Ramsey Electronics WCT3 Manual page 13

circuit board pad simultaneously. Apply a little more
solder to the component lead and the pad when they
are hot enough to melt the solder and remove the
iron. DO NOT move the component lead or board
until the solder cools a little. The finished joint should
look like a drop of water on paper, clean, shiny, with
joint completely filled.
8. Clip remaining component leads as close to the board as possible.
For Surface Mount Technology (SMT) Compo-
nents, the word "Install" means:
1. Pick the correct part type and value or part
number.
2. Melt a dab of solder on one pad of the PC
board for the component you wish to install.
3. Use tweezers to pick up the appropriate com-
ponent by grabbing it across the body, not the
solder connections.
4. Place the part in the assembly location as
noted by the silk-screen on the top layer of the
board (the bottom side has no writing on it). Use
one hand to hold the tweezers and part in place.
5. Use the other hand to re-heat the solder dab
to melt it to the component connection.
6. Let the solder cool and then let go with the
tweezers. Inspect orientation and make sure the
part is square over the correct pads. Make sure
stray solder connections don't overlap or short
across any to adjacent pads.
7. Apply solder to the rest of the pads.
8. Apply a touch more solder to the initial pad to make sure there is a
good solder joint. The rosin core flux will clean the joint and insure stabil-
ity.
9. If you have too much solder and wish to remove it, use a solder
sucker or solder wick to "soak up" the extra solder. Solder bridges on SMT
IC pins are a frequent occurrence so you should always have some solder
wick handy.
WCT3  13