Table of Contents
Advertisement
Quick Links
Advertisement
Table of Contents
Subscribe to Our Youtube Channel
Related Manuals for F&S efus A9X
Summary of Contents for F&S efus A9X
- Page 1 Hardware Documentation efus™A9X for HW Revision 1.12 and 1.20 and 1.30 efus™A9Xr2 for HW Revision 1.00 Version 260 (2022-10-20) © F&S Elektronik Systeme GmbH Untere Waldplätze 23 D-70569 Stuttgart Fon: +49(0)711-123722-0 Fax: +49(0)711-123722-99...
-
Page 2: About This Document
About This Document This document describes how to use the efus™ start interface board with mechanical and electrical information. The latest version of this document can be found at: http://www.fs-net.de. Important Note! The latest PCB version for efusA9X is Version 1.30, for efusA9Xr2 is Version 1.00. The only difference between these two modules is their Gbit Ethernet PHY’s. -
Page 3: Esd Requirements
History Date Platform A,M,R Chapter Description 02.09.15 Initial Version 08.10.15 Correct JAE connector order number 18.12.15 Add second LAN 15.06.16 Remove HDMI 29.08.16 Add missing description pin 25..27, add max. current 4.12 Remove unsupported MIPI-CSI Add LVDS connector as device on I2C_C Specify height of parts Change WIFI/ SD_A to eMMC/ SD_A for HW 1.20 11, 15... -
Page 4: Table Of Contents
Table of Contents About This Document ESD Requirements History Table of Contents Block diagram Mechanical dimension Interface and signal description Goldfinger-connector ..................7 Interfaces USB host ......................15 USB device ......................15 CAN Bus ......................15 SD/MMC card ....................16 SPI ........................17 I2C ........................18 Serial ports ......................19 I2S audio codec interface ................19 Ethernet ......................20 4.10... - Page 5 10.1 Absolute maximum ratings ................30 10.2 DC electrical characteristics for 3.3V IO pins ..........30 Review service ESD and EMI implementing on COM Second source rules Storage conditions ROHS and REACH statement Packaging Matrix Code Sticker Differences efusA9X vs efusA9Xr2 Appendix Important Notice ......................34 Warranty Terms......................34 Hardware Documentation efusA9X+efusA9Xr2...
-
Page 6: Block Diagram
Block diagram 5V Power In DDR3 USB 2.0 Device/Host SLC NAND Flash up USB 2.0 Host to 1GB or Quad SPI LAN Phy LAN (10/100/1000Mb) eMMC up to 32GB LAN Phy LAN (10/100/1000Mb) RGB LCD 18bit Ext. RTC Single Channel LVDS 24bit Freescale i.MX 6SoloX Digital Camera... -
Page 7: Mechanical Dimension
Mechanical dimension Figure 2: Mechanical dimensions Size: 62.11mm x 47mm PCB thickness: 1.2 ± 0.1mm Height of the parts on the top side: max. 4.5 mm (except Jtag connector not mounted on mass production) Height of the parts on the bottom side: max. -
Page 8: Interface And Signal Description
Interface and signal description Goldfinger-connector See also efus start interface documentation for more information. Pin Use on base board Remarks; onboard pullups 1.12-> 1.20 change +5V Power In +5V Power In +5V Power In +5V Power In +5V Power In +5V Power In VBAT In RTC battery input... - Page 9 Pin Use on base board Remarks; onboard pullups 1.12-> 1.20 change SD_A_CLK O5*# CAN_A_TX CAN_A_RX SD_A_DAT0 I/O*# SD_A_DAT1 I/O *# CAN_B_TX CAN_B_RX MPCIE_CTX_P Odiff # MPCIE_CTX_N Odiff # MPCIE_CRX_P Idiff # EXT_PROG MPCIE_CRX_N Idiff # SPI_B_MISO SPI_B_MOSI MPCIE_CLK_P Odiff # SPI_B_SPCK MPCIE_CLK_N Odiff #...
- Page 10 Pin Use on base board Remarks; onboard pullups 1.12-> 1.20 change SPI_B_IRQ1 100k pull-up MPCIE_WAKE SPI_B_IRQ2 100k pull-up SD_B_DAT2 I/O* SPI_A_MISO SD_B_DAT3 I/O * SPI_A_MOSI SD_B_CMD 100k pull-up SPI_A_SPCK SD_B_VCC 3.3V out for SD-Card B SPI_A_CS1 SD_B_CLK SPI_A_CS2 SPI_A_IRQ1 100k pull-up SD_B_DAT0 I/O* 100k pull-up...
- Page 11 Pin Use on base board Remarks; onboard pullups 1.12-> 1.20 change LCD_CLK TXD_A_TTL Debug RXD_D_TTL LCD_HSYNC TXD_D_TTL LCD_VSYNC 100 GND 101 GND 102 RXD_B_TTL 103 LCD_R0 104 TXD_B_TTL 105 LCD_R1 106 RTS_B_TTL 107 LCD_R2 108 CTS_B_TTL 109 LCD_R3 110 GND 111 LCD_R4 112 I2S_MCLK 113 LCD_R5...
- Page 12 Pin Use on base board Remarks; onboard pullups 1.12-> 1.20 change 126 I2S_DIN 127 LCD_G5 128 GND 129 GND 130 I2C_C_DAT 4.7k pull up 131 LCD_B0 132 I2C_C_CLK 4.7k pull up 133 LCD_B1 134 DVI_DDC_VOUT 3.3V output for DDC 135 LCD_B2 136 GND 137 LCD_B3 138 NC...
- Page 13 Pin Use on base board Remarks; onboard pullups 1.12-> 1.20 change 156 NC LVDS_TX3_DN available on a special version with minimum order quantity 157 I2C_A_RST 100k pull up 158 NC 159 GND 160 GND 161 CAM_YDATA0 optional parallel camera signal 162 ETH_B_D4_N I/Odiff 163 CAM_YDATA1...
- Page 14 Pin Use on base board Remarks; onboard pullups 1.12-> 1.20 change 189 CAM_VCAM Camera interface voltage out (default 2.8V) Other voltages on request 190 ETH_A_D4_P I/Odiff 191 CAM_HREF I/O(*) parallel camera signal 192 ETH_A_LED_ACT LINK/ACT (on with link, blinking with activity) 193 CAM_PWDN parallel camera signal 194 ETH_A_D3_N...
- Page 15 Pin Use on base board Remarks; onboard pullups 1.12-> 1.20 change 220 NC 221 USB_DEV_OC 222 NC 223 USB_DEV_ID 100k pull up 224 GND 225 USB_DEV_N I/Odiff 226 NC 227 USB_DEV_P I/Odiff 228 NC 229 GND 230 GND Table 1: 230 pin goldfinger connector 3.3V 5mA logic output 3.3V logic input Idiff, Odiff, I/Odiff:...
-
Page 16: Interfaces
Interfaces USB host The 90 Ohm differential pair of USB signals doesn't need any termination. For external ports ESD and EMV protection is required nearby the USB connector. USB_A_PWRON High active USB port power on signal USB_A_N Differential USB Signal USB_A_P USB device The 90 Ohm differential pair of USB signals don't need any termination. -
Page 17: Sd/Mmc Card
SD/MMC card The interface is supporting a SD card channel. For specification and licensing please refer the website of the SD Association http://www.sdcard.org. Unused signals should be left unconnected. No. Name Description Onboard PU SD_A_WP SD card A write protect input SD_A_CD SD card A card low active detect input SD_A_DAT2... -
Page 18: Spi
The module support 2 HS SPI (Serial Peripheral Interface) with 2 chip selects and 2 interrupt inputs. All signals are 3.3V compliant and do have pull-up on module. Devices on baseboard with other voltage need a level shifter. Name Description Onboard PU SPI_B_MISO SPI port B MISO... - Page 19 The module supports a I2C interface as I2C master. Signals are 3.3V compliant and do have pull-up on module. Devices on baseboard with other voltage need a level shifter. I2C_B_DAT Data signal 4k7 PU onboard I2C_B_CLK Clock signal 4k7 PU onboard I2C_B_IRQ Optional interrupt input 100k PU onboard...
-
Page 20: Serial Ports
Serial ports RXD_A_TTL UART A RX, Debug interface, 100k pull-up onboard TXD_A_TTL UART A TX, Debug interface RXD_B_TTL UART B RX TXD_B_TTL UART B TX RTS_B_TTL UART B RTS CTS_B_TTL UART B CTS RXD_C_TTL UART C RX *n/a with on board WLAN/BT TXD_C_TTL UART C TX * n/a with on board WLAN/BT... -
Page 21: Ethernet
Ethernet The module supports 2 10/100/1000 Mbit LAN interfaces. The only difference between these two modules is their Gbit Ethernet PHY’s. efus™A9X Qualcomm Atheros AR8035 efus™A9Xr2 Realtek RTL8211F/D ETH_CTREF Common power pin for both LAN transformer ETH_A_D4_N Differential data line ETH_A_D4_P ETH_A_LED_ACT LINK/ACT (on with link, blinking with activity), serial R needed... -
Page 22: Pcie
4.10 PCIe A single lane PCI Express port (Gen 2.0) is supported. Please following design rules from PCI-SIG on your design. MPCIE_CTX_P PCIe transmit differential pair MPCIE_CTX_N MPCIE_CRX_P PCIe receive differential pair MPCIE_CRX_N MPCIE_CLK_P PCIe clock differential pair MPCIE_CLK_N MPCIE_PERST PCIe Reset out MPCIE_WAKE PCIe wake input... -
Page 23: Rgb Lcd
4.11 RGB LCD BL_CTRL 3.3V CMOS PWM output for Backlight dimming VCFL_ON CMOS 3.3V high active Backlight on LCD_CLK RGB LCD clock LCD_HSYNC RGB LCD HSYNC LCD_VSYNC RGB LCD VSYNC LCD_R0 Red0 LCD_R1 Red1 LCD_R2 Red2 LCD_R3 Red3 LCD_R4 Red4 LCD_R5 Red5 LCD_G0... -
Page 24: Parallel Camera (Csi)
4.12 Parallel Camera (CSI) Note: because an HW failure this pinout is just working HW Revision ≥1.20! n.a./ I (2.8V) CPU pad QSPI1A_SS0 CAM_YDATA0 n.a./ I (2.8V) CPU pad QSPI1A_SCLK CAM_YDATA1 CAM_YDATA4 I (2.8V) CPU pad CSI_DATA02 CAM_YDATA3 I (2.8V) CPU pad CSI_DATA01 CAM_YDATA5 I (2.8V) -
Page 25: Misc
4.14 MISC V33-Enable 3.3V/100mA Vout, use as enable for main board 3.3V regulator if more current is required ACOK USB OTG charge detect, future use !RESET_IN 3.3V 100k pull-up on module drives with OC/OD to GND. Leave open if not used. !RESET_OUT 4.7k pull down, active low reset for baseboard logic PWM_A... -
Page 26: I2C Eeprom
I2C EEPROM This component is optional and not mounted in all configurations. Please contact sales to get more information. Power +5V Power In VCC in, 5V +/-5% GND, connect all GND pins to GND plane VBAT In RTC battery input. Leave open if not used V33-Enable 3.3V/max. -
Page 27: Lvds-Connector
LVDS-connector The LVDS display port can be direct connected to a LVDS 18 or 24 bit single channel. Display is independent from RGB LCD. JILI30 JAE FI-X30SSLA Connector or compatible GF pin option Function 28..30 VLCD (3.3V or 5V software configurable, max. 300mA) 7,14,17,24 LVDS0_DATA0- LVDS0_DATA0+... -
Page 28: Lvds Emi Filtering
LVDS EMI filtering The following schematic shows the internal connection of LVDS signals between connector and CPU. The common mode chokes are TDK MCZ2010CH240L4T, Panasonic EXC- 28CG240U or equivalent parts. | 27 Hardware Documentation efus™A9X+ efus™A9Xr2... -
Page 29: Wlan/ Bt
WLAN/ BT Starting HW Revision 1.20 efusA9X can provide a 802.11b/g/n/ac and BT4.1 + HS “Smart Ready” BLE solution based on QCA9377 chipset with U.FL connector for an external antenna on module. “Letter of Conformity” for this RF functionality excluding 802.11ac is available from our homepage. -
Page 30: Rtc
P/N: AH104N2450D1 Peak gain: 2.1 dBi (2.4GHz), 2.4 dBi (5GHz) RF exposure considerations Consistent with §2.909(a), the following text must be included within the user’s manual or operator instruction guide for the final commercial product: This modular complies with FCC RF radiation exposure limits set forth for an uncontrolled environment. -
Page 31: Electrical Characteristic
10 Electrical characteristic VCC: 5V +/- 5% VBAT In for RTC: 2.2 … 3.45V power consumption typical current consumption BATT: 3 µA maximum power consumption BATT: 10 µA @25°C Thermal design power (summary all chips) With 1GHz SoloX CPU 5.5 Watt @25°C Additional with Wifi mounted +1.6 Watt @25°C Maximum output current VLCD... - Page 32 11 Review service F&S provide a schematic review service for your baseboard implementation. Please send your schematic as searchable PDF to support@fs-net.de. 12 ESD and EMI implementing on COM Like all other COM modules at the market there is no ESD protection on any signal out from the COM module.
- Page 33 16 Packaging All F&S ESD-sensitive products are shipped either in trays or bags. efus™ modules are shipped in trays. One tray can hold 10 boards. An empty tray is used as top cover. Figure 3: Tray for shipment 17 Matrix Code Sticker All F&S hardware is shipped with a matrix code sticker including the serial number.
- Page 34 18 Differences efusA9X vs efusA9Xr2 The difference between efusA9X and efusA9Xr2 is the Ethernet Phy. efusA9X Qualcomm AR8035-AL1 efusA9Xr2 Realtek RTL8211FD Both Phys are Gbit Phys and are connected by RGMII interface to CPU. All frequencies are the same. In the below picture we marked the area with changes. Figure 5: efusA9X (top) vs efusA9Xr2 (bottom) | 33 Hardware Documentation efus™A9X+ efus™A9Xr2...
- Page 35 19 Appendix Important Notice The information in this publication has been carefully checked and is believed to be entirely accurate at the time of publication. F&S Elektronik Systeme assumes no responsibility, however, for possible errors or omissions, or for any consequences resulting from the use of the information contained in this documentation.
- Page 36 Disclaimer of Warranty THIS WARRANTY IS MADE IN PLACE OF ANY OTHER WARRANTY, WHETHER EXPRESSED, OR IMPLIED, OF MERCHANTABILITY, FITNESS FOR A SPECIFIC PURPOSE, NON-INFRINGEMENT OR THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION, EXCEPT THE WARRANTY EXPRESSLY STATED HEREIN. THE REMEDIES SET FORTH HEREIN SHALL BE THE SOLE AND EXCLUSIVE REMEDIES OF ANY PURCHASER WITH RESPECT TO ANY DEFECTIVE PRODUCT.
Need help?
Do you have a question about the efus A9X and is the answer not in the manual?
Questions and answers