Sony DSC-WX150 Service Manual page 2

Camera Recording media: Internal Memory
(Approx. 19 MB), "Memory Stick Duo"
[System]
media, "Memory Stick Micro" media,
Image device: 7.76 mm (1/2.3 type)
SD cards, microSD memory cards
Exmor R CMOS sensor
Flash: Flash range (ISO sensitivity
Total pixel number of camera:
(Recommended Exposure Index) set to Auto):
Approx. 18.9 Megapixels
Approx. 0.2 m to 3.7 m
Effective pixel number of camera:
(7 7/8 inches to 12 feet 1 3/4 inches) (W)
Approx. 18.2 Megapixels
Approx. 1.5 m to 2.2 m
Lens: Sony G 10× zoom lens
(4 feet 11 1/8 inches to 7 feet 2 5/8 inches) (T)
f = 4.45 mm – 44.5 mm (25 mm – 250 mm
(35 mm film equivalent))
[Input and Output connectors]
F3.3 (W) – F5.9 (T)
HDMI connector: HDMI mini jack
While shooting movies (16:9):
Micro USB connector:
27.5 mm – 275 mm*
USB communication
While shooting movies (4:3):
USB communication: Hi-Speed USB
33.5 mm – 335 mm*
(USB 2.0)
* When [Movie SteadyShot] is set
to [Standard]
[Screen]
SteadyShot: Optical
LCD screen:
Exposure control: Automatic exposure,
7.5 cm (3.0 type) TFT drive
Scene Selection (15 modes)
Total number of dots:
White balance: Automatic, Daylight,
460 800 dots
Cloudy, Fluorescent 1/2/3,
Incandescent, Flash, One Push
[Power, general]
Underwater White balance: Automatic,
Underwater 1/2, One Push Power: Rechargeable battery pack
Signal format: NP-BN, 3.6 V
For 1080 50i: PAL color, CCIR AC Adaptor AC-UB10/UB10B,
standards HDTV 1080/50i 5 V
specification Power consumption (during shooting):
For 1080 60i: NTSC color, EIA 1.0 W
standards HDTV 1080/60i Operating temperature:
specification 0 °C to 40 °C (32 °F to 104 °F)
File format: Storage temperature:
Still images: JPEG (DCF, Exif, –20 °C to +60 °C (–4 °F to +140 °F)
Dimensions (CIPA compliant):
MPF Baseline) compliant,
DPOF compatible 94.7 mm × 56.4 mm × 21.6 mm
3D still images: MPO (MPF Extended (3 3/4 inches × 2 1/4 inches × 7/8 inches)
(Disparity Image)) compliant (W/H/D)
Movies (AVCHD format): Mass (CIPA compliant) (including NP-BN
AVCHD format Ver. 2.0 compatible battery pack, "Memory Stick
Video: MPEG-4 AVC/H.264 Duo" media):
Audio: Dolby Digital 2ch, Approx. 133 g (4.7 oz)
equipped with Dolby Digital Stereo Creator Microphone: Stereo
• Manufactured under license from Speaker: Monaural
Dolby Laboratories. Exif Print: Compatible
Movies (MP4 format): PRINT Image Matching III:
Video: MPEG-4 AVC/H.264 Compatible
Audio: MPEG-4 AAC-LC 2ch
Model information table
Model
Destination US CND, E, KR
Color system NTSC NTSC
TransferJet
• Abbreviation
CH : Chinese model
CND : Canadian model
KR : Korea model
DSC-WX150_L2
SPECIFICATIONS
AC Adaptor AC-UB10/UB10B
Power requirements: AC 100 V to
240 V, 50 Hz/60 Hz, 70 mA
Output voltage: DC 5 V, 0.5 A
Operating temperature:
0 °C to 40 °C (32 °F to 104 °F)
Storage temperature:
–20 °C to +60 °C (–4 °F to +140 °F)
Dimensions:
Approx. 50 mm × 22 mm × 54 mm
(2 inches × 7/8 inches × 2 1/4 inches)
(W/H/D)
Mass:
For the USA and Canada:
Approx. 48 g (1.7 oz)
For countries or regions other than
the USA and Canada:
Approx. 43 g (1.5 oz)
Rechargeable battery pack
NP-BN
Used battery: Lithium-ion battery
Maximum voltage: DC 4.2 V
Nominal voltage: DC 3.6 V
Maximum charge voltage: DC 4.2 V
Maximum charge current: 0.9 A
Capacity:
typical: 2.3 Wh (630 mAh)
minimum: 2.2 Wh (600 mAh)
Design and specifications are subject to
change without notice.
DSC-WX150
UK, CH AEP, E
PAL PAL
Caution
Danger of explosion if battery is incorrectly replaced.
Replace only with the same or equivalent type.
Dispose of used batteries according to the instructions.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH
MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST
ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPO-
NENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY
SONY.
After correcting the original service problem, perform the following
safety checks before releasing the set to the customer.
1. Check the area of your repair for unsoldered or poorly-soldered
connections. Check the entire board surface for solder splashes and
bridges.
2. Check the interboard wiring to ensure that no wires are "pinched"
or contact high-wattage resistors.
3. Look for unauthorized replacement parts, particularly transistors,
that were installed during a previous repair. Point them out to the
customer and recommend their replacement.
4. Look for parts which, through functioning, show obvious signs of
deterioration. Point them out to the customer and recommend their
replacement.
5. Check the B+ voltage to see it is at the values specified.
6. Flexible Circuit Board Repairing
• Set the soldering iron tip temperature to 350 °C approximately.
• Do not touch the soldering iron on the same conductor of the circuit
board (within 3 times).
• Be careful not to apply force on the conductor when soldering or
unsoldering.
– 2 –
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE 0 SUR LES
DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT
CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE REM-
PLACER CES COMPOSANTS QUE PAR DES PIÈCES SONY DONT
LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU DANS LES
SUPPLÉMENTS PUBLIÉS PAR SONY.
SAFETY CHECK-OUT
UNLEADED SOLDER
This unit uses unleaded solder.
Boards requiring use of unleaded solder are printed with the lead free
mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with the
lead free mark due to their particular size.)
: LEAD FREE MARK
Be careful to the following points to solder or unsolder.
• Set the soldering iron tip temperature to 350 °C approximately.
If cannot control temperature, solder/unsolder at high temperature
for a short time.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
Unleaded solder is more viscous (sticky, less prone to
flow) than ordinary solder so use caution not to let solder
bridges occur such as on IC pins, etc.
• Be sure to control soldering iron tips used for unleaded solder and
those for leaded solder so they are managed separately. Mixing un-
leaded solder and leaded solder will cause detachment phenomenon.