Figure 3-9: Recommended Solder Reflow Profile; Table 3-6: Recommended Solder Processing Parameters - PNI RM3100 User Manual

Table 3-6: Recommended Solder Processing Parameters

Parameter
Preheat Temperature, Minimum
Preheat Temperature, Maximum
Preheat Time (T
Solder Melt Temperature
Ramp-Up Rate (T
Peak Temperature
Time from 25°C to Peak (T
Time above T
Soak Time (within 5°C of T
Rampdown Rate
Footnote:
1. Meets IPC/JEDEC J-STD-020 profile recommendations. Sen-XY-f and Sen-
Z-f classified as moisture sensitivity level 1.
moisture sensitivity level 3.
PNI Sensor Corporation
RM3100 & RM2100 Sensor Suite User Manual

Figure 3-9: Recommended Solder Reflow Profile

to T )
Smin Smax
to T )
Smax L
)
P
L
)
P
Symbol
T
Smin
T
Smax
60 – 180 seconds
T >218°C
L
3°C/second maximum
T <260°C
P
6 minutes maximum
60 – 120 seconds
t
L
10 – 20 seconds
t
P
4°C/second maximum
MagI2C MLF classified as
PB
1
Value
150°C
200°C
Doc 1017252 r06
Page 14 of 41