/-...
  • Page 21 SATA3_TX- SATA3_RX+ 2042 4458 SATA3_RX- DFI Inc. DFI Inc. DFI Inc. * Trace length Unit: mils Title Title Title Design Guide | TGH960 Express Card&SATA&LAN/USB3.0 Express Card&SATA&LAN/USB3.0 Express Card&SATA&LAN/USB3.0 Size Size Size Document Number Document Number Document Number COM331-B COM331-B...

  • Page 22: Gigabit Ethernet (Gbe)

    I input to the Module O output from the Module I/O bi-directional input/output signal OD open drain output Pwr Rail/Tolerance: power voltage TGH960: the description of Module board Module Base Specification R2.1 Description COM Express Carrier Design Guide R2.0 Description HDA Signals Descriptions Signal...
  • Page 23 SATA_RX1P SATA_RX3P GND3 GND3 GBE0_MDI0+ 495.40 79504.60 GBE0_MDI0- 498.80 79501.20 GBE0_MDI1+ 498.58 79501.42 GBE0_MDI1- 494.93 79505.07 Differential 80000 GBE0_MDI2+ 496.26 79503.74 100Ω±10% GBE0_MDI2- 493.89 79506.11 GBE0_MDI3+ 492.50 79507.50 GBE0_MDI3- 495.19 79504.81 * Trace length Unit: mils Design Guide | TGH960...
  • Page 24 Designing for Gigabit Ethernet operation is very similar to the designing for 10/100 Mbps. 10/100Mbps Ethernet has two differential pairs, and Gigabit Ethernet has four differential pairs. The figure below indicates the connections between 10/100M Ethernet and Gigabit Ethernet. Board-to-Board MDI0-3+/- Carrier Board COMe Module Design Guide | TGH960...

  • Page 25: Ac'97 Audio / Hd Audio

    I input to the Module O output from the Module I/O bi-directional input/output signal OD open drain output Pwr Rail/Tolerance: power voltage TGH960: the description of Module board Module Base Specification R2.1 Description COM Express Carrier Design Guide R2.0 Description HDA Signals Descriptions Signal...
  • Page 26 R459 R459 0402 0402 106P,16V 106P,16V 0805 0805 NC/0 NC/0 A_GND HDA_SDOUT MIC2-VREFO BAT54A BAT54A 22K,1 22K,1 A_GND Design Guide | TGH960 22K,1 22K,1 A_GND 4.7K,1 4.7K,1 4.7K,1 4.7K,1 Front Audio MIC2-L 475P,10V 475P,10V 75,1 75,1 MIC2-R 475P,10V 475P,10V 75,1...
  • Page 27 226P,16V 75,1 75,1 MIC2-JD 20K,1 20K,1 FRONT-IO-SENSE 226P,16V 226P,16V 75,1 75,1 LINE2-JD 39.2K,1 39.2K,1 BAT54A BAT54A 2X5-1 2X5-1 Design Guide | TGH960 WB2X5K8 WB2X5K8 22K,1 22K,1 A_GND 22K,1 22K,1 22K,1 22K,1 4.7K,1 4.7K,1 4.7K,1 4.7K,1 22K,1 22K,1 A_GND 4.7K,1 4.7K,1 4.7K,1...
  • Page 28 (Intel Spec) trace Length ML (Intel Spec) Length CL AC/HDA_RST# 3408 10568 AC/HDA_SYNC 3531 10445 AC/HDA_BITCLK 3553 10423 Single End 14476 50Ω±10% AC/HAD_SDOUT 3513 10463 AC/HDA_SDIN0 3069 10907 AC/HDA_SDIN1 2954 11022 * Trace length Unit: mils Design Guide | TGH960...

  • Page 29: Universal Serial Bus 2.0 And 3.1 (Usb 2.0 And 3.1)

    Connect AC Coupling Capacitors 0.1uF to Device DDI3_PAIR1+ Connect AC Coupling Capacitors 0.1uF to Device DDI 3 Pair 1 differential pairs/Serial Digital Video B green output differential pair TGH960: the description of Module board O PCIE AC coupled off Module DDI3_PAIR1- Connect AC Coupling Capacitors 0.1uF to Device...
  • Page 30 Connect to DDC clock of LVDS panel I2C clock output for LVDS display use LVDS_I2C_DAT I/O OD CMOS 3.3V / 3.3V PU 2.2K to 3.3V Connect to DDC data of LVDS panel I2C data line for LVDS display use Design Guide | TGH960...
  • Page 31 Display Ports & USB_3.0/2.0 Display Ports & USB_3.0/2.0 Size Size Size Document Number Document Number Document Number COM331-B COM331-B COM331-B Design Guide | TGH960 Date: Date: Date: Thursday, August 09, 2012 Thursday, August 09, 2012 Thursday, August 09, 2012 Sheet Sheet Sheet...
  • Page 32 USB1+ 1647 7853 USB1- USB2+ 1934 7566 USB2- USB3+ 1789 7711 Differential USB3- 10000 85Ω±7% USB4+ 2321 7179 USB4- USB5+ 1884 7616 USB5- USB6+ 2367 7133 USB6- USB7+ 1540 7960 USB7- * Trace length Unit: mils Design Guide | TGH960...
  • Page 33 (Intel Spec) USB_SSTX0+ 3673 USB_SSTX0- USB_SSTX1+ 1081 3419 USB_SSTX1- USB_SSTX2+ 3793 USB_SSTX2- USB_SSTX3+ 1045 3455 USB_SSTX3- Differential 5000 80Ω±7% USB_SSRX0+ 3663 USB_SSRX0- USB_SSRX1+ 3626 USB_SSRX1- USB_SSRX2+ 3902 USB_SSRX2- USB_SSRX3+ 3686 USB_SSRX3- * Trace length Unit: mils Design Guide | TGH960...

  • Page 34: Lvds/Edp (Optional)

    Pwr Rail/Tolerance: power voltage to USB connector USB_SSTX1- Module TGH960: the description of Module board USB_SSRX1+ Connect 90Ω@100MHz Common Choke in series and ESD suppressors to GND Additional receive signal differential pairs for the SuperSpeed USB data path. I PCIE AC coupled off Module Base Specification R2.1 Description...
  • Page 35 The LVDS signals can be routed directly from the COM Express module to the LVDS connectors. The figures listed below indicate one pair of LVDS display. Each pair can use the common-mode choke for EMI compliance if needed. Design Guide | TGH960...
  • Page 36 Traces must be ground referenced. • When choosing cables, it is important to remind that the differential impedance of cable should be 100Ω. The cable length should be less than 0.5 meter for better signal quality. Design Guide | TGH960...
  • Page 37 Module Board Max VIA Count Length Pin# BTB Pin Name BTB Length trace Length ML (Intel Spec) Trace Length (Intel Spec) LVDS_I2C_CK 2134 3366 eDP_AUX+ Differential 6000 50Ω±10% LVDS_I2C_DAT 2137 3363 eDP_AUX- * Trace length Unit: mils Design Guide | TGH960...
  • Page 38 Length ML (Intel Spec) (Intel Spec) Length CL LVDS_A2+/eDP_TX0+ 3627 5873 LVDS_A2-/eDP_TX0- LVDS_A1+/eDP_TX1+ 3751 5749 LVDS_A1-/Edp_TX1- Differential LVDS_A0+/eDP_TX2+ 10000 3307 6193 85Ω±7% LVDS_A0-/eDP_TX2- LVDS_A_CK+/eDP_TX3+ 3297 6203 LVDS_A_CK-/eDP_TX3- LVDS_I2C_CK/eDP_AUX+ 4027 5473 LVDS_I2C_DAT/eDP_AUX- * Trace length Unit: mils Design Guide | TGH960...

  • Page 39: Vga

    I input to the Module O output from the Module I/O bi-directional input/output signal OD open drain output Pwr Rail/Tolerance: power voltage TGH960: the description of Module board Module Base Specification R2.1 Description COM Express Carrier Design Guide R2.0 Description VGA Signals Descriptions Signal...
  • Page 40 3.3P SN74LVC1G125 SN74LVC1G125 2N7002K 2N7002K VGA_GND CRT_DDC_DATA [15] CRT_DDC_DATA DDCSCL_5V 2.2K,1 2.2K,1 5V_DP 2.2K,1 2.2K,1 104P,16V 104P,16V 2N7002K 2N7002K CRT_DDC_CLK [15] CRT_DDC_CLK CRT_VSYNC 33,1 33,1 CRT_VSYNC-R 33,1 33,1 VSYNC [15] CRT_VSYNC 3.3P 3.3P SN74LVC1G125 SN74LVC1G125 VGA_GND Design Guide | TGH960...
  • Page 41 Pin# BTB Pin Name Module Board trace Length ML BTB Length (Intel Spec) Trace Length (Intel Spec) VGA_I2C_CK Single End 14000 441.00 500.00 13059.00 50Ω±10% VGA_I2C_DAT * Trace length Unit: mils Board-to-Board Carrier Board COMe Module Design Guide | TGH960...

  • Page 42: Digital Display Interface

    PCI Express Graphics lane reversal input strap. Pull low on the Carrier board to reverse lane order. PEG_LANE_RV# I CMOS 3.3V / 3.3V TGH960: the description of Module board Module Base Specification R2.1 Description COM Express Carrier Design Guide R2.0 Description DDI Signals Descriptions...
  • Page 43 USB differential pairs 7, USB7 may be configured as a USB client or as a host, or both, at the Module Connect 90Ω @100MHz Common Choke in series and ESD suppressors to GND to USB I/O USB 3.3V Suspend/3.3V USB7- connector designer's discretion.(CR901-B default set as a host) Design Guide | TGH960...
  • Page 44 CPU and display devices. eDP is derived from Display- Port; however, it utilizes advanced power-saving features that will save overall system power and prolong the battery life of many embedded displays of the device. Design Guide | TGH960...
  • Page 45 10K,1 DDCDATA_AUX3N +HDMI_CLK_CON +HDMI_CLK_CON 2N7002K,S -HDMI_CLK_CON -HDMI_CLK_CON +HDMI0_CON +HDMI0_CON -HDMI0_CON -HDMI0_CON NC/BAV99 TPD4S010 SLP2510P8 Design Guide | TGH960 Title Title Title Module schematic Module schematic Module schematic Size Size Size Document Number Document Number Document Number HDMI Interface level shift...
  • Page 46 3175 DDI3_PAIR1- Differential 7000 85Ω±7% DDI3_PAIR2+ 3682 2818 DDI3_PAIR2- DDI3_PAIR3+ 3321 3179 DDI3_PAIR3- SKL-H HDMI 1.4* Main Link Cost-reduced/Active Level Shifter Motherboard Topology of Total Motherboard Length Max = 6500 mils * Trace length Unit: mils Design Guide | TGH960...
  • Page 47 SKL H HDMI 1.4* DDC Cost-reduced Level Shifter otherboard Topology of Total Motherboard Length Max = 12000 mils SKL H HDMI 1.4* DDC Active Level Shifter otherboard Topology of Total Motherboard Length Max = 15000 mils Design Guide | TGH960...

  • Page 48: Miscellaneous

    Length ML (Intel Spec) (Intel Spec) Length CL LPC_AD0 4136 10364 LPC_AD1 4280 10220 LPC_AD2 4144 10356 Single End 15000 50Ω±10% LPC_AD3 4168 10332 LPC_FRAME# 4293 10207 LPC_SERIRQ 4213 10287 * Trace length Unit: mils Design Guide | TGH960...

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