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2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Cross screw driver
Soldering station
Pliers
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Remove all external screws from power supply.(typically 13 screws).
2. Remove top case from power supply.
3. Remove two screws holding PCB to bottom case.(Remove bottom case).
4. Remove socket and mylar film from case and PCBs.
5. Remove four screws holding fan and two fan cases.(Top case and bottom case).
6. Remove fan and leave PCBs.
7. Use soldering station and pliers for remove wires.
8. Remove eleven screws holding semiconductors to heat sinks.(Remove heat sinks)
9. Remove seven inductances and two transformers for PCBs.
10. Use soldering station remove five electrolytic capacitors from PCBs.(height=30mm(3) and height=25mm(2)).
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
EL-MF877-00
Template Revision B
PSG instructions for this template are available at
EL-MF877-01
Tool Size (if
applicable)
6*300mm
Common
Medium
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