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UM960 User Manual Revision History Version Revision History Date R1.0 First release Sep., 2022...
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Unicore holds the trademarks of “和芯星通”,“UNICORECOMM” and other trade name, trademark, icon, logo, brand name and/or service mark of Unicore products or their product serial referred to in this manual (collectively “Unicore Trademarks”).
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UM960 User Manual Foreword This document describes the information of the hardware, package, specification and the use of Unicore UM960 modules. Target Readers This document applies to technicians who possess the expertise on GNSS receivers.
UM960 User Manual 1 Introduction UM960 is a new generation of GNSS high precision positioning RTK module from Unicore. It supports all constellations and multiple frequencies, and can simultaneously track BDS B1I/B2I/B3I + GPS L1/L2/L5 + GLONASS L1/L2+Galileo E1/E5a/E5b + QZSS L1/L2/L5 + SBAS.
Key Features High precision, compact size and low power consumption Based on the new generation GNSS SoC -NebulasIV , with RF-baseband and high precision algorithm integrated 16.0 mm × 12.2 mm × 2.6 mm, surface-mount device Supports all-constellation multi-frequency on-chip RTK positioning solution ...
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UM960 User Manual Observation Accuracy(RMS) GLONASS Galileo B1I/ L1C/A /G1/E1 Pseudorange 10 cm 10 cm 10 cm 10 cm 1 mm 1 mm 1 mm 1 mm B1I/ L1C/A /G1/E1 Carrier Phase B2I/L2P/G2/E5b Pseudorange 10 cm 10 cm 10 cm...
NebulasIV SoC NebulasIV is UNICORECOMM’s new generation high precision GNSS SoC with 22 nm low power design, supporting all constellations, multiple frequencies and 1408 super channels. It integrates a 2 GHz dual CPU, a high speed floating point processor and an RTK co-processor, which can fulfill the high precision baseband processing and RTK positioning independently.
UM960 User Manual Pin Definition Figure 2-2 UM960 Pin Definition Table 2-2 Pin Definition Description Reserved, must be floating; cannot connect — ground or power supply or peripheral I/O Reserved, must be floating; cannot connect — ground or power supply or peripheral I/O...
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Description VCC_RF External LNA power supply — Ground ANT_IN GNSS antenna signal input — Ground — Ground RTK_STAT: High level, RTK Fix; Low level, RTK No Fix LAN_EN: High level, enable external LNA; RTK_STAT/LAN_EN Low level, disable external LNA; Note: The pin function is configured by protocol. The default is RTK_STAT.
UM960 User Manual Electrical Specifications 2.3.1 Absolute Maximum Ratings Table 2-3 Absolute Maximum Ratings Parameter Symbol Min. Max. Unit Power Supply (VCC) -0.3 Voltage Input -0.3 GNSS Antenna Signal Input ANT_IN -0.3 RF Input Power ANT_IN input Consumption of Antenna...
2.3.2 Operational Conditions Table 2-4 Operational Conditions Parameter Symbol Min. Typ. Max. Unit Condition Power Supply (VCC) Maximum Ripple Voltage Working Current VCC = 3.3 V VCC_RF Output Voltage VCC_RF VCC-0.1 VCC_RF Output Current ICC_RF Operating Temperature ° C Power Consumption 2.3.3 IO Threshold Table 2-5 IO Threshold Parameter...
3 Hardware Design Antenna Feed Design UM960 just supports feeding the antennal from the outside of the module rather than the inside. It is recommended to use devices with high power and that can withstand high voltage. Gas discharge tube, varistor, TVS tube and other high-power protective devices may also be used in the power supply circuit to further protect the module from lighting strike and surge.
Grounding and Heat Dissipation Grounding and heat dissipation pad Figure 3-2 Grounding and Heat Dissipation Pad The 55 pads in the rectangle in Figure 3-2 are for grounding and heat dissipation. In the PCB design, they must connect to a large sized ground to strengthen the heat dissipation.
UM960 User Manual 4 Production Requirement Recommended soldering temperature curve is as follows: Rising Preheating Reflux Cooling ° C Peak 245 ° C 40 to 60s 60 to120s Max. 4° C/s Max. 3° C/s Time (s) Figure 4-1 Soldering Temperature (Lead-free) Temperature Rising Stage ...
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In order to prevent falling off during soldering of the module, do not solder it on the back of the board during design, that is, better not go through soldering cycle twice. The setting of soldering temperature depends on many factors of the factory, ...
Figure 5-1 Label Description Product Packaging The UM960 module uses carrier tape and reel (suitable for mainstream surface mount devices), packaged in vacuum-sealed aluminum foil antistatic bags, with a desiccant inside to prevent moisture. When using reflow soldering process to solder modules, please strictly comply with IPC standard to conduct humidity control.
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Thickness: 2.0 mm Carrier Tape Space between (center-to-center distance): 20 mm The UM960 is rated at MSL level 3. Refer to the relevant IPC/JEDEC J-STD-033 standards for the package and operation requirements. You may access to the website www.jedec.org to get more information.
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