Outline Dimensions; Ordering Guide - Analog Devices SSM2319 Manual

OUTLINE DIMENSIONS

A1 BALL
CORNER

ORDERING GUIDE

Model
1
SSM2319CBZ-R2
SSM2319CBZ-REEL 1
1
SSM2319CBZ-REEL7
EVAL-SSM2319Z 1
1 Z = RoHS Compliant Part.
1.490
1.460 SQ
1.430
TOP VIEW
0.385
(BALL SIDE DOWN)
0.360
0.335
Figure 42. 9-Ball Wafer Level Chip Scale Package [WLCSP]
Dimensions shown in millimeters
Temperature Range
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
0.655
0.600
0.545
SEATING
PLANE
0.350
0.320
0.290
0.50
BALL PITCH
0.270
0.240
0.210
(CB-9-2)
Package Description
9-Ball Wafer Level Chip Scale Package [WLCSP]
9-Ball Wafer Level Chip Scale Package [WLCSP]
9-Ball Wafer Level Chip Scale Package [WLCSP]
Evaluation Board
Rev. 0 | Page 17 of 20
3 2 1
A
B
C
BOTTOM VIEW
(BALL SIDE UP)
Package Option
CB-9-2
CB-9-2
CB-9-2
SSM2319