HP MSR4060 Product End-Of-Life Disassembly Instructions page 2

radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where
components and materials requiring selective treatment can be removed.
Tool Description
Screw driver
tweezers
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective
treatment:
1. Unscrew the screws for mounting angle 1, and then remove the mounting angle 1 from the rack or cabinet.
2. Remove all of the labels.
3. Unscrew the screws on blank panel 2 and 3, and then remove the blank panel 2 and 3.
4. Remove shielding fingers 4.
5. Remove the part 5 and 6.
6. Remove shielding fingers 4.
7. Remove the part 7.
8. Unscrew the screws on part 8, then remove it.
9. Remove shielding fingers 4.
10. Unscrew the screws on panel 7.1, and then remove panel 7.1.
11. Unscrew the screws on panel 7.2, and then remove panel 7.2.
12. Remove shielding fingers 4.
13. Unscrew the screws on PCB 7.3, and then remove PCB 7.3.
14. Unscrew the screws on panel 7.4, and then remove panel 7.4.
15. Unscrew the screws 7.5, and then remove handle 7.5.
16. Remove shielding fingers 4.
17. Unscrew the screws on panel 7.4.1, and then remove fan 7.4.2.
18. Unscrew the screws on part 8.1, and then remove PCB 8.2.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations)
EL-MF877-00
Template Revision B
Tool Size (if
applicable)
2#
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