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WCSP-Packaged bq24272/273 Evaluation Modules
The bq24272/273 evaluation module is a complete charger module for evaluating compact, flexible, high-
efficiency, switch-mode charge management solution for single-cell, Li-ion and Li-polymer batteries used
in a wide range of portable applications.
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C is a trademark of Philips Electronics N.V.
SLUU916 - April 2012
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Copyright © 2012, Texas Instruments Incorporated
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List of Tables
WCSP-Packaged bq24272/273 Evaluation Modules
User's Guide
SLUU916 - April 2012
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Summary of Contents for Texas Instruments WCSP-Packaged bq24272
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Page 1: Table Of Contents
Second Internal Layer ....................... Bottom Layer List of Tables ..................... Bill of Materials - HPA759A C is a trademark of Philips Electronics N.V. SLUU916 – April 2012 WCSP-Packaged bq24272/273 Evaluation Modules Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated... -
Page 2: Introduction
IN operating range of 4.2 V – 10 V • LED indication for status signals • Test points for key signals available for testing purposes. Easy probe hook-up. WCSP-Packaged bq24272/273 Evaluation Modules SLUU916 – April 2012 Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated... -
Page 3: Schematic
Introduction www.ti.com Schematic Figure 1. bq24272/273EVM (HPA759) Schematic (Sheet 1 of 2) SLUU916 – April 2012 WCSP-Packaged bq24272/273 Evaluation Modules Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated... -
Page 4: Bq24272/273Evm (Hpa759) Schematic (Sheet 2 Of 2)
NOTE: EVMs with a printed-circuit board label that contain the suffix -X may have been assembled with incorrectly marked ICs. Regardless of the IC’s marking, the EVM was assembled with the correct part number as specified in the EVM bill of material. WCSP-Packaged bq24272/273 Evaluation Modules SLUU916 – April 2012 Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated... -
Page 5: I/O Description
Kelvin to VIN AGND Kelvin to SYS (bq24272 only) PGND PGND Kelvin to BAT TP10 TP11 AGND TP12 AGND TP13 TP14 TP15 TP16 STAT SLUU916 – April 2012 WCSP-Packaged bq24272/273 Evaluation Modules Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated... -
Page 6: Control And Key Parameters Setting
IN(MAX) via I2C communication) Fast charge current, Battery charge current (registers set via I2C communication) 0.550 CHRG(MAX) Operating junction temperature range, T °C WCSP-Packaged bq24272/273 Evaluation Modules SLUU916 – April 2012 Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated... -
Page 7: Test Summary
Observe if A, B occur. If they do not occur, the unit under test has failed. Assembly drawings have locations for jumpers, test points, and individual components. SLUU916 – April 2012 WCSP-Packaged bq24272/273 Evaluation Modules Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated... -
Page 8: Recommended Test Equipment
A computer with at least one USB port and a USB cable is required. The bq2427x evaluation software must be properly installed. 2.2.6 HPA172 Communication Kit (USB TO GPIO) An HPA172 USB-to-I C communication kit is required. WCSP-Packaged bq24272/273 Evaluation Modules SLUU916 – April 2012 Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated... -
Page 9: Recommended Test Equipment Setup
Computer To EVM USB port Figure 4. Connections of HPA172 Kit 9. Ensure jumpers are at the default factory settings per Section 1.6 SLUU916 – April 2012 WCSP-Packaged bq24272/273 Evaluation Modules Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated... -
Page 10: Original Test Setup For Bq24272/273Evm (Hpa759)
Elec Load/ í Res Box í PS#2 CM#2 VM#2 í BAT_Load CHRG í í VM#4 Figure 5. Original Test Setup for bq24272/273EVM (HPA759) WCSP-Packaged bq24272/273 Evaluation Modules SLUU916 – April 2012 Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated... -
Page 11: Main Window Of Bq2427Xsw Evaluation Software
11. Turn on the computer. Open the bq2427x evaluation software and click "IN DEVICE" when prompted at start-up. The main window of the software is shown in Figure Figure 6. Main Window of bq2427xSW Evaluation Software SLUU916 – April 2012 WCSP-Packaged bq24272/273 Evaluation Modules Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated... -
Page 12: Recommended Test Procedure
Measure on CM #1 → I < 850 mA Observe → D1 and D2 are on. 10. Turn off PS #1 and PS #2. WCSP-Packaged bq24272/273 Evaluation Modules SLUU916 – April 2012 Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated... -
Page 13: Printed-Circuit Board Layout Guideline
7. For high-current applications, the balls for the power paths must be connected to as much copper in the board as possible. This allows better thermal performance because the board conducts heat away from the IC. SLUU916 – April 2012 WCSP-Packaged bq24272/273 Evaluation Modules Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated... -
Page 14: Bill Of Materials And Board Layout
Resistor, chip, 1/16W, 1% 0402 R7, R8 1.50 kΩ Resistor, chip, 1/16W, 1% 0603 50 kΩ Potentiometer, 3/8 cermet, single-turn 0.25 × 0.17 in 3266W-1-503LF Bourns WCSP-Packaged bq24272/273 Evaluation Modules SLUU916 – April 2012 Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated... - Page 15 QFN-24 BQ24273RGE with power-path management – Shunt, 100 mil, Black 0.100 929950-00 – PCB 3.00 in × 3.00 in × 0.062 in HPA759 SLUU916 – April 2012 WCSP-Packaged bq24272/273 Evaluation Modules Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated...
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Page 16: Board Layout
Bill of Materials and Board Layout www.ti.com Board Layout Figure 7. Top Assembly Layer Figure 8. Top Layer WCSP-Packaged bq24272/273 Evaluation Modules SLUU916 – April 2012 Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated... -
Page 17: First Internal Layer
Bill of Materials and Board Layout www.ti.com Figure 9. First Internal Layer Figure 10. Second Internal Layer SLUU916 – April 2012 WCSP-Packaged bq24272/273 Evaluation Modules Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated... -
Page 18: Bottom Layer
Bill of Materials and Board Layout www.ti.com Figure 11. Bottom Layer WCSP-Packaged bq24272/273 Evaluation Modules SLUU916 – April 2012 Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated... - Page 19 Any exceptions to this are strictly prohibited and unauthorized by Texas Instruments unless user has obtained appropriate experimental/development licenses from local regulatory authorities, which is responsibility of user including its acceptable authorization.
- Page 20 FCC Interference Statement for Class B EVM devices This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications.
- Page 21 Also, please do not transfer this product, unless you give the same notice above to the transferee. Please note that if you could not follow the instructions above, you will be subject to penalties of Radio Law of Japan. Texas Instruments Japan Limited (address) 24-1, Nishi-Shinjuku 6 chome, Shinjuku-ku, Tokyo, Japan http://www.tij.co.jp...
- Page 22 FDA Class III or similar classification, then you must specifically notify TI of such intent and enter into a separate Assurance and Indemnity Agreement. Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2012, Texas Instruments Incorporated...
- Page 23 Any exceptions to this are strictly prohibited and unauthorized by Texas Instruments unless user has obtained appropriate experimental/development licenses from local regulatory authorities, which is responsibility of user including its acceptable authorization.
- Page 24 FCC Interference Statement for Class B EVM devices This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications.
- Page 25 Also, please do not transfer this product, unless you give the same notice above to the transferee. Please note that if you could not follow the instructions above, you will be subject to penalties of Radio Law of Japan. Texas Instruments Japan Limited (address) 24-1, Nishi-Shinjuku 6 chome, Shinjuku-ku, Tokyo, Japan http://www.tij.co.jp...
- Page 26 FDA Class III or similar classification, then you must specifically notify TI of such intent and enter into a separate Assurance and Indemnity Agreement. Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2012, Texas Instruments Incorporated...
- Page 27 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue.
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