Toshiba D-VR40SF Service Manual page 9

3. The flat pack-IC on the BOARD is affixed with
glue, so be careful not to break or damage the foil
of each pin or the solder lands under the IC when
removing it.
BOARD
Masking
Tape
Tweezers
With Soldering Iron:
1. Using desoldering braid, remove the solder from
Hot-air
Flat Pack-IC
Desoldering
Machine
Flat Pack-IC
2. Lift each lead of the flat pack-IC upward one by
Fig. S-1-2
3. Bottom of the flat pack-IC is fixed with glue to the
4. Release the flat pack-IC from the BOARD using
1-4-2
all pins of the flat pack-IC. When you use solder
flux which is applied to all pins of the flat pack-IC,
you can remove it easily. (Fig. S-1-3)
Desoldering Braid
Flat Pack-IC
one, using a sharp pin or wire to which solder will
not adhere (iron wire). When heating the pins, use
a fine tip soldering iron or a hot air desoldering
machine. (Fig. S-1-4)
Fine Tip
Soldering Iron
BOARD; when removing entire flat pack-IC, first
apply soldering iron to center of the flat pack-IC
and heat up. Then remove (glue will be melted).
(Fig. S-1-6)
tweezers. (Fig. S-1-6)
Soldering Iron
Fig. S-1-3
Sharp
Pin
Fig. S-1-4
DVDN_SN