Akai LCT3785TAJ Service Manual page 69

Digital Power Amplifier
６．Absolute Maximum Rating(Table.2)
Symbol
VD max Maximum VD Voltage
HB max Maximum HB Voltage
Pd
Power dispassion
θja
Thermal Resistance
Tj
Junction temperature
Ta
Operating ambient
temperature
Tstg
Storage temperature
Fig.3 Thermal De-rating
Pd
10.4W
6.3W
4.2W
2.5W
1.6W
1.0W
0
(NOTE)
PCB pattern design for high effective thermal conductivity
(1)The exposed die pad is directly soldered with the printed-circuit board pattern .
(2)Thermal Via
R2S15102NP
Parameter
VD1,VD2 pin volta
HB1、HB2 pin voltage
Ta = 25°C :See Fig.3
See Fig.3
Ma
Temperature range
Temperature range
(on PCB: printed-circuit board ):Size 75mm x 75mm
25℃
PCB
Thermal Via
Condition
ge
ximum Temperature
With Infinite Heat Sink
the ideal condition(θjc=12 ℃/W)
Without External Heat Sink(1)
Double PCB copper planes(t=0.035mm) are
needed and each size is almost 7５mm X 7５mm.
(θｊａ＝３０℃／Ｗ,4layer PCB）
Without External Heat Sink(2)
75℃
67／126
Value Unit
27
40
4.2
30
℃/W
150
-20〜75
-40〜150
There is no copper plane and
no thermal treatment.
( 1layer PCB)
Ta
150℃
(caution)
There are side expositions of
the die pad at corners of the
package.
(The die pad is grounded.)
V
V
W
℃
℃
℃