Printed Wiring Board - Main Board (Side B) - Sony MDS-SE9 Service Manual

7-6. PRINTED WIRING BOARD – MAIN BOARD (SIDE B) –
1
A
R
IN A
L
MD/TAPE
R
B
OUT B
L
SYSTEM
CONTROL
DIGITAL IN
OPTICAL
C
IC 441
MD
C
DIGITAL OUT
OPTICAL
D
IC 442
D
• See page 41 for Circuit Boards Location.
2 3
(FOR FLASH WRITER)
9 1
E
E
1
1 7
21 1
IC 151
22
42
E
1
IC 102
2 16
1 15
CN101
F
POWER
BOARD
CN152
(Page 56)
• : Uses unleaded solder.
4
TAPE
MECHANISM
DECK(1/2)
3
IC 121
IC 402
IC 401
E
E
E
E
E
E
1 9
IC 301
(TAPE SPEED ADJUST)
3
E
1 5
1 3 E
IC 111 IC 101
• Semiconductor Location
Ref. No. Location Ref. No. Location
D101 C-4
D102 C-3
D103 C-3
D104 C-3
D105 C-3
D106 B-4
D121 B-3
D122 A-3
D201 C-5
D321 C-4
49 49
5 6
MD DIGITAL MD DIGITAL
BOARD BOARD
CN703 CN705
(Page 52) (Page 52)
C D
IC 403
IC 201
E
9
E
E
Ref. No. Location Ref. No. Location
D322 C-4 IC111 D-4 IC442 C-2
D431 B-2 IC121 B-3
D432 B-2 IC151 C-2 Q121 B-3
D433 B-2 IC201 C-6 Q251 D-5
D434 B-2 IC202 D-6 Q252 D-5
D435 B-4 IC301 C-4 Q253 D-5
D436 B-4 IC401 B-4 Q254 D-5
IC402 B-5 Q255 D-5
IC101 D-4 IC403 B-5 Q321 B-4
IC102 C-3 IC441 C-2 Q322 C-4
MDS-SE9
7
G
PANEL
BOARD
CN801
(Page 54)
(RECORD BIAS ADJUST (R-CH))
(RECORD BIAS ADJUST (L-CH))
TAPE
MECHANISM
DECK(2/2)
1
IC 202
Ref. No. Location
Q323 B-4
Q324 C-3
Q421 B-4
Q422 B-4
Q431 B-2
Q432 C-2