Lenovo ThinkPad T60 2007 Hardware Maintenance Manual page 114

Removing and replacing a FRU
Following components soldered on the top side of the system board are extremely
sensitive. When you service the system board, avoid any kind of rough handling.
Bending or flexing the system board can cause ball grid array (BGA) connections
to crack (unzip).
108
MT 1951, 1952, 1953, 1954, 1955, 1956, 2007, 2008, 2009, 2613, 2623, and 2637
a
Accelerometer chip for the HDD Active Protection System
b
Security chip
c
CPU
d
Video chip
e
MCH (Memory Controller Hub)
f
ICH (I/O Controller Hub)
c
d
f
e
b a