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Conclusion
We validated the possibility of cracking tendencies through various tests. Various products, Environments, and characteristics of
tools can cause errors and affect test results.
However, the most important conclusion that can be deduced from the tests is that special caution against mechanical damage
and handling errors should be taken from the point of unpacking modules to inserting into the sockets on system boards.
Recent memory module products are structurally weak to external damage due to the increasing numbers of ICs and passive
components and the unit's diminishing size.
It's difficult to predict and find out clear root causes of failures related with BOC PKG passive components due to many variances
and circumstances. However, the above guidelines for memory module handling based on test results should help with crack-
related problems and make more effective process control possible.
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Copyright © 2018 Samsung Electronics Co., Ltd. All rights reserved. Samsung is a registered trademark of Samsung Electronics Co., Ltd. Specifications and designs are subject to
change without notice. Nonmetric weights and measurements are approximate. All data were deemed correct at time of creation. Samsung is not liable for errors or omissions. All
brand, product, service names and logos are trademarks and/or registered trademarks of their respective owners and are hereby recognized and acknowledged.
Fio is a registered trademark of Fio Corporation. Intel is a trademark of Intel Corporation in the U.S. and/or other countries. Linux is a registered trademark of Linus Torvalds. PCI
Express and PCIe are registered trademarks of PCI-SIG. Toggle is a registered trademark of Toggle, Inc.
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